Abstract: Device for enhancing cooling of electronic circuit components that is substantially or fully independent of orientation. A thin profile thermosyphon heat spreader mounted to an electronics package comprises a central evaporator in hydraulic communication with a peripheral condenser, both at least partially filled with liquid coolant. A very high effective thermal conductivity results. Performance is optimized by keeping the evaporator substantially full at all orientations while leaving a void for accumulation of vapor in the condenser. A cover plate and a parallel base plate of generally similar dimension form the evaporator and condenser. Optionally, an opening in the base plate is sealed against the electronics package and places the heat-dissipating component in direct contact with the liquid coolant. Alternatively, the base plate may be formed with the electronics package from a single piece of material. A boiling enhancement structure is provided in the evaporator to encourage vapor bubble nucleation.

Abstract: A plurality of image data are DMA transferred to a printer for printing images as required, and the image data are once buffered in FIFO memories before they are output to the printer so as to reduce an amount of used memories and to provide efficient bus transactions. A DMA transfer apparatus includes a main memory, a CPU and a DMA controller, and is connected to a printer through a printer interface. The DMA controller has a plurality of DMA address registers and transfer count registers, FIFO memories for holding associated data therein and a selector unit for selecting DMA. The selector unit selects DMA addresses at about an earlier output timing to start a plurality of DMA operations to transfer data in conformity to the data output timing.

Abstract: High heat generation member of electronic integrated circuit etc. is boiled and cooled. A refrigerant steam is generated by cooling of the heat generation member and is condensed by a condenser which is provided an upper portion. A refrigerant steam flow path and a condensed refrigerant flow path from the condenser are separated with a partition wall. The condensed liquid sent back to the partition wall is supplied to the heat generation member through the partition wall.

Abstract: The present invention relates to a thermal conduction device well suited to cool electronic components such as semiconductor devices, in which a porous layer is provided at the surface part of the contact interface of a heat generating element or a heat sink element, and a liquid such as oil is contained in cavities formed in the porous layer, the heat generating element and the heat sink element being held in close contact by the surface tension of the liquid, whereby heat generated by the heat generating element is transferred to the heat sink element.

Abstract: A method for producing a heat transfer tube for single-phase flow having rows of discontinuous projections formed on the inner surface thereof along one or more spiral curves. Each projection has a circular, elliptic or a similar cross-section constituted by smooth curves at any desired height including the bottom thereof. The cross-sectional area of the projection progressively decreases towards the top of the projection.

Abstract: A cooling device for providing cooling of integrated circuit semiconductor chips is so arranged as to transfer a heat via thin fin members which are fitted with each other with a small clearance. The bottom surface of one of thermal conductive members which is provided integrally with the fin members is made greater in surface area than a back planar surface of the semiconductor chip, and the thermal conductive member and the semiconductor chip are kept at all times in plane contact with each other, thereby enhancing the cooling performance.

Abstract: A heat transfer tube has at least a row of projections provided on its inner surface at regular intervals along a spiral curve thereof. The row of projections are formed by plastic deformation of part of the heat transfer tube, which is effected by pressing a rolling disc having projections against the outer surface of the heat transfer tube. The projections have smooth curved surfaces. The height of the projections ranges from 0.45 mm to 0.6 mm, their pitch along the spiral curve ranges from 3.5 mm to 5 mm, and their pitch in the axial direction ranges from 5 mm to 9 mm.

Abstract: A boiling type cooling structure for cooling semiconductor chips mounted on printed circuit cards, with a heat conductive stud being attached to the surface of each chip. Cooling plates with fins, arranged so as to surround the circumference of each heat conductive stud, are placed between the printed circuit cards in order to condense the vapor bubbles produced near the heat conductive studs.

Abstract: A heat transfer tube for single-phase flow having rows of discontinuous projections formed on the inner surface thereof along one or more spiral curves. Each projection has a circular, elliptic or a similar cross-section constituted by smooth curves at any desired height including the bottom thereof. The cross-sectional area of the projection progessively decreases towards the top of the projection.

Abstract: In a heat transfer wall having a number of fine and elongate tunnels adjacent to each other with a minute distance under the surface thereof being in contact with liquid on the heat transfer wall, and a number of fine openings for communicating the tunnels to the outside thereof defined on ceilings of the tunnels along the longitudinal directions thereof with each minute distance, a tongue-like projection is provided which protrudes from an edge of the opening or vicinity of the opening across the opening 1 whereby a flow of fluid passing through the openings provided with the projections is controlled so that heat transfer performance characteristics are improved.

Abstract: A method of producing a heat transfer wall, including a plurality of minute tunnels parallelly extending and spaced a minuscule distance from each other under an outer surface of the wall in contact with liquid, and a plurality of tiny hole portions formed at the outer surface of the wall above the tunnels and located at regular intervals along the tunnels to maintain same in communication with the outside. Each hole portion includes a projection located in the hole portion including a hole itself and extending from the vicinity of the hole portion into the hole portion in a manner to traverse same, so that a flow of liquid into the tunnels and a flow of vapor out of the tunnels can be optimally regulated by the projections to enable the heat transfer wall to exhibit a high heat transfer performance.

Abstract: In an apparatus wherein heat generating bodies such as integrated circuit chips are cooled by utilizing boiling of a liquid; a heat transfer apparatus characterized in that a heat conductive member which has a plurality of layers of cavity groups and apertures for bringing the cavity groups into communication is installed on a surface of each of the heat generating bodies.

Abstract: In a perforated heat conductive surface structure having voids under an outer surface and openings in the outer surface, in order to obtain a high performance in particular at a low pressure and low temperature region, there is provided a heat transfer wall in which a thickness of a wall at a ceiling of each void and a length of a passage of the respective openings are increased in predetermined ranges.

Abstract: In a heat transfer wall provided with a plurality of cells and restricted holes, the cells are formed in a plurality of laminated layers in a direction from an outer surface of the heat transfer wall to an inside thereof, and the cells of the upper and lower layers and the outside of the outer surface are communicated to one another through the holes.

Abstract: A liquid film evaporation type heat exchanger including a plurality of heat transfer units, with each unit including a plurality of flat heat transfer ducts of square cross section formed with a plurality of warm water passageways extending perpendicular to the direction of flow of a liquid medium, and a plurality of liquid distributing beams formed with a pluraity of cutouts. The heat transfer ducts and the liquid distributing beams being alternately arranged in the respective units, with the heat transfer units being arranged at locations spaced apart from each other in the direction of flow of the liquid medium. Vapor releasing ports are formed in positions between the adjacent heat transfer units. Each heat transfer duct has on either side surface thereof a porous material layer providing a heat exchange surface on which a film of the liquid medium is formed for evaporation.

Abstract: In a heat transfer surface having cavity groups and restricted opening groups in an outer surface region, the cavity groups are composed of a plurality of rows of void strip members. The cavity strip members are arranged in parallel on a base member of the heat transfer surface and are laminated in one or more layers. Each strip member has a number of elongate cavities laterally arranged in parallel. The elongate cavities are closed at upper surfaces and have at both ends openings. The adjacent cavities in the same layer are communicated with each other by communicating portions each provided between the cavity strip members and by the openings. The restricted opening groups are formed on the upper surfaces of the communicating portions. The restricted opening groups render the communicating portions in one layer, the communicating portions in another layer and the outside to communicate with each another. The method of manufacturing such a heat transfer surface is also disclosed.

Abstract: A falling film evaporation type heat exchanger of the shell-tube type which includes an outer shell or main body portion and a plurality of individual heat transfer tubes disposed therein, with the heat transfer tubes extending substantially in a vertical direction. A liquid refrigerant is caused to freely fall from upper portions of the heat transfer tubes along the outer peripheral surfaces of the tubes and the evaporation of the thin refrigerant film, formed on the outer peripheral surface of the heat transfer tubes effects the transfer.

Abstract: A plurality of winding units each composed of a wire element are serially arranged in the axial direction of the winding between an inner insulating sleeve and an outer insulating sleeve, and vertical cooling paths are formed on opposite sides of each winding unit and horizontal cooling paths are formed between adjacent winding units. The winding units are divided into a plurality of winding sub-units to define a central vertical cooling path therebetween, which central vertical cooling path includes a via flow path and a branch inducing flow path, whereby cooling fluid flows in opposite directions and at substantially the same speed in the horizontal cooling paths along upper and lower surfaces of each of the winding units having the branch inducing flow path. In this manner, the entire winding is uniformly cooled.

Abstract: Winding structure for static electrical induction apparatus such as transformers, reactors, or the like. A winding assembly is disposed in a space formed between a pair of inner and outer insulation continuous walls which are disposed in a container so as to commonly include the vertical axis of the container thereby defining the space therebetween. An inner vertical coolant passage is formed between the winding assembly and the inner insulation wall and an outer vertical coolant passage is also formed between the winding assembly and the inner insulation wall. The winding assembly is composed of a plurality of coil units stacked on one another in the vertical direction with separation at predetermined intervals so as to form horizontal coolant passages between vertically adjacent ones of the coil units, the inner and outer vertical coolant passages communicating with each other through the horizontal coolant passages.

Abstract: A cooling device for providing cooling of integrated circuit semiconductor chips is so arranged as to transfer a heat via thin fin members which are fitted with each other with a small clearance. The bottom surface of one of thermal conductive members which is provided integrally with the fin members is made greater in surface area than a back planar surface of the semiconductor chip, and the thermal conductive member and the semiconductor chip are kept at all times in plane contact with each other, thereby enhancing the cooling performance.