Abstract: An article transport material loaded with an article on a base and used for transport includes noncontact communication means for conducting noncontact communications with a noncontact IC tag put on the article and portable power supply means for supplying electric power to the noncontact communication means, wherein the communication direction of the noncontact communication means is directed to the area above the base.

Abstract: A semiconductor bear chip having a bump subjected to high temperatures is pressed, from the upper side, onto a wiring board including a wiring pattern, a thermosetting resin film covering an electrode area on the wiring pattern and having insulating particles dispersed and included and a thermoplastic resin film covering the thermosetting resin film, while applying a ultrasonic wave, thereby inserting the bumps of the semiconductor bear chip through the thermoplastic resin film and the thermosetting resin film to bond the top end portion of the bump with the electrode area.

Abstract: An electronic part holding film (30) includes an electronic part module (32) and winding conductor patterns (34a, 34b). The winding conductor patterns (34a, 34b) have ends in which terminal pads (35, 36) are formed and to which a connecting part (37) is not connected, respectively. The terminal pads (35, 36) are electrically connected to each other via the electronic part module (32). The electronic part holding film (30) is folded at a folding position (38). In this way, a thin IC tag (20) is manufactured. According to the thin IC tag (20), it is possible to provide a thin IC tag which does not increase the number of manufacturing steps and the manufacturing cost and on which an electronic part and the like can be mounted with ease.

Abstract: An information carrier in which the substrate, having a signal-forming portion for forming signals corresponding to specific information, is attached to a base material having a transfer portion for transferring signals. The specific information is recognized using signals transferred from the signal-forming portion through the transfer portion. The surface attached to the substrate is the surface for attaching the carrier and substrate to an object. When the information carrier is peeled off the object, the substrate remains on the object, thereby separating the substrate and the base material. Accordingly, the signals from the signal-forming portion are no longer transmitted to base portion.

Abstract: An antenna unit by which a noncontact IC tag having different resonance frequencies can be easily manufactured, and the noncontact IC tag are provided. An antenna unit has an impedance matching wiring portion and an antenna, in which when an IC chip is electrically connected to the impedance matching wiring portion and the antenna, a noncontact IC tag is formed; wherein connectable regions are provided in the impedance matching wiring portion, the regions making a direct or indirect connecting position of the IC chip to be adjustable within a predetermined range, so that effective partial length for impedance matching is made adjustable.

Abstract: A method for inspecting a communication condition of an RFID tag that is readable in a noncontact manner using an electromagnetic wave is provided, in which when a communication condition of the RFID tag is inspected, it can be inspected without needing an electromagnetic-wave shield device for preventing diffusion of the electromagnetic wave. When an RFID tag having an antenna communicating using communication frequency of a UHF band, and a matching circuit adjusting impedance of the antenna, is inspected an antenna coil of a reader-writer is opposed to the matching circuit, and a control circuit of the RFID tag is operated by magnetic flux transmitted from the antenna coil, so that the RFID tag is inspected.

Abstract: A flat IC tag contains memory means capable of data storage and transmission means capable of data transmission. The IC tag has on a surface thereof an unvulcanized rubber having identical properties to the unvulcanized rubber used for an article to which the IC tag is mounted. The opposite surface of the IC tag is mounted to the article before vulcanization. The article is vulcanized in this state to mount the IC tag to the article. Hence, the IC tag is not damaged if attached to tires and other articles in harsh operating environment.

Abstract: A pneumatic tire (1) has a tire cavity surface (HS) to which an accommodation tool (11) for accommodating an electronic component is bonded. The accommodation tool (11) includes an accommodation space (10) for accommodating an electronic component (W) therein, and includes a bonding region (11Sb) which is bonded to the tire cavity surface (HS) and which is provided on one end of a back surface (11S) directed to the tire cavity surface (HS). Only the bonding region (11Sb) is bonded to the tire cavity surface (HS), thereby making it possible to separate a portion of a non-bonding region (11Sa) on the side of the other end of the back surface (11S) from the tire cavity surface (HS).

Abstract: A non-contact IC tag which stores information readable by using an induction field from the non-contact IC tag as well as information readable by the other methods, and a fabrication method of the non-contact IC tag are provided. When a non-contact IC tag having a storage unit which stores information and an antenna which communicates in a non-contact manner is fabricated, a magnetic data holding member which magnetically holds data is thermally transferred to a non-contact IC tag main body to provide a magnetic data holding unit.

Abstract: The physical distribution management apparatus comprises a non-contact communication section for communicating out of contact with a non-contact IC tag, an information acquisition section for acquiring the information concerning a situation where it is placed, a control section for writing the information acquired by the information acquisition section into a prescribed storage section, and a portable power source section for supplying an electric power to each of the sections.

Abstract: The method for mounting the IC chip on the substrate comprises: pushing bumps of the semiconductor bare chip onto the thermoplastic resin film while applying an ultrasonic wave thereto, thereby to expel the thermoplastic resin film to bring the bumps and the electrode areas into contact; further applying the ultrasonic wave continuously while the bumps and the electrode areas contacting, thereby to join the bumps and the electrode areas ultrasonically; and cooling and solidifying the thermoplastic resin film thereby to adhere the semiconductor bare chip body to the substrate. The method can manufacture the electric wave readable data carrier efficiently.

Abstract: A coin-shaped IC tag which can be endowed with a predetermined weight is described. The coin-shaped IC tag ensures a normal operation and affords a satisfactory feeling of weightiness as a value medium. Methods of manufacturing the coin-shaped IC tag are also described. The coin-shaped IC tag comprises an IC tag core. The IC tag core comprises an IC packaging base member including a base and an electronic circuit for communicating data and for recording data, the electronic circuit mounted on the base. The IC tag core also comprises a high specific gravity resin layer joined to the IC packaging base member.

Abstract: A semiconductor bear chip having a bump subjected to high temperatures is pressed, from the upper side, onto a wiring board including a wiring pattern, a thermosetting resin film covering an electrode area on the wiring pattern and having insulating particles dispersed and included and a thermoplastic resin film covering the thermosetting resin film, while applying a ultrasonic wave, thereby inserting the bumps of the semiconductor bear chip through the thermoplastic resin film and the thermosetting resin film to bond the top end portion of the bump with the electrode area.

Abstract: A coin-shaped IC tag which can be endowed with a predetermined weight is described. The coin-shaped IC tag ensures a normal operation and affords a satisfactory feeling of weightiness as a value medium. Methods of manufacturing the coin-shaped IC tag are also described. The coin-shaped IC tag comprises an IC tag core. The IC tag core comprises an IC packaging base member including a base and an electronic circuit for communicating data and for recording data, the electronic circuit mounted on the base. The IC tag core also comprises a high specific gravity resin layer joined to the IC packaging base member.

Abstract: To provide a semiconductor chip mounting method by a flip-chip connection method in which a semiconductor chip can be mounted on a circuit board promptly, electrically and mechanically surely and further at a low cost, a process for pushing a melted thermoplastic resin coat aside by pressing a bump of the bare semiconductor chip on the melted thermoplastic resin coat applying an ultrasonic wave in a state in which the thermoplastic resin coat covering an electrode area on a wiring pattern is heated and melted and touching the bump and the electrode area, a process for bonding the bump and the electrode area by continuously applying an ultrasonic wave in a state in which the bump and the electrode area are touched and a process for cooling and solidifying the melted thermoplastic resin coat and bonding the body of the bare semiconductor chip on the circuit board are provided.

Abstract: A coin-shaped IC tag which can be endowed with a predetermined weight is described. The coin-shaped IC tag ensures a normal operation and affords a satisfactory feeling of weightiness as a value medium. The coin-shaped IC tag comprises an IC tag core. The IC tag core comprises an IC packaging base member including a base and an electronic circuit for communicating data and for recording data, the electronic circuit mounted on the base. The IC tag core also comprises a high specific gravity resin layer joined to the IC packaging base member.

Abstract: A method for joining a first wiring board covered with a conductive pattern on a surface of a thin resin basic plate to a second wiring board covered with a conductive pattern on a thin resin basic plate to ensure the electric connection therebetween, including the steps of putting said first and second wiring boards together in a confront relationship so as to adjust join predetermined portions on the conductive patterns, catching the join predetermined portions in the status by a pair of ultrasonic welding tools, and applying an ultrasonic vibration to said ultrasonic welding tools to weld the conductive metals located on the join predetermined portions.

Abstract: To provide a semiconductor chip mounting method by a flip-chip connection method in which a semiconductor chip can be mounted on a circuit board promptly, electrically and mechanically surely and further at a low cost, a process for pushing a melted thermoplastic resin coat aside by pressing a bump of the bare semiconductor chip on the melted thermoplastic resin coat applying an ultrasonic wave in a state in which the thermoplastic resin coat covering an electrode area on a wiring pattern is heated and melted and touching the bump and the electrode area, a process for bonding the bump and the electrode area by continuously applying an ultrasonic wave in a state in which the bump and the electrode area are touched and a process for cooling and solidifying the melted thermoplastic resin coat and bonding the body of the bare semiconductor chip on the circuit board are provided.

Abstract: To provide a semiconductor chip mounting method by a flip-chip connection method in which a semiconductor chip can be mounted on a circuit board promptly, electrically and mechanically surely and further at a low cost, a process for pushing a melted thermoplastic resin coat aside by pressing a bump of the bare semiconductor chip on the melted thermoplastic resin coat applying an ultrasonic wave in a state in which the thermoplastic resin coat covering an electrode area on a wiring pattern is heated and melted and touching the bump and the electrode area, a process for bonding the bump and the electrode area by continuously applying an ultrasonic wave in a state in which the bump and the electrode area are touched and a process for cooling and solidifying the melted thermoplastic resin coat and bonding the body of the bare semiconductor chip on the circuit board are provided.

Abstract: A coin-shaped IC tag which can be endowed with a predetermined weight is described. The coin-shaped IC tag ensures a normal operation and affords a satisfactory feeling of weightiness as a value medium. Methods of manufacturing the coin-shaped IC tag are also described. The coin-shaped IC tag comprises an IC tag core. The IC tag core comprises an IC packaging base member including a base and an electronic circuit for communicating data and for recording data, the electronic circuit mounted on the base. The IC tag core also comprises a high specific gravity resin layer joined to the IC packaging base member.