Abstract: A carbon steel wire with unprecedentedly high strength and excellent ductility and fatigue resistance, a process for producing the same, and a method of evaluating the same are provided. Provided is a carbon steel wire having a carbon content of 0.50 to 1.10% by mass, wherein the ratio of the hardness of the surface layer portion on a cross section and the hardness of the surface layer portion on a longitudinal section is represented by a coefficient X1, and the ratio of the hardness of the center portion on the cross section and the hardness of the center portion on the longitudinal section is represented by a coefficient X2, wherein X1 and X2 satisfy the following expressions: 0.9<coefficient X1?1.10, and 0.9<coefficient X2?1.10, and wherein the carbon steel wire has a tensile strength of 4000 MPa or higher.

Abstract: The present invention avoids execution of processing not intended by the user on the photographed image in a locked state. The image photographed by a camera which is in a lock released state is stored in a user area created in a storage area. On the other hand, an image photographed by a camera, which turned to a locked state as a result of being performed no operation for more than a fixed time, is stored in an area where stores the photographed image photographed in a locked state (second storage area). The image stored in the second storage area is determined after an input of a user's instruction with regard to the processing to be performed on the image.

Abstract: The invention relates to a composition for organic electroluminescent element, which comprises: a solvent; and a compound group ? for organic electroluminescent element that is constituted of at least two kinds of compounds which each have a molecular weight of 3,000 or less and have a structure comprising a plurality of aromatic ring groups linked to each other, wherein the compound group ? comprises: a compound ?1; and another compound ?n satisfying a specific condition.

Abstract: Disclosed is a processing method that removes moisture in a low permittivity film formed on a substrate to be processed which has a damaged layer on the surface thereof while maintaining the specific permittivity or a leakage current value low when the film is subjected to a recovery processing. The method for the recovery processing includes applying, on the damaged layer of the low permittivity film, a first processing gas whose molecules are small sufficient to permeate the inside of the damaged layer of the low permittivity film and which is able to remove the moisture in the damaged layer and a second processing gas which forms a hydrophobic dense reformatted layer on the surface of the damaged layer, thereby allowing the first processing gas and the second processing gas to react with the damaged layer.

Abstract: The invention provides an organic compound incorporating a specific structure into a pyridine skeleton or a 1,3,5-triazine skeleton and adapting the molecular weight to a specific range, a composition comprising the organic compound and a solvent, organic electroluminescent element comprising a layer that is formed by using the composition, and the uses thereof.

Abstract: The present invention relates to a metal oxide-platinum compound catalyst comprising 5 to 95 parts by weight of a metal oxide and 95 to 5 parts by weight of platinum as the balance. The platinum has a form to reticulately cover at least a part of a particle of the metal oxide. The wires constituting the platinum mesh have an average wire diameter of 5 nm or smaller.

Abstract: The invention provides an organic compound incorporating a specific structure into a pyridine skeleton or a 1,3,5-triazine skeleton and adapting the molecular weight to a specific range, a composition comprising the organic compound and a solvent, organic electroluminescent element comprising a layer that is formed by using the composition, and the uses thereof.

Abstract: The objection of invention is to provide a composition for organic electroluminescent element having a smaller amount of foreign substance. The invention is a composition for organic electroluminescent element, which is for forming at least one layer selected from the group consisting of a light emitting layer, a hole injection layer and a hole transportation layer, wherein the composition comprises an aromatic amine polymer having a weight average molecular weight of 3,000 to 1,000,000 and a solvent, and a Zn concentration in the composition is less than 0.5 ppm.

Abstract: A recovery process of a damaged layer and a reducing process of an oxide are performed on a substrate in which the oxide and the damaged layer from which carbon has been eliminated are formed on exposed surfaces of a Cu wiring and a SiCOH film as a low-k film, respectively. In the same processing chamber 51, a recovery process of a damaged layer 15 and a reducing process of an oxide/fluoride layer 16 are performed on a wafer W in which the damaged layer 15 from which carbon has been eliminated and the oxide/fluoride layer 16 are formed on exposed surfaces of an interlayer insulating film 4 containing SiCOH and a wiring 2 containing Cu, respectively, by consecutively supplying H2 gas and TMSDMA gas containing silicon and carbon in sequence.

Abstract: The present invention relates to a metal oxide-platinum compound catalyst comprising 5 to 95 parts by weight of a metal oxide and 95 to 5 parts by weight of platinum as the balance. The platinum has a form to reticulately cover at least a part of a particle of the metal oxide. The wires constituting the platinum mesh have an average wire diameter of 5 nm or smaller.

Abstract: The invention provides an organic compound incorporating a specific structure into a pyridine skeleton or a 1,3,5-triazine skeleton and adapting the molecular weight to a specific range, a composition comprising the organic compound and a solvent, organic electroluminescent element comprising a layer that is formed by using the composition, and the uses thereof.

Abstract: A method for fabricating a semiconductor device, according to the present invention includes the steps of: preparing an SOI substrate, which comprises a semiconductor supporting layer, an oxide layer formed on the semiconductor supporting layer and an SOI layer formed on the oxide layer; forming a semiconductor device on the SOI layer; forming a passivation layer over the SOI substrate, the passivation layer allowing a UV light to pass through it; and applying a UV light to the SOI substrate after the step of forming the semiconductor device is completed.

Abstract: Disclosed are: a polyorganosiloxane composition which can be cured into a product having high strength and has little influence on the environment; and a cured product of the polyorganosiloxane composition. Specifically disclosed are: a polyorganosiloxane composition comprising (A) a polyorganosiloxane in which at least one end in the molecule is modified with a silanol, (B) a titanium alkoxide in an amount of 0.01 to 2 moles relative to 1 mole of the polyorganosiloxane, and (C) an ?-hydroxycarbonyl compound or a hydroxycarboxylic acid ester in an amount of 0.01 to 2 moles relative to 1 mole of the polyorganosiloxane; and a cured product of the polyorganosiloxane composition.

Abstract: Disclosed is an organosiloxane composition which can be produced at low cost and is usable for bonding of glasses, metals and resins. The organosiloxane composition can provide a cured product exhibiting excellent heat resistance and cold resistance, while having high strength and high transparency. Specifically disclosed is a polyorganosiloxane composition containing (A) a polyorganosiloxane wherein at least one end of each molecule is modified with a silanol group, and (B) 0.5-4.0 moles of a metal alkoxide per 1 mole of the polyorganosiloxane, wherein the mean molecular weight (Mw) of the polyorganosiloxane according to the mass fraction is not more than 1,000. Also specifically disclosed are a cured product of the composition and a method for producing the composition.

Abstract: Disclosed is a processing method that removes moisture in a low permittivity film formed on a substrate to be processed which has a damaged layer on the surface thereof while maintaining the specific permittivity or a leakage current value low when the film is subjected to a recovery processing. The method for the recovery processing includes applying, on the damaged layer of the low permittivity film, a first processing gas whose molecules are small sufficient to permeate the inside of the damaged layer of the low permittivity film and which is able to remove the moisture in the damaged layer and a second processing gas which forms a hydrophobic dense reformatted layer on the surface of the damaged layer, thereby allowing the first processing gas and the second processing gas to react with the damaged layer.

Abstract: Disclosed is an organosiloxane composition which can be produced at low cost and is usable for bonding of glasses, metals and resins. The organosiloxane composition can provide a cured product exhibiting excellent heat resistance and cold resistance, while having high strength and high transparency. Specifically disclosed is a polyorganosiloxane composition containing (A) a polyorganosiloxane wherein at least one end of each molecule is modified with a silanol group, and (B) 0.5-4.0 moles of a metal alkoxide per 1 mole of the polyorganosiloxane, wherein the mean molecular weight (Mw) of the polyorganosiloxane according to the mass fraction is not more than 1,000. Also specifically disclosed are a cured product of the composition and a method for producing the composition.

Abstract: There is provided a processing method for performing a recovery process on a damaged layer formed on a surface of a low-k film of a target substrate by introducing a processing gas containing a methyl group into a processing chamber. The method includes: increasing an internal pressure of the processing chamber up to a first pressure lower than a processing pressure for the recovery process by introducing a dilution gas into the processing chamber maintained in a depressurized state; then stopping the introduction of the dilution gas, and increasing the internal pressure of the processing chamber up to a second pressure as the processing pressure for the recovery process by introducing the processing gas into a region where the target substrate exists within the processing chamber; and performing the recovery process on the target substrate while the processing pressure is maintained.

Abstract: Disclosed are: a polyorganosiloxane composition which can be cured into a product having high strength and has little influence on the environment; and a cured product of the polyorganosiloxane composition. Specifically disclosed are: a polyorganosiloxane composition comprising (A) a polyorganosiloxane in which at least one end in the molecule is modified with a silanol, (B) a titanium alkoxide in an amount of 0.01 to 2 moles relative to 1 mole of the polyorganosiloxane, and (C) an ?-hydroxycarbonyl compound or a hydroxycarboxylic acid ester in an amount of 0.01 to 2 moles relative to 1 mole of the polyorganosiloxane; and a cured product of the polyorganosiloxane composition.

Abstract: Provided is a carbon steel wire with unprecedentedly high strength and excellent ductility and fatigue resistance, a process for producing the same, and a method of evaluating the same is provided. Provided is a carbon steel wire having a carbon content of 0.50 to 1.10% by mass, wherein the ratio of the hardness of the surface layer portion 13 on a cross section 12 and the hardness of the surface layer portion 3 on a longitudinal section 2, a coefficient X (cross sectional hardness/longitudinal sectional hardness), and the ratio of the hardness of the center portion 14 on the cross section 12 and the hardness of the center portion 4 on the longitudinal section 2, a coefficient X (cross sectional hardness/longitudinal sectional hardness), each satisfy a relationship represented by the following expression: 0.9<coefficient X?1.10, and wherein the carbon steel wire has a tensile strength of 4000 MPa or higher.

Abstract: A recovery process of a damaged layer and a reducing process of an oxide are performed on a substrate in which the oxide and the damaged layer from which carbon has been eliminated are formed on exposed surfaces of a Cu wiring and a SiCOH film as a low-k film, respectively. In the same processing chamber 51, a recovery process of a damaged layer 15 and a reducing process of an oxide/fluoride layer 16 are performed on a wafer W in which the damaged layer 15 from which carbon has been eliminated and the oxide/fluoride layer 16 are formed on exposed surfaces of an interlayer insulating film 4 containing SiCOH and a wiring 2 containing Cu, respectively, by consecutively supplying H2 gas and TMSDMA gas containing silicon and carbon in sequence.