Patents by Inventor Wai Yew Lo
Wai Yew Lo has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 11056457Abstract: A packaged semiconductor device includes a substrate having input/output (I/O) pads, a semiconductor die attached to the substrate and electrically connected to the substrate with bond wires. A bond-wire reinforcement structure is formed over the bond wires before the assembly is covered with a molding compound. The bond-wire reinforcement structure prevents wire sweep during molding and protects the wires from shorting with other wires. In one embodiment, the bond-wire reinforcement structure is formed with a fiberglass and liquid epoxy mixture.Type: GrantFiled: September 28, 2018Date of Patent: July 6, 2021Assignee: NXP USA, INC.Inventors: Boon Yew Low, Lan Chu Tan, Wai Yew Lo, Poh Leng Eu, Chin Teck Siong
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Publication number: 20200105709Abstract: A packaged semiconductor device includes a substrate having input/output (I/O) pads, a semiconductor die attached to the substrate and electrically connected to the substrate with bond wires. A bond-wire reinforcement structure is formed over the bond wires before the assembly is covered with a molding compound. The bond-wire reinforcement structure prevents wire sweep during molding and protects the wires from shorting with other wires. In one embodiment, the bond-wire reinforcement structure is formed with a fiberglass and liquid epoxy mixture.Type: ApplicationFiled: September 28, 2018Publication date: April 2, 2020Inventors: Boon Yew Low, Lan Chu Tan, Wai Yew Lo, Poh Leng Eu, Chin Teck Siong
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Patent number: 9698093Abstract: A universal substrate for assembling ball grid array (BGA) type integrated circuit packages has a non-conducting matrix, an array of conducting vias extending between top and bottom surfaces of the matrix, and one or more instances of each of two or more different types of fiducial pairs on the top surface of the matrix. Each instance of each different fiducial pair indicates a location of a different via sub-array of the substrate for a different BGA package of a particular package size. The same substrate can be used to assemble BGA packages of different size, thereby avoiding having to design a different substrate for each different BGA package size.Type: GrantFiled: August 24, 2015Date of Patent: July 4, 2017Assignee: NXP USA,INC.Inventors: Chee Seng Foong, Ly Hoon Khoo, Wen Shi Koh, Wai Yew Lo, Zi Song Poh, Kai Yun Yow
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Patent number: 9638596Abstract: A cavity-down pressure sensor device has a pressure-sensing die that is electrically connected to a master control unit (MCU) using face-to-face bonding. Connecting the pressure-sensing die in this manner avoids the need to wire bond the pressure-sensing die to the master control unit.Type: GrantFiled: April 8, 2014Date of Patent: May 2, 2017Assignee: FREESCALE SEMICONDUCTOR, INC.Inventor: Wai Yew Lo
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Publication number: 20170062320Abstract: A universal substrate for assembling ball grid array (BGA) type integrated circuit packages has a non-conducting matrix, an array of conducting vias extending between top and bottom surfaces of the matrix, and one or more instances of each of two or more different types of fiducial pairs on the top surface of the matrix. Each instance of each different fiducial pair indicates a location of a different via sub-array of the substrate for a different BGA package of a particular package size. The same substrate can be used to assemble BGA packages of different size, thereby avoiding having to design a different substrate for each different BGA package size.Type: ApplicationFiled: August 24, 2015Publication date: March 2, 2017Inventors: CHEE SENG FOONG, LY HOON KHOO, WEN SHI KOH, WAI YEW LO, ZI SONG POH, KAI YUN YOW
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Patent number: 9362479Abstract: A semiconductor sensor device includes a device substrate, a micro-controller unit (MCU) die attached to the substrate, and a packaged pressure sensor having a sensor substrate and a pressure sensor die. The sensor substrate has a front side with the pressure sensor die attached to it, a back side, and an opening from the front side to the back side. A molding compound encapsulates the MCU die, the device substrate, and the packaged pressure sensor. A back side of the sensor substrate and the opening in the sensor substrate are exposed on an outer surface of the molding compound.Type: GrantFiled: July 22, 2014Date of Patent: June 7, 2016Assignee: FREESCALE SEMICONDUCTOR, INC.Inventor: Wai Yew Lo
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Patent number: 9297713Abstract: A semiconductor pressure sensor device having a pressure-sensing die electrically connected to a microcontrol unit (MCU) using either through silicon vias (TSVs) or flip-chip bumps. An active surface of the pressure-sensing die is in facing relationship with the MCU. These embodiments avoid the need to used bonds to electrically connect the pressure-sensing die to the MCU, thereby saving time, reducing size, and reducing cost.Type: GrantFiled: March 19, 2014Date of Patent: March 29, 2016Assignee: FREESCALE SEMICONDUCTOR,INC.Inventors: Wai Yew Lo, Lan Chu Tan
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Publication number: 20160086880Abstract: A semiconductor device includes a semiconductor substrate having opposing first and second main surfaces, a via (TSV) extending from the first main surface of the substrate to the second main surface of the substrate, first electrical connectors formed near the first main surface and second electrical connectors formed near the second main surface. There are insulated bond wires, each extending through the via and having a first end bonded to a respective one of the first electrical connectors and a second end bonded to a respective one of the second electrical connectors. The via may be filled with an encapsulating material.Type: ApplicationFiled: September 22, 2014Publication date: March 24, 2016Applicant: Freescale Semiconductor, Inc.Inventors: Navas Khan Oratti Kalandar, Wai Yew Lo, Wen Shi Koh
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Publication number: 20160069763Abstract: A method for assembling a pressure sensor device uses a pressure-sensitive gel material that is applied to an active region of a pressure-sensing integrated circuit (IC) die. A molding compound is dispensed over the pressure-sensitive gel material to encapsulate the gel material. A portion of the molding compound is then removed to expose the gel material to an ambient environment outside of the packaged semiconductor device.Type: ApplicationFiled: September 5, 2014Publication date: March 10, 2016Applicant: Freescale Semiconductor, Inc.Inventor: Wai Yew Lo
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Publication number: 20160027992Abstract: A semiconductor sensor device includes a device substrate, a micro-controller unit (MCU) die attached to the substrate, and a packaged pressure sensor having a sensor substrate and a pressure sensor die. The sensor substrate has a front side with the pressure sensor die attached to it, a back side, and an opening from the front side to the back side. A molding compound encapsulates the MCU die, the device substrate, and the packaged pressure sensor. A back side of the sensor substrate and the opening in the sensor substrate are exposed on an outer surface of the molding compound.Type: ApplicationFiled: July 22, 2014Publication date: January 28, 2016Applicant: Freescale Semiconductor, Inc.Inventor: Wai Yew Lo
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Patent number: 9209120Abstract: A semiconductor package includes a lead frame having an interior region and leads surrounding the interior region, an integrated circuit, a region of insulating material, and a power bar. The integrated circuit, which is disposed in the interior region, has bond pads and electrical couplings (e.g., bond wires) between the bond pads and the leads. The region of insulating material is disposed on at least some of the lead frame leads and the power bar is disposed on the region of insulating material. There also are electrical couplings between the power bar and at least some of the bond pads.Type: GrantFiled: March 11, 2014Date of Patent: December 8, 2015Assignee: FREESCALE SEMICONDUCTOR, INC.Inventors: Kong Bee Tiu, Chee Seng Foong, Wai Yew Lo
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Publication number: 20150340305Abstract: A packaged semiconductor device has lead fingers that define a cavity, and a first die located within the cavity. A second die abuts an inactive side of the first die. The second die is electrically connected to one or more of the lead fingers. A redistribution layer abuts an active side of the first die. Metal structures are situated on an outer surface of the redistribution layer. The redistribution layer electrically connects (i) one or more of the metal structures to one or more of the lead fingers and (ii) one or more of the metal structures to one or more bond pads on the active side of the first die.Type: ApplicationFiled: May 20, 2014Publication date: November 26, 2015Applicant: Freescale Semiconductor, Inc.Inventor: Wai Yew Lo
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Patent number: 9190352Abstract: A semiconductor device includes a lead frame having a flag and leads that surround the flag. The leads include a dummy lead that has first and second wire bonding areas. A first die is attached on the flag and electrically connected to the first wire bonding area. The first die and the first wire bonding area are encapsulated with a molding material and a cavity with an opening is formed above the first die. The second wire bonding area is exposed in the cavity. A second die is placed in the cavity and electrically connected to the second wire bonding area such that the second die is electrically connected to the first die by way of the dummy lead.Type: GrantFiled: November 21, 2013Date of Patent: November 17, 2015Assignee: FREESCALE SEMICONDUCTOR, INC.Inventors: Kong Bee Tiu, Teck Beng Lau, Wai Yew Lo
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Publication number: 20150285702Abstract: A cavity-down pressure sensor device has a pressure-sensing die that is electrically connected to a master control unit (MCU) using face-to-face bonding. Connecting the pressure-sensing die in this manner avoids the need to wire bond the pressure-sensing die to the master control unit.Type: ApplicationFiled: April 8, 2014Publication date: October 8, 2015Applicant: Freescale Semiconductor, Inc.Inventor: Wai Yew Lo
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Publication number: 20150270206Abstract: A semiconductor pressure sensor device having a pressure-sensing die electrically connected to a microcontrol unit (MCU) using either through silicon vias (TSVs) or flip-chip bumps. An active surface of the pressure-sensing die is in facing relationship with the MCU. These embodiments avoid the need to used bonds to electrically connect the pressure-sensing die to the MCU, thereby saving time, reducing size, and reducing cost.Type: ApplicationFiled: March 19, 2014Publication date: September 24, 2015Applicant: Freescale Semiconductor, Inc.Inventors: Wai Yew Lo, Lan Chu Tan
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Publication number: 20150262924Abstract: A semiconductor package includes a lead frame having an interior region and leads surrounding the interior region, an integrated circuit, a region of insulating material, and a power bar. The integrated circuit, which is disposed in the interior region, has bond pads and electrical couplings (e.g., bond wires) between the bond pads and the leads. The region of insulating material is disposed on at least some of the lead frame leads and the power bar is disposed on the region of insulating material. There also are electrical couplings between the power bar and at least some of the bond pads.Type: ApplicationFiled: March 11, 2014Publication date: September 17, 2015Inventors: Kong Bee Tiu, Chee Seng Foong, Wai Yew Lo
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Publication number: 20150162269Abstract: A semiconductor die package has a die mounted to a die pad. The die has data bond pads and power supply bond pads. Lead fingers are spaced from and project outwardly from the die pad. Each of the lead fingers has a proximal end that is near to a respective edge of the die pad, and a distal end farther from the die pad. The lead fingers include power bar lead fingers and data lead fingers. A power bar bridges the proximal ends of two of the power bar lead fingers. The power bar is between the proximal ends of the data lead fingers and the respective edge of the die pad. Insulated bond wires are used to selectively electrically couple the power bar to the die power supply bond pads.Type: ApplicationFiled: December 6, 2013Publication date: June 11, 2015Inventor: Wai Yew Lo
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Publication number: 20150137279Abstract: A semiconductor device includes a lead frame having a flag and leads that surround the flag. The leads include a dummy lead that has first and second wire bonding areas. A first die is attached on the flag and electrically connected to the first wire bonding area. The first die and the first wire bonding area are encapsulated with a molding material and a cavity with an opening is formed above the first die. The second wire bonding area is exposed in the cavity. A second die is placed in the cavity and electrically connected to the second wire bonding area such that the second die is electrically connected to the first die by way of the dummy lead.Type: ApplicationFiled: November 21, 2013Publication date: May 21, 2015Inventors: Kong Bee Tiu, Teck Beng Lau, Wai Yew Lo
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Patent number: 9029999Abstract: A semiconductor sensor device is packaged using a footed lid instead of a pre-molded lead frame. A semiconductor sensor die is attached to a first side of a lead frame. The die is then electrically connected to leads of the lead frame. A gel material is dispensed onto the sensor die. The footed lid is attached to the substrate such that the footed lid covers the sensor die and the electrical connections between the die and the lead frame. A molding compound is then formed over the substrate and the footed lid such that the molding compound covers the substrate, the sensor die and the footed lid.Type: GrantFiled: November 23, 2011Date of Patent: May 12, 2015Assignee: Freescale Semiconductor, Inc.Inventor: Wai Yew Lo
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Patent number: 8981541Abstract: A Quad Flat Package (QFP) semiconductor device has a multi-stepped lead frame for forming rows of external contacts. A semiconductor die is attached to a die pad of the lead frame and electrically connected to lead with bond wires. The die and bond wires are encapsulated with a mold compound and then multiple cuts are made to the lead frame to form the rows of external contacts.Type: GrantFiled: July 10, 2013Date of Patent: March 17, 2015Assignee: Freescale Semiconductor, Inc.Inventors: Kong Bee Tiu, Ruzaini B. Ibrahim, Wai Yew Lo