Abstract: The present invention relates to a novel electrolyte and a secondary battery including the same. The present invention has an effect of providing a secondary battery having improved charging efficiency and output due to reduced charging resistance and having excellent long-term lifespan and high-temperature capacity retention rate.

Abstract: A semiconductor device including: a first transistor which include a first gate stack on a substrate; and a second transistor which includes a second gate stack on the substrate, wherein the first gate stack includes a first ferroelectric material layer disposed on the substrate, a first work function layer disposed on the first ferroelectric material layer and a first upper gate electrode disposed on the first work function layer, wherein the second gate stack includes a second ferroelectric material layer disposed on the substrate, a second work function layer disposed on the second ferroelectric material layer and a second upper gate electrode disposed on the second work function layer, wherein the first work function layer includes the same material as the second work function layer, and wherein an effective work function of the first gate stack is different from an effective work function of the second gate stack.

Abstract: The present invention relates to an electrolyte solution and a secondary battery including the same. According to the present invention, the present invention has an effect of providing a secondary battery having improved charging efficiency and output due to low discharge resistance and having a long lifespan and excellent high-temperature capacity retention by suppressing gas generation and increase in thickness.

Abstract: The present invention relates to an electrolyte solution and a secondary battery including the same. According to the present invention, the present invention has an effect of providing a secondary battery having improved charging efficiency and output due to low discharge resistance and having a long lifespan and excellent high-temperature capacity retention by suppressing gas generation and increase in thickness.

Abstract: The present invention relates to an electrolyte solution and a secondary battery including the same. According to the present invention, the present invention has an effect of providing a secondary battery having improved charging efficiency and output due to low discharge resistance and having a long lifespan and excellent high-temperature capacity retention by suppressing gas generation and increase in thickness.

Abstract: The present invention relates to an electrolyte solution and a secondary battery including the same. According to the present invention, the present invention has an effect of providing a secondary battery having improved charging efficiency and output due to low discharge resistance and having a long lifespan and excellent high-temperature capacity retention by suppressing gas generation and increase in thickness.

Abstract: A purge control method of the present disclosure includes determining whether or not a vehicle quickly decelerates in a driving situation in which a large amount of fuel evaporation gas is discharged, decreasing purge duty for operating a purge control solenoid valve when the controller determines that the vehicle is in a state of quick deceleration, and decreasing a purge flow of the fuel evaporation gas by controlling operation of the purge control solenoid valve by the purge duty.

Abstract: A light emitting device including a package body having a first cavity; an electrode having a first electrode and a second electrode in the package body; at least one light emitting chip on the first electrode; a resin material in the first cavity; and a lens on the package body and the at least one light emitting chip. Further, the first electrode and the second electrode are separated by the package body, the package body comprises a first stepped portion exposed between the first electrode and the second electrode, the first electrode comprises a second cavity, and the at least one light emitting chip is disposed on the second cavity of the first electrode.

Abstract: A light emitting device can include a substrate including a top surface, an outermost side surface, and a bottom surface; a light emitting diode chip on the top surface of the substrate; a reflecting member disposed on a first portion of the top surface of the substrate and the reflecting member having a cavity; a first metal layer disposed on a second portion of the top surface, one side of the outermost side surface, and a first portion of the bottom surface; a second metal layer disposed on a third portion of the top surface, another side of the outermost side surface, and a second portion of the bottom surface; a heatsink disposed on the bottom surface of the substrate; and at least two heatsink holes in the substrate formed to pass through the substrate, in which the at least two heatsink holes are in contact with the heatsink, and a reflective material is on an inside surface of the at least two heatsink holes, the first metal layer, the second metal layer, and the heatsink are separated from each other

Abstract: A purge control method of the present disclosure includes determining whether or not a vehicle quickly decelerates in a driving situation in which a large amount of fuel evaporation gas is discharged, decreasing purge duty for operating a purge control solenoid valve when the controller determines that the vehicle is in a state of quick deceleration, and decreasing a purge flow of the fuel evaporation gas by controlling operation of the purge control solenoid valve by the purge duty.

Abstract: A light emitting device can include a substrate including a top surface, an outermost side surface, and a bottom surface; a light emitting diode chip on the top surface of the substrate; a reflecting member disposed on a first portion of the top surface of the substrate and the reflecting member having a cavity; a first metal layer disposed on a second portion of the top surface, one side of the outermost side surface, and a first portion of the bottom surface; a second metal layer disposed on a third portion of the top surface, another side of the outermost side surface, and a second portion of the bottom surface; a heatsink disposed on the bottom surface of the substrate; and at least two heatsink holes in the substrate formed to pass through the substrate, in which the at least two heatsink holes are in contact with the heatsink, and a reflective material is on an inside surface of the at least two heatsink holes, the first metal layer, the second metal layer, and the heatsink are separated from each other

Abstract: A light emitting diode package can include a substrate; a light emitting diode on the substrate; an electrode electrically connected to the light emitting diode; a frame surrounding the light emitting diode and configured to reflect light emitted from the light emitting diode; and a hole formed to pass through the substrate and configured to connect both upper and bottom surfaces of the substrate, in which a top surface of the frame is higher than a top surface of the light emitting diode, a portion of the frame has an inclined inner surface, the frame includes at least one protruding portion protruding from an imaginary surface where the light emitting diode is disposed, a bottom surface of the at least one protruding portion contacts the substrate, the at least one protruding portion is outside of the light emitting diode, and the hole is vertically overlapped with the light emitting diode.

Abstract: A light emitting device package is provided. The light emitting device package includes a package body comprising a first cavity, and a second cavity connected to the first cavity; a first lead electrode, at least a portion of which is disposed within the second cavity; a second lead electrode, at least a portion of which is disposed within the first cavity; a light emitting device disposed within the second cavity; a first wire disposed within the second cavity, the first wire electrically connecting the light emitting device to the first lead electrode; and a second wire electrically connecting the light emitting device to the second lead electrode.

Abstract: A light emitting diode package can include a substrate; a light emitting diode on the substrate; an electrode electrically connected to the light emitting diode; a frame surrounding the light emitting diode and configured to reflect light emitted from the light emitting diode; and a hole formed to pass through the substrate and configured to connect both upper and bottom surfaces of the substrate, in which a top surface of the frame is higher than a top surface of the light emitting diode, a portion of the frame has an inclined inner surface, the frame includes at least one protruding portion protruding from an imaginary surface where the light emitting diode is disposed, a bottom surface of the at least one protruding portion contacts the substrate, the at least one protruding portion is outside of the light emitting diode, and the hole is vertically overlapped with the light emitting diode.

Abstract: Provided is a light emitting device package. It is a substrate comprising a top and a bottom surfaces being substantially parallel to each other; a light emitting diode chip on the substrate; a frame disposed around the light emitting diode chip and configured to reflect light emitted from the light emitting diode chip, the frame having an opening; a first metal layer disposed on the top surface of the substrate; a second metal layer disposed on the top surface of the substrate; a third metal layer disposed on the bottom surface of the substrate; a through hole connected between the first metal layer and the third metal layer; a material being filled in the opening of the frame; and a lens disposed on the material, wherein the substrate and the frame are separate from each other.

Abstract: A light emitting device including a package body having a first cavity; an electrode having a first electrode and a second electrode in the package body; at least one light emitting chip on the first electrode; a resin material in the first cavity; and a lens on the package body and the at least one light emitting chip. Further, the first electrode and the second electrode are separated by the package body, the package body comprises a first stepped portion exposed between the first electrode and the second electrode, the first electrode comprises a second cavity, and the at least one light emitting chip is disposed on the second cavity of the first electrode.

Abstract: A light emitting device package is provided. The light emitting device package comprises a package body comprising a first cavity, and a second cavity connected to the first cavity; a first lead electrode, at least a portion of which is disposed within the second cavity; a second lead electrode, at least a portion of which is disposed within the first cavity; a light emitting device disposed within the second cavity; a first wire disposed within the second cavity, the first wire electrically connecting the light emitting device to the first lead electrode; and a second wire electrically connecting the light emitting device to the second lead electrode.

Abstract: Provided is a light emitting device package. It is a substrate comprising a top and a bottom surfaces being substantially parallel to each other; a light emitting diode chip on the substrate; a frame disposed around the light emitting diode chip and configured to reflect light emitted from the light emitting diode chip, the frame having an opening; a first metal layer disposed on the top surface of the substrate; a second metal layer disposed on the top surface of the substrate; a third metal layer disposed on the bottom surface of the substrate; a through hole connected between the first metal layer and the third metal layer; a material being filled in the opening of the frame; and a lens disposed on the material, wherein the substrate and the frame are separate from each other.

Abstract: A light emitting device package is provided. The light emitting device package includes a package body comprising a first cavity, and a second cavity connected to the first cavity; a first lead electrode, at least a portion of which is disposed within the second cavity; a second lead electrode, at least a portion of which is disposed within the first cavity; a light emitting device disposed within the second cavity; a first wire disposed within the second cavity, the first wire electrically connecting the light emitting device to the first lead electrode; and a second wire electrically connecting the light emitting device to the second lead electrode.

Abstract: A light emitting device package is provided. The light emitting device package comprises a package body comprising a first cavity, and a second cavity connected to the first cavity; a first lead electrode, at least a portion of which is disposed within the second cavity; a second lead electrode, at least a portion of which is disposed within the first cavity; a light emitting device disposed within the second cavity; a first wire disposed within the second cavity, the first wire electrically connecting the light emitting device to the first lead electrode; and a second wire electrically connecting the light emitting device to the second lead electrode.