Patents by Inventor Wei Lu

Wei Lu has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 10964609
    Abstract: An apparatus for detecting an endpoint of a grinding process includes a connecting device, a timer and a controller. The connecting device is connected to a sensor that periodically senses an interface of a reconstructed wafer comprising a plurality of dies of at least two types to generate a thickness signal comprising thicknesses from a surface of an insulating layer of the reconstructed wafer to the interface of the reconstructed wafer. The timer is configured to generate a clock signal having a plurality of pulses with a time interval. The controller is coupled to the sensor and the timer, and configured to filter the thickness signal according to the clock signal to output a thickness extremum among the thicknesses in the thickness signal within each time interval, wherein the thickness signal after the filtering is used to determine the endpoint of the grinding process being performed on the reconstructed wafer.
    Type: Grant
    Filed: May 23, 2019
    Date of Patent: March 30, 2021
    Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Yi-Chao Mao, Chin-Chuan Chang, Szu-Wei Lu
  • Patent number: 10964744
    Abstract: Light control for improved near infrared sensitivity and channel separation for an image sensor. In one embodiment, an image sensor includes: a plurality of photodiodes arranged in rows and columns of a pixel array; and a light filter layer having a plurality of light filters configured over the plurality of photodiodes. The light filter layer has a first side facing the plurality of photodiodes and a second side facing away from the first side. The image sensor also includes a color filter layer having a plurality of color filters configured over the plurality of photodiodes. The color filter layer has a first surface facing the second side of the light filter layer and a second surface facing away from the first layer. Individual micro-lenses are configured to direct incoming light through corresponding light filter and color filter onto the respective photodiode.
    Type: Grant
    Filed: September 13, 2019
    Date of Patent: March 30, 2021
    Assignee: OmniVision Technologies, Inc.
    Inventors: Cheng Zhao, Chen-Wei Lu, Cunyu Yang, Ping-Hsu Chen, Zhiqiang Lin, Chengming Liu
  • Patent number: 10965560
    Abstract: Examples relate to organizing and storing network communications. In one example, a programmable hardware processor may: receive a first set of network packets; identify, for each network packet included in the first set, a network flow, each network flow including at least one related packet; store each network packet included in a subset of the first set in a first data storage device; for each network packet included in the subset, organize the network packet according to the network flow identified for the network packet; identify, from the network flows, a set of network flows that each have at least one characteristic of interest; and store, in a second data storage device, each network packet included in each network flow of the set of network flows.
    Type: Grant
    Filed: February 18, 2020
    Date of Patent: March 30, 2021
    Assignee: Trend Micro Incorporated
    Inventors: Wei Lu, Leslie Zsohar, Edward A. Wartha, Randal Mullin, Craig Botkin
  • Patent number: 10964888
    Abstract: The present disclosure describes a method utilizing an ion beam etch process, instead of a RIE etch process, to form magnetic tunnel junction (MTJ) structures. For example, the method includes forming MTJ structure layers on an interconnect layer, where the interconnect layer includes a first area and a second area. The method further includes depositing a mask layer over the MTJ structure layers in the first area and forming masking structures over the MTJ structure layers in the second area. The method also includes etching with an ion beam etch process, the MTJ structure layers between the masking structures to form MTJ structures over vias in the second area of the interconnect layer; and removing, with the ion beam etch process, the mask layer, the top electrode, the MTJ stack, and a portion of the bottom electrode in the first area of the interconnect layer.
    Type: Grant
    Filed: April 3, 2020
    Date of Patent: March 30, 2021
    Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.
    Inventors: Pin-Ren Dai, Chung-Ju Lee, Chung-Te Lin, Chih-Wei Lu, Hsi-Wen Tien, Tai-Yen Peng, Chien-Min Lee, Wei-Hao Liao
  • Patent number: 10960006
    Abstract: A topical formulation comprising (a) a therapeutically effective amount of tofacitinib; (b) at least one solvent; and (c) optionally one or more other pharmaceutically acceptable excipients is provided. Also provided is a method for treating and/or preventing autoimmune diseases in a subject administering said topical formulation.
    Type: Grant
    Filed: January 22, 2019
    Date of Patent: March 30, 2021
    Assignee: TWi Pharmaceuticals, Inc.
    Inventors: Chih-Ming Chen, Guang-Wei Lu, Ling-Ying Liaw, Fan-Lun Liu, Shih-Fen Liao, Chou-Hsiung Chen, Yu-Han Kao, Yu-Yin Chen
  • Patent number: 10965600
    Abstract: Examples of implementations relate to metadata extraction. For example, a system of privacy preservation comprises a physical processor that executes machine-readable instructions that cause the system to normalize a network traffic payload with a hardware-based normalization engine controlled by a microcode program; parse the normalized network traffic payload, as the network traffic payload passes through a network, by performing a parsing operation of a portion of the normalized network traffic payload with a hardware-based function engine of a plurality of parallel-distributed hardware-based function engines controlled by the microcode program; and provide the hardware-based function engine with a different portion of the normalized network traffic payload responsive to an indication, communicated through a common status interface, that the different portion of the normalized network traffic payload is needed to complete the parsing operation.
    Type: Grant
    Filed: April 29, 2020
    Date of Patent: March 30, 2021
    Assignee: Trend Micro Incorporated
    Inventors: Leslie Zsohar, Wei Lu, Randal Mullin, Craig Botkin
  • Publication number: 20210090899
    Abstract: A semiconductor structure includes a conductive feature disposed over a semiconductor substrate, a via disposed in a first interlayer dielectric (ILD) layer over the conductive feature, and a metal-containing etch-stop layer (ESL) disposed on the via, where the metal-containing ESL includes a first metal and is resistant to etching by a fluorine-containing etchant. The semiconductor structure further includes a conductive line disposed over the metal-containing ESL, where the conductive line includes a second metal different from the first metal and is etchable by the fluorine-containing etchant, and where the via is configured to interconnect the conductive line to the conductive feature. Furthermore, the semiconductor structure includes a second ILD layer disposed over the first ILD layer.
    Type: Application
    Filed: September 25, 2019
    Publication date: March 25, 2021
    Inventors: Wei-Hao Liao, Hsi-Wen Tien, Chih Wei Lu, Pin-Ren Dai, Chung-Ju Lee
  • Publication number: 20210091614
    Abstract: A brushless motor includes a stator and a rotor installed in the stator. The stator includes a front insulating frame and a rear insulating frame. The rotor includes a rotating shaft, a front bearing, a rear bearing, a front-end cover and a rear-end cover. The front-end cover is located on the front side of the rotor and installed on the front bearing. The rear-end cover is located on the rear side of the rotor and is installed on the rear bearing and abuts against the rear insulating frame. The front side of the front insulating frame is provided with multiple first snap parts. The front-end cover is provided with multiple second snap parts in the circumference. The first snap parts are snap-fitted with the second snap parts.
    Type: Application
    Filed: December 9, 2020
    Publication date: March 25, 2021
    Inventors: Masatoshi Fukinuki, Yasheng Chen, Wei Lu
  • Publication number: 20210092782
    Abstract: A communications method and apparatus, the method including receiving, by a policy control network element, from a first session management network element, a policy request message, sending, by the policy control network element, to the first session management network element, according to the policy request message, policy information, where the policy information comprises a data network access identifier (DNAI), and establishing, by the first session management network element, according to the DNAI, a first user plane network element for a first protocol data unit (PDU) session for a terminal device.
    Type: Application
    Filed: December 2, 2020
    Publication date: March 25, 2021
    Inventor: Wei Lu
  • Publication number: 20210091005
    Abstract: A semiconductor package includes a first semiconductor die, a second semiconductor die, a semiconductor bridge, an integrated passive device, a first redistribution layer, and connective terminals. The second semiconductor die is disposed beside the first semiconductor die. The semiconductor bridge electrically connects the first semiconductor die with the second semiconductor die. The integrated passive device is electrically connected to the first semiconductor die. The first redistribution layer is disposed over the semiconductor bridge. The connective terminals are disposed on the first redistribution layer, on an opposite side with respect to the semiconductor bridge. The first redistribution layer is interposed between the integrated passive device and the connective terminals.
    Type: Application
    Filed: March 2, 2020
    Publication date: March 25, 2021
    Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.
    Inventors: Chen-Hsuan Tsai, Chin-Chuan Chang, Szu-Wei Lu, Tsung-Fu Tsai
  • Publication number: 20210085669
    Abstract: Methods of treating patients diagnosed with AML or MDS harboring mutant IDH-1 include detecting an IDH1 mutation and the therapeutic administration of an inhibitor of a mutant IDH-1 as a single agent, or in combination with azacitidine (AZA) or cytarabine.
    Type: Application
    Filed: December 4, 2020
    Publication date: March 25, 2021
    Inventors: Patrick F. Kelly, Alan Collis, Jeff Davis, Duncan Walker, Susan Ashwell, Blythe Thomson, Wei Lu
  • Patent number: 10957616
    Abstract: In an embodiment, a device includes: a substrate having a first side and a second side opposite the first side; an interconnect structure adjacent the first side of the substrate; and an integrated circuit device attached to the interconnect structure; a through via extending from the first side of the substrate to the second side of the substrate, the through via being electrically connected to the integrated circuit device; an under bump metallurgy (UBM) adjacent the second side of the substrate and contacting the through via; a conductive bump on the UBM, the conductive bump and the UBM being a continuous conductive material, the conductive bump laterally offset from the through via; and an underfill surrounding the UBM and the conductive bump.
    Type: Grant
    Filed: September 30, 2019
    Date of Patent: March 23, 2021
    Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Jing-Cheng Lin, Szu-Wei Lu, Chen-Hua Yu
  • Publication number: 20210082990
    Abstract: Light control for improved near infrared sensitivity and channel separation for an image sensor. In one embodiment, an image sensor includes: a plurality of photodiodes arranged in rows and columns of a pixel array; and a light filter layer having a plurality of light filters configured over the plurality of photodiodes. The light filter layer has a first side facing the plurality of photodiodes and a second side facing away from the first side. The image sensor also includes a color filter layer having a plurality of color filters configured over the plurality of photodiodes. The color filter layer has a first surface facing the second side of the light filter layer and a second surface facing away from the first layer. Individual micro-lenses are configured to direct incoming light through corresponding light filter and color filter onto the respective photodiode.
    Type: Application
    Filed: September 13, 2019
    Publication date: March 18, 2021
    Inventors: Cheng Zhao, Chen-Wei Lu, Cunyu Yang, Ping-Hsu Chen, Zhiqiang Lin, Chengming Liu
  • Publication number: 20210082698
    Abstract: Semiconductor device and the manufacturing method thereof are disclosed herein. An exemplary method of forming a semiconductor device comprises receiving a structure including a substrate and a first hard mask over the substrate, the first hard mask having at least two separate portions; forming spacers along sidewalls of the at least two portions of the first hard mask with a space between the spacers; forming a second hard mask in the space; forming a first cut in the at least two portions of the first hard mask; forming a second cut in the second hard mask; and depositing a cut hard mask in the first cut and the second cut.
    Type: Application
    Filed: September 16, 2019
    Publication date: March 18, 2021
    Inventors: Hsi-Wen Tien, Wei-Hao Liao, Pin-Ren Dai, Chih Wei Lu, Chung-Ju Lee
  • Publication number: 20210082894
    Abstract: A package structure includes a circuit element, a first semiconductor die, a second semiconductor die, a heat dissipating element, and an insulating encapsulation. The first semiconductor die and the second semiconductor die are located on the circuit element. The heat dissipating element connects to the first semiconductor die, and the first semiconductor die is between the circuit element and the heat dissipating element, where a sum of a first thickness of the first semiconductor die and a third thickness of the heat dissipating element is substantially equal to a second thickness of the second semiconductor die. The insulating encapsulation encapsulates the first semiconductor die, the second semiconductor die and the heat dissipating element, wherein a surface of the heat dissipating element is substantially leveled with the insulating encapsulation.
    Type: Application
    Filed: September 17, 2019
    Publication date: March 18, 2021
    Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.
    Inventors: Weiming Chris Chen, Chi-Hsi Wu, Chih-Wei Wu, Kuo-Chiang Ting, Szu-Wei Lu, Shang-Yun Hou, Ying-Ching Shih, Hsien-Ju Tsou, Cheng-Chieh Li
  • Publication number: 20210082850
    Abstract: A semiconductor structure including an integrated circuit die and conductive bumps is provided. The integrated circuit die includes bump pads. The conductive bumps are disposed on the bump pads. Each of the conductive bumps includes a first pillar portion disposed on one of the bump pads and a second pillar portion disposed on the first pillar portion. The second pillar portion is electrically connected to one of the bump pads through the first pillar portion, wherein a first width of the first pillar portion is greater than a second width of the second pillar portion. A package structure including the above-mentioned semiconductor structure is also provided.
    Type: Application
    Filed: September 17, 2019
    Publication date: March 18, 2021
    Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.
    Inventors: Jung-Hua Chang, Szu-Wei Lu, Ying-Ching Shih
  • Publication number: 20210084107
    Abstract: This application relates to a data transmission method. The method includes a terminal device receives indication information from a policy control function (PCF) network element. The indication information indicates data network access identifier information corresponding to an application. The method also includes the terminal device determines, based on the indication information, a PDU session for transmitting data of the application.
    Type: Application
    Filed: November 30, 2020
    Publication date: March 18, 2021
    Inventors: Wei LU, Weisheng JIN
  • Publication number: 20210078973
    Abstract: The invention relates to inhibitors of mutant isocitrate dehydrogenase (mt-IDH) proteins with neomorphic activity useful in the treatment of cell-proliferation disorders and cancers, having the Formula: where A, U, W1, W2, W3, R1-R6, and R9 are described herein.
    Type: Application
    Filed: November 23, 2020
    Publication date: March 18, 2021
    Inventors: Jian Lin, Anna Ericsson, Ann-Marie Campbell, Gary Gustafson, Zhongguo Wang, R. Bruce Diebold, Susan Ashwell, David R. Lancia, JR., Justin Andrew Caravella, Wei Lu
  • Publication number: 20210082804
    Abstract: Interconnect structures and methods of forming the same are provided. An interconnect structure according to the present disclosure includes a conductive line feature over a substrate, a conductive etch stop layer over the conductive line feature, a contact via over the conductive etch stop layer, and a barrier layer disposed along a sidewall of the conductive line feature, a sidewall of the conductive etch stop layer, and a sidewall of the contact via.
    Type: Application
    Filed: September 17, 2019
    Publication date: March 18, 2021
    Inventors: Chieh-Han Wu, Cheng-Hsiung Tsai, Chih Wei Lu, Chung-Ju Lee
  • Publication number: 20210068551
    Abstract: A headrest angle adjuster includes a first fixing member, a second fixing member, a gear, a flexible member, a floating positioning member, and an engaging member. The gear is configured on the first fixing member which is hinged to the second fixing member; one end of the floating positioning member is movably sleeved on the gear, a driving hole is provided on the floating positioning member, a locking hole is provided on the first fixing member, the engaging member is located in the driving hole and the locking hole, and the floating positioning member swings and pushes the engaging member to move toward a narrower end of the locking hole, thereby guiding the engaging member to engage with the gear. The headrest can be positioned at any angle, and the adjustment is silent to improve user experience.
    Type: Application
    Filed: January 9, 2020
    Publication date: March 11, 2021
    Inventor: Wei Lu