Patents by Inventor Wei-Chih Lin

Wei-Chih Lin has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20100120271
    Abstract: An IC socket, adapted for electrically connecting an IC package to a printed circuit board, comprises a main body defining a plurality of passageways and a plurality of contacts received in the passageways of the main body. Each contact has a base portion, a first contacting portion and a second contacting portion extending upwardly from the base portion. The first contacting portion and the second contacting portion each is formed with a contacting end to cooperatively clamp a guiding trace of the IC package. The contacting end of the second contacting portion defines a recess to receive the contacting end of the first contacting portion when the IC package is disassembled to the main body.
    Type: Application
    Filed: November 10, 2009
    Publication date: May 13, 2010
    Applicant: HON HAI PRECISION INDUSTRY CO., LTD.
    Inventor: WEI-CHIH LIN
  • Publication number: 20100120269
    Abstract: A socket adapted for electrically connecting a semiconductor package to a printed circuit board, includes a main body defining a number of contact passageways and a plurality of contacts received in the contact passageways of the main body. Each contact has a base portion, a first contacting portion and a second contacting portion upwardly extending from the base portion, and a spring arm bent from a bottom edge of the base portion. The spring arm extends substantially in a horizontal direction and is bent downwardly at a free end thereof to form a tail. The spring arm can deform to provide an elastic force for the tail to press against the printed circuit board.
    Type: Application
    Filed: August 6, 2009
    Publication date: May 13, 2010
    Applicant: HON HAI PRECISION INDUSTRY CO., LTD.
    Inventors: SHIH-WEI HSIAO, WEI-CHIH LIN
  • Publication number: 20100041254
    Abstract: A socket adapted for interconnecting an IC package (3), such as TSOP (Thin Small Outline Package), and a circuit board, includes a socket body (1), a plurality of contacts (2) received in the socket body, and an operating member (5) movable mounted on the socket body. Each contact includes a base portion (21) retained into the slot of the socket body and a first and a second contact beams (24, 25), each extending upwardly from an upper edge of the base portion. When a force is applied on the operating member, both of the first and the second contact beams cooperated with the operating member and moving away from its original position.
    Type: Application
    Filed: August 18, 2009
    Publication date: February 18, 2010
    Applicant: HON HAI PRECISION INDUSTRY CO., LTD.
    Inventors: Hsiu-Yuan Hsu, Wei-Chih Lin
  • Patent number: 7654830
    Abstract: An IC socket includes a socket body defining a first receiving cavity with a bottom wall, a cover attached pivotally on one end of the socket body and a locking member for locking the cover to the socket body. The IC socket further includes four detachable aligning elements mounted on four corners of the bottom wall. The four aligning elements have a plurality of positioning surfaces adapted for corporately defining a second receiving cavity for snugly accommodating an IC package therein. Different aligning elements with different dimensions can be replaced to mount on the socket body for different IC packages, thus a cost of manufacturing is reduced.
    Type: Grant
    Filed: March 31, 2009
    Date of Patent: February 2, 2010
    Assignee: Hon Hai Precision Ind. Co., Ltd.
    Inventor: Wei-Chih Lin
  • Publication number: 20100015821
    Abstract: A socket (100) comprises an insulative housing (1) with a number of passageways (13) thereon. A number of contacts are received in the passageways. A cover lid (3) rotationally is assembled to the housing to be in an open position or a closed position. The cover lid comprises a latch member (31) integrally molded thereon to reduce the component of the socket, and the insulative housing forms a step portion (15) for mating with the latch member to keep the cover lid in the closed position.
    Type: Application
    Filed: July 21, 2009
    Publication date: January 21, 2010
    Applicant: HON HAI PRECISION INDUSTRY CO., LTD.
    Inventors: HSIU-YUAN HSU, WEI-CHIH LIN
  • Publication number: 20100009558
    Abstract: An electrical connector (1) for receiving an IC package includes a socket body (2) with a plurality of contacts (4) therein. A cover (3) is pivotally mounted with respect to the socket body (2) and defines an inner side close to the socket body (2) and an outer side opposite to the socket body (2). A heat sink (5) is provided to be mounted with the cover (3) by a plurality of fasteners (6). The fasteners (6) are inserted into the cover (3) and the heat sink (6) from the inner side of the cover (3).
    Type: Application
    Filed: July 14, 2009
    Publication date: January 14, 2010
    Applicant: HON HAI PRECISION INDUSTRY CO., LTD.
    Inventors: Wei-Chih Lin, Wen-Yi Hsieh
  • Publication number: 20090325413
    Abstract: A burn-in socket includes a base, a plurality of terminals received in the base, a self-centering supporting bracket mounted above the base in a floating manner and a plurality of elastic elements mounted between the base and the supporting bracket. The supporting bracket defines a receiving cavity for receiving an IC package, and the receiving cavity has a number of oblique surfaces for leading and supporting the IC package so as to precisely position the IC package in the burn-in socket.
    Type: Application
    Filed: June 30, 2009
    Publication date: December 31, 2009
    Applicant: HON HAI PRECISION INDUSTRY CO., LTD.
    Inventor: WEI-CHIH LIN
  • Publication number: 20090317988
    Abstract: A burn-in socket for receiving an IC package comprises a base defining a cavity for receiving the IC package and an adapter retained in the cavity. The adapter has two-pieces configuration and comprises a loading board for loading the IC package and a positioning board assembled upon the bottom plate of the loading board for positioning the IC package.
    Type: Application
    Filed: June 23, 2009
    Publication date: December 24, 2009
    Applicant: HON HAI PRECISION INDUSTRY CO., LTD.
    Inventor: WEI-CHIH LIN
  • Publication number: 20090291582
    Abstract: A burn-in includes a base, a number of contacts received in the base, and a cover pivotally mounted to the base and rotatably moving between an open position and a closed position. The base defines a receiving space and a plurality of recesses adjacent to and communicating with the receiving space. Two hard stoppers are mounted to the recesses of the base and support upwardly the cover.
    Type: Application
    Filed: May 26, 2009
    Publication date: November 26, 2009
    Applicant: HON HAI PRECISION INDUSTRY CO., LTD.
    Inventor: WEI-CHIH LIN
  • Publication number: 20090246982
    Abstract: An IC socket includes a socket body defining a first receiving cavity with a bottom wall, a cover attached pivotally on one end of the socket body and a locking member for locking the cover to the socket body. The IC socket further includes four detachable aligning elements mounted on four corners of the bottom wall. The four aligning elements have a plurality of positioning surfaces adapted for corporately defining a second receiving cavity for snugly accommodating an IC package therein. Different aligning elements with different dimensions can be replaced to mount on the socket body for different IC packages, thus a cost of manufacturing is reduced.
    Type: Application
    Filed: March 31, 2009
    Publication date: October 1, 2009
    Inventor: Wei-Chih Lin
  • Patent number: 7568646
    Abstract: A food processor comprises a body provided therein with an operating motor, a cutting seat, and an upper cover. The cutting seat is disposed within a space formed above the body and is linked with the operating motor, so that the cutting seat and the operating motor are rotated simultaneously. The upper cover is mounted on an upper end of the body and is provided with an introduced pipe extending downwardly from its surface. The introduced pipe includes a first introduced passageway and a second introduced passageway, which are interconnected with each other. Vegetables, fruit, or other food is introduced into a material inlet of the two passageways and pushed tightly with a material-pushing plunger to render the vegetables, fruit, or other food cut by the cutting seat at a material outlet at the bottom of the introduced pipe.
    Type: Grant
    Filed: April 6, 2007
    Date of Patent: August 4, 2009
    Inventor: Wei-Chih Lin
  • Patent number: 7540745
    Abstract: A burn-in socket for receiving an IC package (2) is provided. The burn-in socket includes a socket body with a plurality of contacts (7) disposed therein and a cover (6) rotatablely coupled to the socket body. The socket body defines a receiving space (500) for receiving the IC package (2) to be tested therein. The cover (6) has a pushing portion (611) capable of pressing on the IC package (2) toward the socket body when the cover (6) is turned to a closed position. At least one pair of pick-up arrangements (8) are provided around the pushing portion (611) for automatic pick-up of the IC package (2).
    Type: Grant
    Filed: May 28, 2008
    Date of Patent: June 2, 2009
    Assignee: Hon Hai Precision Ind. Co., Ltd.
    Inventor: Wei-Chih Lin
  • Publication number: 20090104807
    Abstract: A test socket comprising an insulative base with a plurality of contacts received in the base and a cover pivotally mounted to one end of the base. The cover comprises a pusher with an opening extending therethrough and a lid aligned with the pusher. The lid has a through hole corresponding to the opening of the pusher. Between the pusher and the lid have a plurality of elastic members for making the lid moveably with respect to the pusher.
    Type: Application
    Filed: October 21, 2008
    Publication date: April 23, 2009
    Inventors: Wei-Chih Lin, Hsiu-Yuan Hsu, Wen-Yi Hsieh
  • Publication number: 20090028013
    Abstract: A method for calibrating an SA compensation level of an optical drive is provided. The method includes steps of providing a plurality of SA compensation levels; obtaining a peak-to-peak value of an S curve corresponding to each of the SA compensation levels; selecting a maximum of the peak-to-peak values of the S curves and the SA compensation level corresponding to the maximum; and setting the selected SA compensation level to be an optimal SA compensation level.
    Type: Application
    Filed: July 24, 2008
    Publication date: January 29, 2009
    Applicant: LITE-ON IT CORPORATION
    Inventor: WEI CHIH LIN
  • Publication number: 20080299793
    Abstract: A burn-in socket for receiving an IC package (2) is provided. The burn-in socket includes a socket body with a plurality of contacts (7) disposed therein and a cover (6) rotatablely coupled to the socket body. The socket body defines a receiving space (500) for receiving the IC package (2) to be tested therein. The cover (6) has a pushing portion (611) capable of pressing on the IC package (2) toward the socket body when the cover (6) is turned to a closed position. At least one pair of pick-up arrangements (8) are provided around the pushing portion (611) for automatic pick-up of the IC package (2).
    Type: Application
    Filed: May 28, 2008
    Publication date: December 4, 2008
    Inventor: Wei-Chih Lin
  • Publication number: 20080245202
    Abstract: A food processor comprises a body provided therein with an operating motor, a cutting seat, and an upper cover. The cutting seat is disposed within a space formed above the body and is linked with the operating motor, so that the cutting seat and the operating motor are rotated simultaneously. The upper cover is mounted on an upper end of the body and is provided with an introduced pipe extending downwardly from its surface. The introduced pipe includes a first introduced passageway and a second introduced passageway, which are interconnected with each other. Vegetables, fruit, or other food is introduced into a material inlet of the two passageways and pushed tightly with a material-pushing plunger to render the vegetables, fruit, or other food cut by the cutting seat at a material outlet at the bottom of the introduced pipe.
    Type: Application
    Filed: April 6, 2007
    Publication date: October 9, 2008
    Inventor: Wei-Chih Lin
  • Publication number: 20080211381
    Abstract: An apparatus of light source includes a cathode structure, an anode structure, a fluorescent layer, a secondary electron generating layer, and a low-pressure gas layer. The fluorescent layer is located between the cathode structure and the anode structure. The low-pressure gas layer is filled between the cathode structure and the anode structure. The secondary electron generating layer is located on the cathode structure. The secondary electron generating layer can generate additional secondary electrons to hit the fluorescent layer for improving the performance of the light source.
    Type: Application
    Filed: May 11, 2007
    Publication date: September 4, 2008
    Applicant: INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE
    Inventors: Yi-Ping Lin, Jung-Yu Li, Shih-Pu Chen, Wei-Chih Lin, Lian-Yi Cho
  • Publication number: 20080211377
    Abstract: A light source apparatus applicable to a backlight module includes a cathode structure, an anode structure, a fluorescent layer, a secondary electron generation layer, and a low-pressure gas layer. The fluorescent layer is located between the cathode structure and the anode structure. The low-pressure gas layer is filled between the cathode structure and the anode structure. The secondary electron generation layer is disposed on the cathode structure and can generate additional secondary electrons to hit the fluorescent layer for improving the luminous efficiency.
    Type: Application
    Filed: February 29, 2008
    Publication date: September 4, 2008
    Applicant: INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE
    Inventors: Yi-Ping Lin, Jung-Yu Li, Shih-Pu Chen, Wei-Chih Lin, Lian-Yi Cho
  • Publication number: 20080175107
    Abstract: An optical reading/writing apparatus has an optical head that includes a collimator and a lens. For focusing control, a startup procedure is executed to generate a first startup S-curve. A boundary is then set according to the startup S-curve. After executing focusing on and tracking on, a plurality of position combinations of the collimator and the lens are selected for focusing calibration, thereby obtaining respective focusing error signals. By comparing the focusing error signals with the boundary, whether the position combinations of the selected collimator and the lens are valid can be determined. One of the valid position combinations with the greatest image-quality value is then selected to read/write the optical disc in the subsequent reading/writing procedure.
    Type: Application
    Filed: January 19, 2007
    Publication date: July 24, 2008
    Applicant: PHILIPS & BENQ DIGITAL STORAGE CORPORATION
    Inventors: Maarten Kuijper, Stefan Geusens, Wei-Chih Lin
  • Publication number: 20080157652
    Abstract: A pixel structure of display apparatus includes a first substrate and a second substrate. Several cathode structure layers are disposed on the first substrate. The second substrate is a light-transmissive material. Several anode structure layers are disposed on the second substrate, and are light-transmissive conductive materials. The first substrate faces to the second substrate, so that the cathode structure layers are respectively aligned with the anode structure layers. A separation structure is disposed between the first substrate and the second substrate, for respective partitioning the anode structure layers and the cathode structure layers to form several spaces. Several fluorescent layers are respectively disposed between the anode structure layers and the cathode structure layers. A low-pressure gas is respectively filled into the spaces.
    Type: Application
    Filed: December 18, 2007
    Publication date: July 3, 2008
    Applicant: INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE
    Inventors: Jung-Yu Li, Shih-Pu Chen, Yi-Ping Lin, Wei-Chih Lin, Lian-Yi Cho