Patents by Inventor W. D. Buckley

W. D. Buckley has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Method of fabrication of an optically flat membrane
    Patent number: 4579616
    Abstract: A method for tensioning a thin film on a support ring to achieve an optically flat membrane. The support ring is optically flat with a slight bevel at its outside edge where the membrane is epoxied to the support ring.
    Type: Grant
    Filed: November 14, 1983
    Date of Patent: April 1, 1986
    Assignee: The Perkin-Elmer Corporation
    Inventors: Henry Windischmann, W. D. Buckley
  • Method of fabricating a pellicle cover for projection printing system
    Patent number: 4523974
    Abstract: The invention is also directed to a method of fabricating a pellicle cover assembly for use in a projection printing system for forming an image on a radiation sensitive wafer, the method comprising the steps of applying a gold film onto the surface of a wafer, applying a polymer film onto the gold film surface, curing the polymer film, adhering a support ring to the polymer film, cutting through the polymer and gold films between the ring and wafer edges to expose the wafer surface, peeling the ring off the wafer and etching off the gold film.
    Type: Grant
    Filed: March 21, 1984
    Date of Patent: June 18, 1985
    Assignee: The Perkin-Elmer Corporation
    Inventors: Dawn L. Duly, Henry Windischmann, W. D. Buckley
  • Method of fabricating a pellicle cover for projection printing system
    Patent number: 4465759
    Abstract: The invention is directed to a method of fabricating a pellicle cover assembly for use in a projection printing system for forming an image on a radiation sensitive wafer, the method comprising the steps of applying a gold film onto the surface of a wafer, applying a polymer film onto the gold film surface, curing the polymer film, adhering a support ring to the polymer film, cutting through the polymer and gold films between the ring and wafer edges to expose the wafer surface, peeling the ring off the wafer and etching off the gold film.
    Type: Grant
    Filed: February 14, 1983
    Date of Patent: August 14, 1984
    Assignee: The Perkin-Elmer Corporation
    Inventors: Dawn L. Duly, Henry Windischmann, W. D. Buckley