Patents by Inventor Wataru Morita

Wataru Morita has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20210036203
    Abstract: The present invention provides a thermoelectric conversion device layer having excellent durability and a method of producing the same. Specifically, the present invention provides a thermoelectric conversion device layer including a thermoelectric conversion module including, on one face of a film substrate, a thermoelectric element layer in which a P-type thermoelectric element layer and an N-type thermoelectric element layer are alternately arranged to be adjacent to each other in the in-plane direction and disposed in series; and further a sealing layer on the face side of the thermoelectric element layer, wherein the sealing layer has a water vapor transmission rate at 40° C. and 90% RH, as prescribed in JIS K7129:2008, of 1,000 g·m?2·day?1 or less; and a method of producing the same.
    Type: Application
    Filed: March 29, 2018
    Publication date: February 4, 2021
    Applicant: LINTEC CORPORATION
    Inventors: Wataru MORITA, Kunihisa KATO, Tsuyoshi MUTO
  • Publication number: 20210036202
    Abstract: The present invention is to provide a thermoelectric conversion module capable of maintaining a thermoelectric performance and revealing excellent insulation properties and a method of producing the same. Provided are a thermoelectric conversion module including a heat dissipation layer via an insulating layer on at least one face of a thermoelectric element layer being one in which a p-type thermoelectric element layer and an n-type thermoelectric element layer are alternately arranged to be adjacent to each other in the in-plane direction and disposed in series, wherein the insulating layer has an elastic modulus at 23° C. of 0.1 to 500 GPa, and a method of producing the same.
    Type: Application
    Filed: October 24, 2017
    Publication date: February 4, 2021
    Applicant: LINTEC Corporation
    Inventors: Yusuke HARA, Wataru MORITA, Kunihisa KATO, Tsuyoshi MUTO
  • Publication number: 20200144471
    Abstract: Provided are an electrode material for thermoelectric conversion modules capable of preventing cracking and peeling of electrodes that may occur at the bonding parts of a thermoelectric element and an electrode under high-temperature conditions to thereby maintain a low resistance at the bonding parts, and a thermoelectric conversion module using the material.
    Type: Application
    Filed: March 13, 2018
    Publication date: May 7, 2020
    Applicant: LINTEC CORPORATION
    Inventors: Kunihisa KATO, Wataru MORITA, Tsuyoshi MUTO, Yuma KATSUTA
  • Publication number: 20200066960
    Abstract: The present invention provides: a thermoelectric conversion material capable of being produced in a simplified manner and at a lower cost and excellent in thermoelectric performance and flexibility, and a method for producing the material. The thermoelectric conversion material has, on a support, a thin film of a thermoelectric semiconductor composition containing thermoelectric semiconductor fine particles, a heat-resistant resin and an inorganic ionic compound. The method for producing a thermoelectric conversion material having, on a support, a thin film of a thermoelectric semiconductor composition containing thermoelectric semiconductor fine particles, a heat-resistant resin and an inorganic ionic compound includes a step of applying a thermoelectric semiconductor composition containing thermoelectric semiconductor fine particles, a heat-resistant resin and an inorganic ionic compound onto a support and drying it to form a thin film thereon, and a step of annealing the thin film.
    Type: Application
    Filed: December 7, 2017
    Publication date: February 27, 2020
    Applicant: LINTEC CORPORATION
    Inventors: Kunihisa KATO, Wataru MORITA, Tsuyoshi MUTOU, Yuma KATSUTA, Takeshi KONDO
  • Publication number: 20190378967
    Abstract: Provided are a flexible thermoelectric conversion device having high thermoelectric performance and capable of imparting a sufficient temperature difference in an in-plane direction to the thermoelectric elements inside the thermoelectric conversion module therein, and a method for producing the device. The flexible thermoelectric conversion device includes a thermoelectric conversion module having P-type thermoelectric elements and N-type thermoelectric elements alternately arranged to be adjacent to each other on one face of a film substrate, and includes a high thermally conductive layer composed of a high thermally conductive material in a part of a position on one face of the thermoelectric conversion module, which is on the side of the other face of the film substrate, among both faces of the thermoelectric conversion module, in which the thermal conductivity of the high thermally conductive layer is 5 to 500 (W/m·K), and the production method produces the device.
    Type: Application
    Filed: January 24, 2018
    Publication date: December 12, 2019
    Applicant: LINTEC CORPORATION
    Inventors: Wataru MORITA, Kunihisa KATO, Tsuyoshi MUTOU, Takeshi KONDO
  • Patent number: 10490724
    Abstract: To provide a Peltier cooling element that is excellent in thermoelectric performance and flexibility and can be manufactured easily at low cost. A Peltier cooling element containing a thermoelectric conversion material containing a support having thereon a thin film containing a thermoelectric semiconductor composition containing thermoelectric semiconductor fine particles, a heat resistant resin, and an ionic liquid, and a method for manufacturing a Peltier cooling element containing a thermoelectric conversion material containing a support having thereon a thin film containing a thermoelectric semiconductor composition containing thermoelectric semiconductor fine particles, a heat resistant resin, and an ionic liquid, the method containing: coating a thermoelectric semiconductor composition containing thermoelectric semiconductor fine particles, a heat resistant resin, and an ionic liquid, on a support, and drying, so as to form a thin film; and subjecting the thin film to an annealing treatment.
    Type: Grant
    Filed: December 24, 2015
    Date of Patent: November 26, 2019
    Assignee: LINTEC CORPORATION
    Inventors: Kunihisa Kato, Tsuyoshi Mutou, Wataru Morita, Yuma Katsuta, Takeshi Kondo
  • Patent number: 9944831
    Abstract: The present invention provides a thermally conductive adhesive sheet that can be easily laminated on an electronic device without an adhesive layer therebetween and can further selectively dissipate heat in a particular direction to provide a sufficient temperature difference to the inside of the electronic device, a method for producing the same, and an electronic device using the same.
    Type: Grant
    Filed: September 24, 2014
    Date of Patent: April 17, 2018
    Assignee: LINTEC CORPORATION
    Inventors: Wataru Morita, Kunihisa Kato, Tsuyoshi Mutou
  • Publication number: 20170373240
    Abstract: To provide a Peltier cooling element that is excellent in thermoelectric performance and flexibility and can be manufactured easily at low cost. A Peltier cooling element containing a thermoelectric conversion material containing a support having thereon a thin film containing a thermoelectric semiconductor composition containing thermoelectric semiconductor fine particles, a heat resistant resin, and an ionic liquid, and a method for manufacturing a Peltier cooling element containing a thermoelectric conversion material containing a support having thereon a thin film containing a thermoelectric semiconductor composition containing thermoelectric semiconductor fine particles, a heat resistant resin, and an ionic liquid, the method containing: coating a thermoelectric semiconductor composition containing thermoelectric semiconductor fine particles, a heat resistant resin, and an ionic liquid, on a support, and drying, so as to form a thin film; and subjecting the thin film to an annealing treatment.
    Type: Application
    Filed: December 24, 2015
    Publication date: December 28, 2017
    Applicant: LINTEC CORPORATION
    Inventors: Kunihisa KATO, Tsuyoshi MUTOU, Wataru MORITA, Yuma KATSUTA, Takeshi KONDO
  • Publication number: 20160222256
    Abstract: The present invention provides a thermally conductive adhesive sheet that can be laminated on an electronic device to efficiently dissipate heat and to selectively dissipate heat in a particular direction to provide a sufficient temperature difference to the inside of the electronic device, a method for producing the same, and an electronic device using the same.
    Type: Application
    Filed: September 24, 2014
    Publication date: August 4, 2016
    Applicant: LINTEC CORPORATION
    Inventors: Kunihisa KATO, Wataru MORITA, Tsuyoshi MUTOU
  • Publication number: 20160215172
    Abstract: The present invention provides a thermally conductive adhesive sheet that can be easily laminated on an electronic device without an adhesive layer therebetween and can further selectively dissipate heat in a particular direction to provide a sufficient temperature difference to the inside of the electronic device, a method for producing the same, and an electronic device using the same.
    Type: Application
    Filed: September 24, 2014
    Publication date: July 28, 2016
    Applicant: LINTEC CORPORATION
    Inventors: Wataru MORITA, Kunihisa KATO, Tsuyoshi MUTOU
  • Patent number: 6768864
    Abstract: An information recording and reproducing apparatus (S) is provided with: a reproducing device (8) for reproducing information, which is recorded on a record medium (9) in advance; a compressing device (5, 6) for compressing the reproduced information to reduce an information amount of the reproduced information and generating a compression information; and a recording device (8) for re-recording the generated compression information onto the record medium.
    Type: Grant
    Filed: August 30, 1999
    Date of Patent: July 27, 2004
    Assignee: Pioneer Corporation
    Inventors: Atsushi Kimura, Wataru Morita, Megumi Hashiotani, Eriko Shimizu