Abstract: The present disclosure proposes a pattern matching device capable of achieving matching processing that is characterized by involving a learning function even for a semiconductor pattern including a repetitive pattern, in particular. The pattern matching device pertaining to the present disclosure is provided with a learning unit for estimating a first correlation image having, as pixel values thereof, numerical values representing a correlation between a first image and a second image. The pattern matching device calculates a second correlation image having, as pixel values thereof, numerical values representing the correlation between a derivative image generated from the first image and the first image, and the learning unit performs learning so as to reduce the difference between the first correlation image and the second correlation image (refer to FIG. 1).

Abstract: To provide a technique capable of quantitatively grasping a change in three-dimensional shape including a cross-sectional shape of a pattern within a surface of a wafer or between wafers in a non-destructive manner before cross-sectional observation.

Abstract: The purpose of the present invention is to provide a pattern matching device and computer program that carry out highly accurate positioning even if edge positions and numbers change. The present invention proposes a computer program and a pattern matching device wherein a plurality of edges included in first pattern data to be matched and a plurality of edges included in second pattern data to be matched with the first pattern data are associated, a plurality of different association combinations are prepared, the plurality of association combinations are evaluated using index values for the plurality of edges, and matching processing is carried out using the association combinations selected through the evaluation.

Abstract: A pattern matching apparatus includes a computer system configured to execute pattern matching processing between first pattern data based on design data 104 and second pattern data representing a captured image 102 of an electron microscope. The computer system acquires a first edge candidate group including one or more first edge candidates, acquires a selection-required number (the number of second edge candidates to be selected based on the second pattern data), acquires a second edge candidate group including the second edge candidates of the selection-required number, acquires an association evaluation value for each of different association combinations between the first edge candidate group and the second edge candidate group, selects one of the combinations based on the association evaluation value, and calculates a matching shift amount based on the selected combination.

Abstract: It is an object of the present invention to provide a semiconductor inspection apparatus capable of well carrying out position alignment and correctly determining whether the position alignment has been carried out successfully or has ended in a failure without operator interventions even if an inspected image is an image having few characteristics as is the case with a repetitive pattern or the inspected image is an image having a complicated shape.

Abstract: To provide means according to which template matching is performed successfully in an apparatus that performs inspection or measurement of a semiconductor pattern, which is formed on a wafer, even in a case in which a pattern for alignment, which is in design data, has been eliminated from an image in which an image of a practical pattern was captured using the apparatus, in which the brightness value contrast of a pattern is lower (more indistinct) than that of other locations, or in which a pattern is deformed and there is a discrepancy with the shape of a template (a pattern for alignment in the design data).

Abstract: The purpose of the present invention is to provide a pattern matching device and computer program that carry out highly accurate positioning even if edge positions and numbers change. The present invention proposes a computer program and a pattern matching device wherein a plurality of edges included in first pattern data to be matched and a plurality of edges included in second pattern data to be matched with the first pattern data are associated, a plurality of different association combinations are prepared, the plurality of association combinations are evaluated using index values for the plurality of edges, and matching processing is carried out using the association combinations selected through the evaluation.

Abstract: To provide means according to which template matching is performed successfully in an apparatus that performs inspection or measurement of a semiconductor pattern, which is formed on a wafer, even in a case in which a pattern for alignment, which is in design data, has been eliminated from an image in which an image of a practical pattern was captured using the apparatus, in which the brightness value contrast of a pattern is lower (more indistinct) than that of other locations, or in which a pattern is deformed and there is a discrepancy with the shape of a template (a pattern for alignment in the design data).

Abstract: An inspection device that performs pattern matching on a searched image performs matching between a template image of an inspection object and the searched image by using: a feature region extraction process unit that extracts a feature quantity from the template image acquired for learning; a feature quantity extraction process unit that extracts a feature quantity from the searched image acquired for learning; a mutual feature quantity calculation process unit that calculates a mutual feature quantity of the template image and the searched image from the feature quantity extracted from the template image and the feature quantity extracted from the searched image; a learning process unit that calculates, using a plurality of the mutual feature quantities, a discrimination boundary surface that determines matching success or failure; a process unit that calculates a plurality of the mutual feature quantities from an image acquired from the inspection object; and the plurality of mutual feature quantities and

Abstract: A template creation device for a sample observation device for creating a template for image processing using design data includes a storage unit for storing process information in which information concerning a plurality of process processings is defined, and a template creation unit for processing the design data using the process information and creating the template for the image processing.

Abstract: An inspection device that performs pattern matching on a searched image performs matching between a template image of an inspection object and the searched image by using: a feature region extraction process unit that extracts a feature quantity from the template image acquired for learning; a feature quantity extraction process unit that extracts a feature quantity from the searched image acquired for learning; a mutual feature quantity calculation process unit that calculates a mutual feature quantity of the template image and the searched image from the feature quantity extracted from the template image and the feature quantity extracted from the searched image; a learning process unit that calculates, using a plurality of the mutual feature quantities, a discrimination boundary surface that determines matching success or failure; a process unit that calculates a plurality of the mutual feature quantities from an image acquired from the inspection object; and the plurality of mutual feature quantities and

Abstract: The present invention is a template matching processing device capable of evaluating a similarity degree which supports even a case of intensive morphological change between a design image and a photographic image. In the template matching processing device, matching processing between the design image and the photographic image is performed, a partial design image is obtained by clipping a portion having the highest correlation (step 101), and processing for deforming the photographic image in accordance with the clipped design image (steps 102 to 105) is performed, so that correlation between the deformed image obtained and the design image is taken to be set as the similarity degree.

Abstract: Provided is a template matching method and a template matching apparatus, where the degree of matching between a template and the actual image upon template matching is maintained at a high level, without depending on a partial appearance of a lower layer. Proposed as one embodiment, is a method and an apparatus for template matching, where either an area is set in which comparison of the template and the image is not conducted, or a second area is set inside the template where comparison different from comparison conducted in a first comparison area is to be conducted, and the template matching is conducted on the basis either of comparison excluding the non-comparison area, or of comparison using the first and second areas.

Abstract: To enable SEM-based management of a cross-sectional shape or manufacturing process parameters of a semiconductor device pattern to be measured, the association between the shape or parameters and SEM image characteristic quantities effective for estimating the shape or parameters is saved as learning data. The image characteristic quantities are collated with learning data to estimate the shape or to monitor the process parameters. Accuracy and reliability is achievable by calculating three kinds of reliability (reliability of the image characteristic quantities, reliability of estimation engines, and reliability of estimating results) based on the distribution of the image characteristic quantities and then judging whether additional learning is necessary, or selecting and adjusting image characteristic quantities and estimation engine based on the reliability.

Abstract: (1) part or all of the number, coordinates and size/shape and imaging sequence of imaging points each for observation, the imaging position change method and imaging conditions can be calculated automatically from CAD data, (2) a combination of input information and output information for imaging recipe creation can be set arbitrarily, and (3) decision is made of imaging or processing at an arbitrary imaging point as to whether to be successful/unsuccessful and in case a failure is determined, a relief process can be conducted in which the imaging point or imaging sequence is changed.

Abstract: (1) part or all of the number, coordinates and size/shape and imaging sequence of imaging points each for observation, the imaging position change method and imaging conditions can be calculated automatically from CAD data, (2) a combination of input information and output information for imaging recipe creation can be set arbitrarily, and (3) decision is made of imaging or processing at an arbitrary imaging point as to whether to be successful/unsuccessful and in case a failure is determined, a relief process can be conducted in which the imaging point or imaging sequence is changed.

Abstract: (1) part or all of the number, coordinates and size/shape and imaging sequence of imaging points each for observation, the imaging position change method and imaging conditions can be calculated automatically from CAD data, (2) a combination of input information and output information for imaging recipe creation can be set arbitrarily, and (3) decision is made of imaging or processing at an arbitrary imaging point as to whether to be successful/unsuccessful and in case a failure is determined, a relief process can be conducted in which the imaging point or imaging sequence is changed.

Abstract: It is an object of the present invention to provide a semiconductor inspection apparatus capable of well carrying out position alignment and correctly determining whether the position alignment has been carried out successfully or has ended in a failure without operator interventions even if an inspected image is an image having few characteristics as is the case with a repetitive pattern or the inspected image is an image having a complicated shape.

Abstract: In an imaging recipe creating apparatus that uses a scanning electron microscope to create an imaging recipe for SEM observation of a semiconductor pattern, in order that the imaging recipe for measuring the wiring width and other various dimension values of the pattern from an observation image and thus evaluating the shape of the pattern is automatically generated within a minimum time by the analysis using the CAD image obtained by conversion from CAD data, an CAD image creation unit that creates the CAD image by converting the CAD data into an image format includes an image-quantizing width determining section, a brightness information providing section, and a pattern shape deformation processing section; the imaging recipe being created using the CAD image created by the CAD image creation unit.

Abstract: In an imaging recipe creating apparatus that uses a scanning electron microscope to create an imaging recipe for SEM observation of a semiconductor pattern, in order that the imaging recipe for measuring the wiring width and other various dimension values of the pattern from an observation image and thus evaluating the shape of the pattern is automatically generated within a minimum time by the analysis using the CAD image obtained by conversion from CAD data, an CAD image creation unit that creates the CAD image by converting the CAD data into an image format includes an image-quantizing width determining section, a brightness information providing section, and a pattern shape deformation processing section; the imaging recipe being created using the CAD image created by the CAD image creation unit.