Abstract: A printed circuit board comprises a plurality of inner and outer holes. An electrically conductive barrel may be disposed in each outer hole, and an electrically conductive barrel and a probe may be disposed in each inner hole. The electrically conductive barrels may protrude from the bottom of the interface board at substantially similar fixed heights. Transfer paths may couple at least some of the barrels in the outer holes to selected barrels in the inner holes.

Abstract: A series of modular plugs insertable into a row of connector sockets mounted on a circuit board to be tested are secured to a specially designed support structure which enables the plugs to be simultaneously mated with the sockets to thereby substantially reduce the required test connection time and to enable the plugs to be coupled with and uncoupled from the sockets without subjecting the plug cables to appreciable handling stress. In one embodiment thereof the support structure may be manually moved toward the sockets to effect the coupling of the plugs with their sockets, and a movable latch plate member is carried by the support structure for use in simultaneously unlatching the inserted plugs from their sockets. In another embodiment thereof the support structure is stationarily secured to a specially designed test stand assembly which is operable to move the circuit board toward the stationary plugs to effect the desired plug/socket test interconnection.

Abstract: A top-accessible system for simultaneously testing both sides of a printed circuit board includes a vertically movable top plate, upon which the circuit board may be rested, and a framed bottom plate which underlies the top plate and defines a vacuum chamber therewith. A mounting plate is pivoted to the upper side of the top plate for movement to a latched test position over the circuit board. A probe plate is movably carried by and is parallel to the underside of the mounting plate. With the mounting plate in its test position a cam structure thereon is operated to drive the probe plate transversely toward the circuit board to cause upper test pins on the probe plate to perpendicularly contact test points on the upper side of the circuit board, and cause hold-down members on the probe plate to contact the circuit board and firmly hold it against the top plate.