Abstract: A memory architecture 400 includes an array of memory cells partitioned into a plurality of subarrays 401. Each subarray 401 includes a plurality of memory cells organized in rows and columns, each row associated with a conductive wordline 407 and each column associated with a pair of conductive half-bitlines 403. The first sense amplifier 402 is selectively coupled to selected pair of half-bitlines 403. A second sense amplifier 402 is selectively coupled to the selected pair of half-bitlines 403. A first local I/O line 404 is coupled to first sense amplifier 402 and a second local I/O line 404 is coupled to the second sense amplifier 402. First and second sets of global I/O lines 405 are selectively coupled to the first and second I/O lines 404.

Abstract: A memory 200 includes a first memory segment 302 comprising an array of rows and columns of memory cells, a selected column of cells in the first segment 302 accessed through a dedicated sense amplifier 304 associated with the first segment. A second memory segment 302 comprises an array of rows and columns of memory cells, a selected column of cells in the second memory segment 302 accessed through a dedicated sense amplifier 304 associated with the second segment. A Read Input/Output line 306a is coupled to the sense amplifier accessing the selected column of the first segment 302 for reading data from the first segment during a selected access cycle. A Write Input/Output line 306b is coupled to the sense amplifier 304 accessing the selected column of the second segment 302 for simultaneously writing data to the second memory segment 302 during the selected access cycle.

Abstract: Memory 200 having an array of rows and columns of memory cells, each column associated with a pair of complementary bitlines 302a, 302b. An access sense amplifier 203 coupled to each pair of complementary bitlines 302a, 302b for sensing and latching data from cells along a selected row during a first portion of a random access cycle. Refresh sense amplifier 204 is coupled to each pair of complementary bitlines for 302a, 302b for refreshing data from cells along a selected row during a second portion of the random access cycle.

Abstract: A memory 1300 including an array of rows and columns of memory cells 501 is disclosed. For each column, first and second interdigitated bitlines 1301, 1303 are coupled to the cells of the column. The first bitlines 1301 has an end coupled to a sense amplifier 1302 at a first boundary of the array and a second bitline 1303 has an end coupled to a second sense amplifier at a second boundary of the array, the first and second boundaries being spaced apart by the array. Control circuitry 508 precharges the first bitlines 1301 of the columns of the array substantially simultaneous to an access to the array through the second bitlines 1303 of selected columns of the array.

Abstract: A dynamic random access memory 400 includes an array 401 of physical rows and columns of memory cells, the cells of each row coupled to first and second wordlines 603 and first and second bitlines 602. A direct input/output data path 402 having a width equal to a width of the rows supports simultaneous writing to each of the cells along a selected row using the first wordlines and first bitlines during a single access cycle without restore.

Abstract: A data processing system having a DRAM and a non-volatile memory, such as a ROM or a programmable ROM (PROM), is implemented on a single integrated circuit using DRAM data processing techniques. The DRAM is manufactured in accordance with known processing techniques. The non-volatile memory is manufactured using the same DRAM manufacturing techniques, with the addition of a processing step in which a first terminal of a stacked capacitor manufactured in accordance with the DRAM process, is coupled to a known-reference voltage. This stacked capacitor structure may be coupled to a known conductor through the formation of a via and the subsequent coupling of a conductor to the stacked capacitor structure through the via. Alternatively, the stacked capacitor structure may be coupled to the known reference voltage through an internal connection to that reference voltage.

Abstract: A method of permanently programming selected cells of dynamic random access memory cell array. First selected cell is programmed to a Logic 1 by grounding a first capacitor plate of the first cell, and applying a programming voltage to a second capacitor plate common to the cells of the array. A dielectric disposed between the first capacitor plate and the second capacitor plate breaks down, thereby shorting the first and second capacitor plates. A second selected cell is programmed to store a Logic 1 by allowing a first capacitor of the second cell to float during a period when the programming voltage is applied to the second capacitor plate.

Abstract: A memory 200 including an array 201 of rows and columns of 2-transistor, 1-capacitor memory cells 301 of the cells of each row coupled to first and second wordlines 303a, 303b and the cells of each column coupled to a pair of bitlines 302a, 302b. Refresh circuitry 208 activates the first wordline 303a plus selected said row and refreshes the cells 301 of that row through a first one of the bitlines 302a of each of the columns. Data access circuitry 202, 204 substantially simultaneously activates the second said wordline 303b of a second selected row and accesses selected cells of the second row through a second one of the bitlines 302b in the corresponding columns.

Abstract: A memory architecture 400 includes an array of memory cells partitioned into a plurality of subarrays 401. Each subarray 401 includes a plurality of memory cells organized in rows and columns, each row associated with a conductive wordline 407 and each column associated with a pair of conductive half-bitlines 403. The first sense amplifier 402 is selectively coupled to selected pair of half-bitlines 403. A second sense amplifier 402 is selectively coupled to the selected pair of half-bitlines 403. A first local I/O line 404 is coupled to first sense amplifier 402 and a second local I/O line 404 is coupled to the second sense amplifier 402. First and second sets of global I/O lines 405 are selectively coupled to the first and second I/O lines 404.