Patents by Inventor Wai Kwong Tang

Wai Kwong Tang has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20220322613
    Abstract: A modular planting system comprising a plurality of container units to receive therein a growing medium and one or more plants or plant material, the container unit being configured such that adjacent abutting container units define at least one or more voids therebetween; a frame with a plurality of engagement projections which extend at least partially into the at least one or more voids defined between adjacent abutting container units to maintain said container units in the abutting arrangement and positioned above apertures defined in the support frame member; and a water impermeable base that supports the frame spaced apart by a predetermined distance from an upper surface of the water impermeable base.
    Type: Application
    Filed: September 2, 2020
    Publication date: October 13, 2022
    Inventors: Sai Cheung Osbert Lam, Philip Pang, Wai Kwong Tang
  • Patent number: 7598600
    Abstract: The present invention provides a method of making a stackable power semiconductor package system comprising forming a lower lead frame, having an upward bent source lead and an upward bent gate lead, mounting a power semiconductor device on the lower lead frame utilizing interconnect structures and forming an upper lead frame wherein the upper lead frame is on the power semiconductor device.
    Type: Grant
    Filed: January 27, 2006
    Date of Patent: October 6, 2009
    Assignee: Stats Chippac Ltd.
    Inventors: Wai Kwong Tang, You Yang Ong, Kuan Ming Kan, Larry Lewellen
  • Patent number: 7557432
    Abstract: The present invention provides a thermally enhanced power semiconductor package system comprising providing a power semiconductor die, forming an upper lead frame on the power semiconductor die and forming a lower lead frame below the power semiconductor die, wherein the upper lead frame and the lower lead frame are provided in an offset configuration relative to each other to provide two heat dissipation paths.
    Type: Grant
    Filed: January 31, 2006
    Date of Patent: July 7, 2009
    Assignee: Stats Chippac Ltd.
    Inventors: Wai Kwong Tang, You Yang Ong, Kuan Ming Kan, Larry Lewellen
  • Publication number: 20070108564
    Abstract: The present invention provides a thermally enhanced power semiconductor package system comprising providing a power semiconductor die, forming an upper lead frame on the power semiconductor die and forming a lower lead frame below the power semiconductor die, wherein the upper lead frame and the lower lead frame are provided in an offset configuration relative to each other to provide two heat dissipation paths.
    Type: Application
    Filed: January 31, 2006
    Publication date: May 17, 2007
    Inventors: Wai Kwong Tang, You Yang Ong, Kuan Ming Kan, Larry Lewellen
  • Publication number: 20070108560
    Abstract: The present invention provides a stackable power semiconductor package system comprising forming a lower lead frame, having an upward bent source lead and an upward bent gate lead, mounting a power semiconductor device on the lower lead frame utilizing interconnect structures and forming an upper lead frame wherein the upper lead frame is on the power semiconductor device.
    Type: Application
    Filed: January 27, 2006
    Publication date: May 17, 2007
    Applicant: STATS ChipPAC Ltd.
    Inventors: Wai Kwong Tang, You Yang Ong, Kuan Ming Kan, Larry Lewellen