Patents by Inventor Wei-Cheng Ku
Wei-Cheng Ku has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 8816713Abstract: A probe card for high-frequency signal transmission includes a circuit board with transmission lines, a plurality of probes, and a signal path adjuster having first lead wires with a same length respectively connected between the transmission lines and the probes. Each first lead wire is selectively replaceable by a second lead having a length different from that of the first lead wire. As a result, a first high-frequency signal transmitting from one transmission line through the associated first lead wire to the associated probe and a second high-frequency signal transmitting from another transmission line through the associated second lead wire to the associated probe may have a same output timing when the first and second high-frequency signals are synchronously inputted into the circuit board.Type: GrantFiled: July 20, 2012Date of Patent: August 26, 2014Assignee: MPI CorporationInventors: Wei-Cheng Ku, Chih-Hao Ho, Chen-Kuo Kao, Chao-Ping Hsieh
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Publication number: 20140232421Abstract: A probe card, which is used to transmit power signals and test signals from a tester to a DUT, includes a pin base, a plurality of signal pins, a signal conducting circuit and at least one power conducting circuit. The signal pins are made of conductive materials, and each contacts the DUT with an end thereof; the signal conducting circuit has a first resistance, and electrically connects the tester and the other end of one of the signal pin to transmit the test signals to the DUT; the power conducting circuit has a second resistance which is much less than the first resistance, and electrically connects the tester and the other end of one of the signal pin which is not connected with the signal conducting circuit to transmit the power signals to the DUT.Type: ApplicationFiled: November 11, 2013Publication date: August 21, 2014Applicant: MPI CORPORATIONInventors: Wei-Cheng KU, Jun-Liang LAI
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Publication number: 20140176177Abstract: A probe card which is capable of transmitting high-frequency signals provided by a DUT, and the DUT includes an output pin group and an input pin group for sending and receiving the high-frequency signals respectively. The probe card includes a first signal pin group, a second signal pin group, and a multiband circuit. The first signal pin group is made of a conductive material, and is used to contact the output pin group; the second signal pin group is made of a conductive material too, and is used to contact the input pin group; the multiband circuit is electrically connected to the first signal pin group and the second signal pin group to allow signals within a first bandwidth and a second bandwidth to pass therethrough.Type: ApplicationFiled: December 24, 2013Publication date: June 26, 2014Inventors: Wei-Cheng Ku, JUN-LIANG LAI
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Publication number: 20140103948Abstract: A probe card having a configurable structure for exchanging/swapping electronic components for impedance matching is provided. In the probe card, an applied force is exerted on the electronic component so as to make the electronic component electrically connected with at least one conductive contact pad of a supporting unit. The supporting unit is a circuit board or a space transformer. In order to facilitate the exchange or swap of the electronic component, the applied force can be removed. The probe card includes a pressing plate which can be moved between a pressing position and a non-pressing position. The pressing plate has a pressing surface which is contacted with the top end of the electronic component while the pressing plate is in the pressing position. Therefore, the applied force can be generated or removed by changing the positioning of the pressing plate.Type: ApplicationFiled: December 18, 2013Publication date: April 17, 2014Applicant: MPI CORPORATIONInventors: Chao-Ching Huang, Chih-Hao Ho, Wei-Cheng Ku
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Patent number: 8648739Abstract: A transmission interface includes a first pin, a second pin, a conversion unit, and a decoding unit. The conversion unit receives a serial input data stream via the first pin and receives a serial clock via the second pin. The conversion unit converts the serial input data stream to parallel input data and converts the serial clock to a parallel clock. The serial input data stream has a full swing form. The decoding unit receives and decodes the parallel input data and generates an input data signal according to the decoded parallel input data.Type: GrantFiled: August 12, 2010Date of Patent: February 11, 2014Assignee: Mediatek Inc.Inventors: Wei-Cheng Ku, Chung-Hung Tsai, Chun-Nan Li, Yi-Hsi Chen
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Patent number: 8638116Abstract: A probe card having a configurable structure for exchanging/swapping electronic components for impedance matching and an impedance method therefore are provided. In the probe card, an applied force is exerted on the electronic component so as to make the electronic component electrically connected with at least one conductive contact pad of a supporting unit. The supporting unit is a circuit board or a space transformer. In order to facilitate the exchange or swap of the electronic component, the applied force can be removed. The probe card includes a pressing plate which can be moved between a pressing position and a non-pressing position. The pressing plate has a pressing surface which is contacted with the top end of the electronic component while the pressing plate is in the pressing position. Therefore, the applied force can be generated or removed by changing the positioning of the pressing plate.Type: GrantFiled: March 10, 2011Date of Patent: January 28, 2014Assignee: MPI CorporationInventors: Chao-Ching Huang, Chih-Hao Ho, Wei-Cheng Ku
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Patent number: 8542027Abstract: A probe card is provided. The probe card can serialize, analogize and divide a digital signal by a analog-to-digital converter (ADC), a digital-to-analog converter (DAC), and a power divided unit respectively. The probe card can increase signal channels, and is not restricted by signal channels of a tester to test more DUTs simultaneously. Moreover, the probe card has fine impedance matching and channels separating to raise testing efficiency and reduce signal loss.Type: GrantFiled: March 17, 2010Date of Patent: September 24, 2013Assignee: MPI CorporationInventors: Young-Huang Chou, Wei-Cheng Ku, Wen-Pin Su, Jun-Liang Lai, Chao-Ping Hsieh, Ping-Hsiao Liao
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Publication number: 20130021053Abstract: A probe card for high-frequency signal transmission includes a circuit board with transmission lines, a plurality of probes, and a signal path adjuster having first lead wires with a same length respectively connected between the transmission lines and the probes. Each first lead wire is selectively replaceable by a second lead having a length different from that of the first lead wire. As a result, a first high-frequency signal transmitting from one transmission line through the associated first lead wire to the associated probe and a second high-frequency signal transmitting from another transmission line through the associated second lead wire to the associated probe may have a same output timing when the first and second high-frequency signals are synchronously inputted into the circuit board.Type: ApplicationFiled: July 20, 2012Publication date: January 24, 2013Inventors: Wei-Cheng KU, Chih-Hao Ho, Chen-Kuo Kao, Chao-Ping Hsieh
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Publication number: 20120274347Abstract: An integrated high-speed probe system is provided. The integrated high-speed probe system includes a circuit substrate for transmitting low-frequency testing signals from a tester through a first probe of the probe assembly to a DUT, and a high-speed substrate for transmitting high-frequency testing signals from the tester to the DUT. The high-speed substrate extends from the upper surface of the circuit substrate in the testing area to the lower surface of the circuit substrate in the probe area for being adjacent to the probe assembly and electrically connecting the second probe. In this way, the tester can transmit testing signals of different frequencies through the integrated high-speed probe system.Type: ApplicationFiled: April 18, 2012Publication date: November 1, 2012Inventors: Chun-Chi Wang, Chia-Tai Chang, Ya-Yun Cheng, Wei-Cheng Ku, Chao-Ping Hsieh
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Publication number: 20120242360Abstract: Method for transmitting a high-frequency signal by a coupling effect includes receiving a high-frequency signal by a high-frequency circuit and coupling the high-frequency signal to a coupling circuit by the coupling effect to output a high-frequency coupled signal, and adjusting a filter between the coupling circuit and the high-frequency circuit formed by the coupling effect for adjusting transmission frequency of the high-frequency coupled signal; upon when the high-frequency circuit includes a high-frequency metal probe, the coupling circuit comprises a coupling transmission wire. Meanwhile, upon when the high-frequency circuit includes the coupling transmission wire, the coupling circuit includes the high-frequency metal probe.Type: ApplicationFiled: March 20, 2012Publication date: September 27, 2012Inventors: Keng-Yi Huang, Chao-Ping Hsieh, Wei-Cheng Ku, Chih-Hao Ho
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Publication number: 20120038497Abstract: A transmission interface includes a first pin, a second pin, a conversion unit, and a decoding unit. The conversion unit receives a serial input data stream via the first pin and receives a serial clock via the second pin. The conversion unit converts the serial input data stream to parallel input data and converts the serial clock to a parallel clock. The serial input data stream has a full swing form. The decoding unit receives and decodes the parallel input data and generates an input data signal according to the decoded parallel input data.Type: ApplicationFiled: August 12, 2010Publication date: February 16, 2012Applicant: MEDIATEK INC.Inventors: Wei-Cheng Ku, Chung-Hung Tsai, Chun-Nan Li, Yi-Hsi Chen
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Patent number: 8106673Abstract: A probe for high frequency signal transmission includes a metal pin, and a metal line spacedly arranged on and electrically insulated from the metal pin and electrically connected to grounding potential so as to maintain the characteristic impedance of the probe upon transmitting high frequency signal. The maximum diameter of the probe is substantially equal to or smaller than two times of the diameter of the metal pin. Under this circumstance, a big amount of probes can be installed in a probe card for probing a big amount of electronic devices, so that a wafer-level electronic test can be achieved efficiently and rapidly.Type: GrantFiled: May 26, 2010Date of Patent: January 31, 2012Assignee: MPI CorporationInventors: Wei-Cheng Ku, Chih-Hao Ho, Chia-Tai Chang, Ho-Hui Lin, Chien-Ho Lin
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Publication number: 20110221462Abstract: A probe card having a configurable structure for exchanging/swapping electronic components for impedance matching and an impedance method therefore are provided. In the probe card, an applied force is exerted on the electronic component so as to make the electronic component electrically connected with at least one conductive contact pad of a supporting unit. The supporting unit is a circuit board or a space transformer. In order to facilitate the exchange or swap of the electronic component, the applied force can be removed. The probe card includes a pressing plate which can be moved between a pressing position and a non-pressing position. The pressing plate has a pressing surface which is contacted with the top end of the electronic component while the pressing plate is in the pressing position. Therefore, the applied force can be generated or removed by changing the positioning of the pressing plate.Type: ApplicationFiled: March 10, 2011Publication date: September 15, 2011Inventors: Chao-Ching Huang, Chih-Hao Ho, Wei-Cheng Ku
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Publication number: 20110095778Abstract: A probe card is provided. The probe card detaches or separates a probe assembly and a test signal generator which generates test signals from the tester and the printed circuit board, so as to form a probe system module. The probe system module is secured into a probe card module by one or more securing unit. The probe card module includes the printed circuit board. Control signals from the tester are wirelessly transmitted to the probe system module and drive the probe system module to generate the corresponding test signals. Therefore, the loss or distortion of the test signals due to having longer transmitting distances will be reduced and thus the test quality can be improved.Type: ApplicationFiled: October 26, 2010Publication date: April 28, 2011Inventors: Young Huang CHOU, Wei Cheng Ku
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Publication number: 20100253378Abstract: A probe for high frequency signal transmission includes a metal pin, and a metal line spacedly arranged on and electrically insulated from the metal pin and electrically connected to grounding potential so as to maintain the characteristic impedance of the probe upon transmitting high frequency signal. The maximum diameter of the probe is substantially equal to or smaller than two times of the diameter of the metal pin. Under this circumstance, a big amount of probes can be installed in a probe card for probing a big amount of electronic devices, so that a wafer-level electronic test can be achieved efficiently and rapidly.Type: ApplicationFiled: May 26, 2010Publication date: October 7, 2010Applicant: MPI CORPORATIONInventors: Wei-Cheng Ku, Chih-Hao Ho, Chia-Tai Chang, Ho-Hui Lin, Chien-Ho Lin
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Publication number: 20100237886Abstract: A probe card is provided. The probe card can serialize, analogise and divide a digital signal by a parallel-to-serial converter, a parallel-to-serial converter, and a power divided unit respectively. The probe card can increase signal channels, and is not restricted by signal channels of a tester to test more DUTs simultaneously. Moreover, the probe card has fine impedance matching and channels separating to raise testing efficiency and reduce signal loss.Type: ApplicationFiled: March 17, 2010Publication date: September 23, 2010Applicant: MPI CORPORATIONInventors: Young Huang Chou, Wei Cheng Ku, Wen Pin Su, Jun Liang Lai, Chao Ping Hsieh, Ping Hsiao Liao
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Patent number: 7791359Abstract: A probe for high frequency signal transmission includes a metal pin, and a metal line spacedly arranged on and electrically insulated from the metal pin and electrically connected to grounding potential so as to maintain the characteristic impedance of the probe upon transmitting high frequency signal. The maximum diameter of the probe is substantially equal to or smaller than two times of the diameter of the metal pin. Under this circumstance, a big amount of probes can be installed in a probe card for probing a big amount of electronic devices, so that a wafer-level electronic test can be achieved efficiently and rapidly.Type: GrantFiled: January 8, 2008Date of Patent: September 7, 2010Assignee: MPI CorporationInventors: Wei-Cheng Ku, Chih-Hao Ho, Chia-Tai Chang, Ho-Hui Lin, Chien-Ho Lin
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Patent number: 7782070Abstract: A probing device includes a rack that has an outer support member supporting a circuit layer and a center support member supporting a probe assembly. When the tester touching down the circuit layer of the probing device from the top side, the outer support member of the rack bears this touchdown stress. When the probes of the probe holder touching down the electronic components of an IC wafer under test, the center support member of the rack bears the reaction force from the IC wafer.Type: GrantFiled: June 4, 2008Date of Patent: August 24, 2010Assignee: MJC Probe IncorporatedInventors: Wei-Cheng Ku, Chih-Hao Ho, Ho-Hui Lin, Te-Chen Feng, Jun-Liang Lai, Jia-Chi Ho, Chih-Chung Chien, Chien-Huei Huang, Ai-Chuan Chang, Horng-Chuan Sun
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Patent number: 7724009Abstract: A high frequency probe preparation method for making a high frequency probe for high frequency testing to assure signal integrity by means of making a sleeve assembly subject to the size of a predetermined bare needle and then sleeving bare needle by the sleeve assembly to form a high-frequency probe is disclosed to include the steps of: a) providing an insulated tube, and b) forming a conducting layer on the outer surface of the insulated tube which having a metal layer for grounding. The insulated tube and the conducting layer constitute the sleeve assembly. The metal layer is formed by means of physical deposition, chemical deposition, mixture of physical and chemical deposition or electrochemical deposition.Type: GrantFiled: May 1, 2009Date of Patent: May 25, 2010Assignee: MPI CorporationInventors: Wei-Cheng Ku, Kuan-Chun Chou
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Patent number: 7683645Abstract: A high-frequency probe card includes a circuit board having signal circuits and grounding circuits, transmission lines each having a bi-wire structure including a first lead wire for transmitting high-frequency signal and a second lead wire connected to the grounding circuits, and signal probes. High-frequency test signal provided by a test machine to the signal circuits can be transmitted to the signal probes through the first lead wires. Since the grounding circuits and second lead wires are provided adjacent to the signal circuits and first lead wires respectively, the high-frequency signal can be efficiently transmitted and the characteristic impedance matching can be maintained during high-frequency signal transmission. The bi-wire structure of the transmission lines has a diameter equal to or less than 1 millimeter, thereby allowing installation of a big number of the transmission lines such that the high-frequency test for a big number of electronic elements can be realized.Type: GrantFiled: October 20, 2006Date of Patent: March 23, 2010Assignee: MPI CorporationInventors: Wei-Cheng Ku, Hsin-Hung Lin, Chih-Hao Ho, Te-Chen Feng