Patents by Inventor Walter J. Dressick

Walter J. Dressick has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 6316607
    Abstract: Qualitative and quantitative electrochemiluminescent assays for analytes of interest present in multicomponent liquids are provided. These methods comprise contacting a sample with a reagent labeled with an electrochemiluminescent chemical moiety and capable of combining with the analyte of interest, exposing the resulting sample to electrochemical energy and detecting electromagnetic radiation emitted by the electrochemiluminescent chemical moiety.
    Type: Grant
    Filed: June 7, 1995
    Date of Patent: November 13, 2001
    Assignee: IGEN International, Inc.
    Inventors: Richard J. Massey, Michael J. Powell, Paul A. Mied, Peter Feng, Leopoldo Della Ciana, Walter J. Dressick, Mohindar S. Poonian
  • Patent number: 6307098
    Abstract: This invention relates to water soluble phosphines of the following structural formula and method of preparing these phosphines: Wherein A is a moiety which is stable to the reaction conditions and does not interfere with solubility of the compound in the preparation reaction. R1 and R2 are selected from hydroxyl groups, dialkylamino group, and alkoxide groups.
    Type: Grant
    Filed: June 9, 2000
    Date of Patent: October 23, 2001
    Assignee: The United States of America as represented by the Secretary of the Navy
    Inventors: Terrence L. Schull, Walter J. Dressick
  • Patent number: 5811236
    Abstract: Electrochemiluminiscent moieties having the formula?Re(P).sub.m (L.sup.1).sub.n (L.sup.2).sub.o (L.sup.3).sub.p (L.sup.4).sub.q (L.sup.5).sub.r (L.sup.6).sub.s !.sub.t (B).sub.uwhereinP is a polydentate ligand of Re;L.sup.1, L.sup.2, L.sup.3, L.sup.4, L.sup.5 and L.sup.6 are ligands of Re, each of which may be the same as or different from each other ligand;B is a substance which is a ligand of Re or is conjugated to one or more of P, L.sup.1, L.sup.2, L.sup.3, L.sup.4, L.sup.5 or L.sup.6 ;m is an integer equal to or greater than 1;each of n, o, p, q, r and s is zero or an integer;t is an integer equal to or greater than 1; andu is an integer equal to or greater than 1;P, L.sup.1, L.sup.2, L.sup.3, L.sup.4, L.sup.5, L.sup.6 and B being of such composition and number that the chemical moiety can be induced to emit electromagnetic radiation and the total number of bonds to Re provided by the ligands of Re being equal to the coordination of Reare disclosed.
    Type: Grant
    Filed: June 6, 1995
    Date of Patent: September 22, 1998
    Assignee: IGEN International, Inc.
    Inventors: Richard J. Massey, Michael J. Powell, Walter J. Dressick, Jonathan K. Leland, Janel K. Hino, Mohindar S. Poonian, Leopoldo Della Ciana
  • Patent number: 5716781
    Abstract: Electrochemiluminiscent moieties having the formula?Re(P).sub.m (L.sup.1).sub.n (L.sup.2).sub.o (L.sup.3).sub.p (L.sup.4).sub.q (L.sup.5).sub.r (L.sup.6).sub.s !.sub.t (B).sub.uwhereinP is a polydentate ligand of Re;L.sup.1, L.sup.2, L.sup.3, L.sup.4, L.sup.5 and L.sup.6 are ligands of Re, each of which may be the same as or different from each other ligand;B is a substance which is a ligand of Re or is conjugated to one or more of P, L.sup.1, L.sup.2, L.sup.3, L.sup.4, L.sup.5 or L.sup.6 ;m is an integer equal to or greater than 1;each of n, o, p, q, r and s is zero or an integer;t is an integer equal to or greater than 1; andu is an integer equal to or greater than 1;P, L.sup.1, L.sup.2, L.sup.3, L.sup.4, L.sup.5, L.sup.6 and B being of such composition and number that the chemical moiety can be induced to emit electromagnetic radiation and the total number of bonds to Re provided by the ligands of Re being equal to the coordination of Reare disclosed.
    Type: Grant
    Filed: June 6, 1995
    Date of Patent: February 10, 1998
    Assignee: Igen International Inc.
    Inventors: Richard J. Massey, Michael J. Powell, Walter J. Dressick, Jonathan K. Leland, Janel K. Hino, Mohindar S. Poonian, Leopoldo Della Ciana
  • Patent number: 5688642
    Abstract: Patterns of pre-formed hybridizable nucleic acid oligomers are formed upon a substrate. The substrate is coated with molecules, such as aminosilanes, whose reactivity with nucleic acid molecules can be transformed by irradiation. The coated substrate exposed to patterned irradiation then contacted with pre-formed nucleic acid oligomers. The binding of the preformed nucleic acid oligomers to the coating molecules may be covalent or non-covalent (for example, ionic bonding or hydrogen bonding). If desired, a heterobifunctional crosslinker may be employed, before or after irradiation, with the coating to promote covalent binding of the nucleic acid oligomers to the coating molecules. Also, the irradiation step may be performed with the assistance of a positive-tone or negative-tone photoresist.
    Type: Grant
    Filed: December 1, 1994
    Date of Patent: November 18, 1997
    Assignee: The United States of America as represented by the Secretary of the Navy
    Inventors: Linda A. Chrisey, Walter J. Dressick, Jeffrey M. Calvert
  • Patent number: 5648201
    Abstract: A process for efficient modification and metallization of substrates includes the steps of providing a substrate with highly photoefficient chemical functional groups on at least a portion of this substrate, exposing the substrate to actinic radiation to transform, deactivate, or remove these chemical functional groups, to modify their chemical reactivity, and carrying out further chemical reaction steps on these modified chemical functional groups.
    Type: Grant
    Filed: December 16, 1992
    Date of Patent: July 15, 1997
    Assignee: The United Sates of America as represented by the Secretary of the Navy
    Inventors: Charles S. Dulcey, Timothy S. Koloski, Walter J. Dressick, Jeffrey M. Calvert, Brian M. Peek
  • Patent number: 5591581
    Abstract: Electrochemiluminescent moieties having the formula(Re(P).sub.m (L.sup.1).sub.n (L.sup.2).sub.o (L.sup.3).sub.p (L.sup.4).sub.t (B).sub.uwhereinP is a polydentate ligand of Re;L.sup.1, L.sup.2, L.sup.3 and L.sup.4 are ligands of Re, each of which may be the same as or not the same as each other ligand;B is a substance which is a ligand of Re or is conjugated to one or more of P, L.sup.1, L.sup.2, L.sup.3 and L.sup.4 ;m is an integer equal to or greater than 1;each of n, o, p, q, r and s is zero or an integer;t is an integer equal to or greater than 1; andu is an integer equal to or greater than 1;P, L.sup.1, L.sup.2, L.sup.3, L.sup.4 and B being of such composition and number that the chemical moiety can be induced to electrochemiluminesce and the total number of bonds to Re provided by the ligands of Re being equal to the coordination number of Re are disclosed.
    Type: Grant
    Filed: April 15, 1994
    Date of Patent: January 7, 1997
    Assignee: IGEN, Inc.
    Inventors: Richard J. Massey, Michael J. Powell, Walter J. Dressick, Jonathan K. Leland, Janel K. Hino, Mohindar S. Poonian, Leopoldo D. Ciana
  • Patent number: 5510216
    Abstract: The invention is directed to a process for patterning a substrate in a selective pattern. In one embodiment, the process comprises the steps of forming a patterned coating over a substrate surface whereby portions of the substrate are covered by the patterned coating and portions of the substrate remain uncoated. A layer of a ligating material is coated over at least those portions of the substrate free of the patterned coating. The ligating layer is one that is capable of ligating with an electroless metal plating catalyst. The article so formed is then contacted with an electroless metallization catalyst and then with an electroless plating solution to form a patterned metal deposit on the substrate.
    Type: Grant
    Filed: August 29, 1995
    Date of Patent: April 23, 1996
    Assignee: Shipley Company Inc.
    Inventors: Gary S. Calabrese, Jeffrey M. Calvert, Mu-San Chen, Walter J. Dressick, Charles S. Dulcey, Jacque H. Georger, Jr., John F. Bohland, Jr.
  • Patent number: 5500315
    Abstract: Methods and compositions for electroless metallization. In one aspect, the invention is characterized by the use of chemical groups capable of ligating with an electroless metallization catalyst, including use of ligating groups that are chemically bound to the substrate. In a preferred aspect, the invention provides a means for selective metallization without the use of a conventional photoresist patterning sequence, enabling fabrication of high resolution metal patterns in a direct and convenient manner.
    Type: Grant
    Filed: October 4, 1994
    Date of Patent: March 19, 1996
    Assignee: Rohm & Haas Company
    Inventors: Jeffrey M. Calvert, Walter J. Dressick, Gary S. Calabrese, Michael Gulla
  • Patent number: 5468597
    Abstract: The invention is directed to a process for patterning a substrate in a selective pattern. In one embodiment, the process comprises the steps of forming a patterned coating over a substrate surface whereby portions of the substrate are covered by the patterned coating and portions of the substrate remain uncoated. A layer of a ligating material is coated over at least those portions of the substrate free of the patterned coating. The ligating layer is one that is capable of ligating with an electroless metal plating catalyst. The article so formed is then contacted with an electroless metallization catalyst and then with an electroless plating solution to form a patterned metal deposit on the substrate.
    Type: Grant
    Filed: August 25, 1993
    Date of Patent: November 21, 1995
    Assignee: Shipley Company, L.L.C.
    Inventors: Gary S. Calabrese, Jeffrey M. Calvert, Mu-San Chen, Walter J. Dressick, Charles S. Dulcey, Jacque H. Georger, Jr., John F. Bohland, Jr.
  • Patent number: 5389496
    Abstract: Methods and compositions for electroless metallization. In one aspect, the invention is characterized by the use of chemical groups capable of ligating with an electroless metallization catalyst, including use of ligating groups that are chemically bound to the substrate. In a preferred aspect, the invention provides a means for selective metallization without the use of a conventional photoresist patterning sequence, enabling fabrication of high resolution metal patterns in a direct and convenient manner.
    Type: Grant
    Filed: May 17, 1993
    Date of Patent: February 14, 1995
    Assignees: Rohm and Haas Company, United States of America
    Inventors: Jeffrey M. Calvert, Walter J. Dressick, Gary S. Calabrese, Michael Gulla