Patents by Inventor Wayne Victor Sorin

Wayne Victor Sorin has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20180233881
    Abstract: In example implementations of a vertical-cavity surface-emitting laser (VCSEL), the VCSEL includes a p-type distributed Bragg reflector (p-DBR) layer end a p-type ohmic (p-ohmic) contact layer adjacent to the p-DBR layer. The p DBR layer may include an oxide aperture and the p-ohmic contact layer may have an opening that is aligned with the oxide aperture. The opening may be filled with a dielectric material. A metal layer may be coupled to the p-ohmic contact layer and encapsulate the dielectric material.
    Type: Application
    Filed: August 10, 2015
    Publication date: August 16, 2018
    Inventors: Sagi MATHAI, Michael Renne Ty TAN, Wayne Victor SORIN
  • Patent number: 10048440
    Abstract: A photonic interconnect apparatus includes tunable light devices, multiplexers to multiplex optical signals produced by the tunable light devices onto optical paths, and a cyclic arrayed waveguide grating (AWG) to receive the optical signals over the optical paths, and to direct a given optical signal of the received optical signals to a selected output of a plurality of outputs of the cyclic AWG based on a wavelength of the given optical signal. A respective demultiplexer directs the given optical signal to a selected output of a plurality of outputs of the respective demultiplexer according to which coarse wavelength band the wavelength of the given optical signal is part of.
    Type: Grant
    Filed: January 29, 2015
    Date of Patent: August 14, 2018
    Assignee: Hewlett Packard Enterprise Development LP
    Inventors: Mike Schlansker, Jean Tourrilhes, Michael Renne Ty Tan, Joaquin Matres, Wayne Victor Sorin
  • Patent number: 10033159
    Abstract: A mode-controlled laser system includes an active region to generate optical energy in response to an electric signal. The system also includes a mirror to resonate the optical energy in an optical cavity. The system also includes a HCG mode control reflector arranged in the optical cavity to control the resonated optical energy into a substantially non-Gaussian intensity profile. The resonated optical energy can be emitted as an optical signal having the substantially non-Gaussian intensity profile.
    Type: Grant
    Filed: June 20, 2013
    Date of Patent: July 24, 2018
    Assignee: Hewlett Packard Enterprise Development LP
    Inventors: Wayne Victor Sorin, Michael Renne Ty Tan, David A. Fattal, Marco Fiorentino
  • Patent number: 10033477
    Abstract: A system includes an optical Y-junction coupler to receive a first modulated optical signal on a wide input path of the optical Y-junction coupler and to receive a second modulated optical signal on a narrow input path of the optical Y-junction coupler, wherein the optical Y-junction coupler generates a combined optical signal from signals received on the wide input path and the narrow input path. A multimode waveguide receives the combined optical signal from the optical Y-junction coupler and propagates a spatially multiplexed optical output signal along a transmission path.
    Type: Grant
    Filed: July 27, 2012
    Date of Patent: July 24, 2018
    Assignee: Hewlett Packard Enterprise Development LP
    Inventors: Alexandre M Bratkovski, Jacob Khurgin, Wayne Victor Sorin, Michael Renne Ty Tan
  • Patent number: 10018788
    Abstract: A silicon photonic (SiPh) packaging assembly includes a SiPh interposer and a wafer. The SiPh interposer has one or more optical gratings disposed thereon to couple an optical signal traversing the wafer. The wafer is bonded to the interposer, with the wafer including one or more microlenses, each microlens aligned with a respective optical grating and designed to direct the optical signal traversing the wafer at a desired angle.
    Type: Grant
    Filed: October 28, 2014
    Date of Patent: July 10, 2018
    Assignee: Hewlett Packard Enterprise Development LP
    Inventors: Sagi Varghese Mathai, Michael Renne Ty Tan, Wayne Victor Sorin
  • Patent number: 10007065
    Abstract: An example device includes a first semiconductor component comprising at least two lasers to emit light at a first wavelength; a second semiconductor component comprising at least two lasers to emit light at a second wavelength, the first wavelength being different from the second wavelength; and an optical multiplexer to receive light from two lasers at the first wavelength and light from two lasers at the second wavelength. The optical multiplexer component includes a first output interface to couple light from one laser at the first wavelength and light from one laser at the second wavelength to a first optical fiber, and a second output interface to couple light from one laser at the first wavelength and light from one laser at the second wavelength beams to a second optical fiber.
    Type: Grant
    Filed: October 31, 2013
    Date of Patent: June 26, 2018
    Assignee: Hewlett Packard Enterprise Development LP
    Inventors: Michael Renne Ty Tan, Sagi Varghese Mathai, Georgios Panotopoulos, Paul Kessler Rosenberg, Wayne Victor Sorin
  • Patent number: 9973283
    Abstract: An optical coupling system includes an optical signal source to provide an optical signal from an aperture. The system also includes a substantially planar high-contrast grating (HCG) lens to convert an optical mode of the optical signal to provide a converted optical signal having a mode-isolating intensity profile. The system further includes an optical element to receive the converted optical signal. The optical signal source and the substantially planar HCG lens can be arranged to substantially mitigate coupling of a reflected optical signal associated with the converted optical signal that is reflected from the optical element to the aperture of the optical signal source based on a reflected mode-isolating intensity profile.
    Type: Grant
    Filed: April 11, 2013
    Date of Patent: May 15, 2018
    Assignee: Hewlett Packard Enterprise Development LP
    Inventors: Wayne Victor Sorin, Sonny Vo, David A. Fattal, Michael Renne Ty Tan
  • Patent number: 9917647
    Abstract: A combination underfill-dam and electrical-interconnect structure for an opto-electronic engine. The structure includes a first plurality of electrical-interconnect solder bodies. The first plurality of electrical-interconnect solder bodies includes a plurality of electrical interconnects. The first plurality of electrical-interconnect solder bodies, is disposed to inhibit intrusion of underfill material into an optical pathway of an opto-electronic component for the opto-electronic engine. A system and an opto-electronic engine that include the combination underfill-dam and electrical interconnect structure are also provided.
    Type: Grant
    Filed: January 31, 2012
    Date of Patent: March 13, 2018
    Assignee: Hewlett Packard Enterprise Development LP
    Inventors: Sagi Varghese Mathai, Michael Renne Ty Tan, Paul Kessler Rosenberg, Wayne Victor Sorin, Georgios Panotopoulos, Susant K. Patra, Joseph Straznicky
  • Publication number: 20180052284
    Abstract: An example device in accordance with an aspect of the present disclosure includes a slab to transmit light, and a plurality of lenses and filters disposed on first and second surfaces of the slab. The lenses include an anti-reflective coating on at least one of the plurality of lenses at an end of the slab to couple light through the anti-reflective coating, and a reflective coating disposed on remaining ones of the plurality of lenses to cause the lenses to reflect light. The filters are offset from the lenses to form an optical zig-zag.
    Type: Application
    Filed: April 10, 2015
    Publication date: February 22, 2018
    Inventors: Joaquin Matres, Michael Renee Ty Tan, Sagi Mathai, Wayne Victor Sorin, Paul Kessler Rosenberg
  • Publication number: 20170315299
    Abstract: A silicon photonic (SiPh) packaging assembly includes a SiPh interposer and a wafer. The SiPh interposer has one or more optical gratings disposed thereon to couple an optical signal traversing the wafer. The wafer is bonded to the interposer, with the wafer including one or more microlenses, each microlens aligned with a respective optical grating and designed to direct the optical signal traversing the wafer at a desired angle.
    Type: Application
    Filed: October 28, 2014
    Publication date: November 2, 2017
    Inventors: Sagi Varghese MATHAI, Michael Renne Ty TAN, Wayne Victor SORIN
  • Patent number: 9798087
    Abstract: Example implementations relate to mounting optoelectronic devices and wavelength-division multiplexing optical connectors. For example, an implementation includes a transparent interposer having an integrated plurality of lenses. A plurality of optoelectronic devices are mounted to a bottom surface of the transparent interposer, each of the optoelectronic devices being paired to a respective lens of the plurality of lenses. The bottom surface of the transparent interposer is mounted to a substrate within a region of an optical socket. The optical socket receives a filter-based wavelength-division multiplexing (WDM) optical connector. Each lens of the plurality of lenses is paired to a respective filter of the WDM optical connector when the WDM optical connector is mated to the optical socket.
    Type: Grant
    Filed: November 1, 2016
    Date of Patent: October 24, 2017
    Assignee: Hewlett Packard Enterprise Development LP
    Inventors: Sagi Mathai, Michael Renne Ty Tan, Wayne Victor Sorin, Paul Kessler Rosenberg
  • Publication number: 20170227714
    Abstract: A photonic interconnect apparatus includes tunable light devices, multiplexers to multiplex optical signals produced by the tunable light devices onto optical paths, and a cyclic arrayed waveguide grating (AWG) to receive the optical signals over the optical paths, and to direct a given optical signal of the received optical signals to a selected output of a plurality of outputs of the cyclic AWG based on a wavelength of the given optical signal. A respective demultiplexer directs the given optical signal to a selected output of a plurality of outputs of the respective demultiplexer according to which coarse wavelength band the wavelength of the given optical signal is part of.
    Type: Application
    Filed: January 29, 2015
    Publication date: August 10, 2017
    Inventors: Mike Schlansker, Jean Tourrilhes, Michael Renne Ty Tan, Joaquin Matres, Wayne Victor Sorin
  • Publication number: 20170010482
    Abstract: A high contrast grating optical modulation includes an optical modulator at a front surface of a substrate to modulate received light. The high contrast grating optical modulation further includes a high contrast grating (HCG) lens adjacent to a back surface of the substrate opposite to the front surface to focus incident light onto the optical modulator. The substrate is transparent to operational wavelengths of the focused incident light and the modulated light.
    Type: Application
    Filed: January 24, 2014
    Publication date: January 12, 2017
    Inventors: Sagi Varghese Mathai, David A. Fattal, Michael Renne Ty Tan, Wayne Victor Sorin
  • Publication number: 20160327746
    Abstract: Bidirectional optical multiplexing employs a high contrast grating as one or both of a beam-forming lens and a relay mirror. A bidirectional optical multiplexer includes the beam-forming lens to focus light. The light is one or both of a light beam internal to and another light beam external to the bidirectional optical multiplexer. The bidirectional optical multiplexer further includes an optical filter and the relay mirror. The optical filter is to selectively pass a portion of the internal light beam at a first wavelength and to reflect portions of the internal light beam at other wavelengths. The relay mirror is to reflect the internal light beam along a zigzag propagation path between the optical filter and the relay mirror.
    Type: Application
    Filed: January 25, 2014
    Publication date: November 10, 2016
    Applicant: HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.
    Inventors: Sagi Varghese Mathai, Michael Renne Ty Tan, Georgios Panotopoulos, Wayne Victor Sorin, Paul Kessler Rosenberg
  • Publication number: 20160246008
    Abstract: An example device includes a first semiconductor component comprising at least two lasers to emit light at a first wavelength; a second semiconductor component comprising at least two lasers to emit light at a second wavelength, the first wavelength being different from the second wavelength; and an optical multiplexer to receive light from two lasers at the first wavelength and light from two lasers at the second wavelength. The optical multiplexer component includes a first output interface to couple light from one laser at the first wavelength and light from one laser at the second wavelength to a first optical fiber, and a second output interface to couple light from one laser at the first wavelength and light from one laser at the second wavelength beams to a second optical fiber.
    Type: Application
    Filed: October 31, 2013
    Publication date: August 25, 2016
    Inventors: Michael Renne Ty Tan, Sagi Varghese Mathai, Georgios Panotopoulos, Paul Kessler Rosenberg, Wayne Victor Sorin
  • Publication number: 20160238795
    Abstract: Loss compensated optical switching includes an optical crossbar switch and a wafer bonded semiconductor amplifier (SOA). The optical crossbar switch has a plurality of input ports and a plurality of output ports and is on a substrate of a first semiconductor material. The wafer bonded SOA includes a layer of second semiconductor material that is wafer bonded to a surface of the substrate such that a portion of the wafer bonded SOA semiconductor material layer overlies a portion of a port of the plurality of input ports. The second semiconductor material of the wafer bonded SOA is different from the first semiconductor material of the substrate.
    Type: Application
    Filed: October 9, 2013
    Publication date: August 18, 2016
    Applicant: Hewlett-Packard Development Company, L.P.
    Inventors: Michael Renne Ty Tan, Sagi Varghese Mathai, Wayne Victor Sorin, Paul Kessler Rosenberg
  • Publication number: 20160195677
    Abstract: A device includes a first element and a second element. The first element includes a plurality of mirrors formed as concave features on the first element. The second element is to support a plurality of filters. The first element is coupleable to the second element to align the plurality of mirrors relative to the plurality of filters to operate as a multiplexer or de-multiplexer.
    Type: Application
    Filed: August 21, 2013
    Publication date: July 7, 2016
    Inventors: Georgios Panotopoulos, Paul Kessler Rosenberg, Michael Renne Ty Tan, Wayne Victor Sorin, Sagi Varghese Mathai
  • Patent number: 9354410
    Abstract: A monolithically integrated, self-aligning, optical-fiber ferrule for a pigtailed opto-electronic module. The ferrule includes a body, a cavity defined within the body, a lateral alignment structure, and an optical-fiber stop. The cavity is to accept and align an optical fiber with an end of the cavity to face an optical aperture of an opto-electronic component. The lateral alignment structure is to self-align laterally the optical fiber with the optical aperture. The optical-fiber stop is coupled to the body, to self-align vertically the optical fiber. The body, the cavity, the lateral alignment structure and the optical-fiber stop are integrated together as a portion of a monolithically integrated chip. A system and a pigtailed opto-electronic engine that include the ferrule are also provided.
    Type: Grant
    Filed: January 31, 2012
    Date of Patent: May 31, 2016
    Assignee: Hewlett Packard Enterprise Development LP
    Inventors: Sagi Varghese Mathai, Michael Renne Ty Tan, Paul Kessler Rosenberg, Wayne Victor Sorin, Georgios Panotopoulos
  • Patent number: 9354388
    Abstract: A composite wafer includes a molded wafer and a second wafer. The molded wafer includes a plurality of first components, and the second wafer includes a plurality of second components. The second wafer is combined with the molded wafer to form the composite wafer. At least one of the first components is aligned with at least one of the second components to form a multi-component element. The multi-component element is singulatable from the composite wafer.
    Type: Grant
    Filed: July 30, 2014
    Date of Patent: May 31, 2016
    Assignee: Hewlett Packard Enterprise Development LP
    Inventors: Michael Renne Ty Tan, Georgios Panotopoulos, Paul Kessler Rosenberg, Sagi Varhgese Mathai, Wayne Victor Sorin, Susant K. Patra
  • Publication number: 20160149646
    Abstract: Techniques related to optical devices including a high contrast grating (HCG) lens are described herein. In an example, an optical device includes a transparent substrate. A laser emitter or detector at a first side of the transparent substrate to emit or detect a laser light transmitted via the transparent substrate. A HCG lens is at a second side of the transparent substrate to transmit and refract the laser light.
    Type: Application
    Filed: May 22, 2013
    Publication date: May 26, 2016
    Inventors: Wayne Victor Sorin, Michael Renne Ty Tan, David A. Fattal, Sagi Varghese Mathai