Abstract: High-voltage rectifier having a plurality of serially connected semiconductor components, including a substantially cylindrical shielding formed of a plurality of sections electrically isolated from one another, each of the sections containing at least one of the semiconductor components, the shielding sections being formed as cooling bodies defined at one side thereof by a cylinder-segment surface, at least two of the cooling bodies forming a group and being disposed in spaced relationship to one another in a common plane so that the cylinder-segment surfaces thereof define a nearly complete cylinder, the cooling bodies having cooling ribs at a side thereof opposite the respective cylinder-segment surfaces thereof, the respective semiconductor components being connected thermally and electrically conductively to the respective opposite sides of the cooling bodies.

Abstract: Semiconductor component having a plurality of semiconductor elements disposed in a case, including a bottom of the case, and case terminals, including conductor bars electrically connecting the semiconductor elements to each other and to the case terminals, the semiconductor elements being in thermal and pressure contact with the bottom through at least one of said conductor bars and being electrically insulated from the bottom, pressure contacts disposed between the semiconductor elements and said conductor bars, the conductor bars being formed of first sections of relatively large width associated with the pressure contacts, and second sections of relatively small width connected to the first sections.

Abstract: Semiconductor component with a plurality of semiconductor elements disposed in a case having a metallic bottom being in heat-conducting contact with the semiconductor elements, electrical leads, and a leaf spring having ends and providing electrical pressure contact between the semiconductor elements and the leads, including yokes each holding a respective end of the spring, and at least two screws anchoring the yokes and the semiconductor elements to the bottom.