Patents by Inventor WEI-NUNG HSU

WEI-NUNG HSU has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11420894
    Abstract: A brittle object cutting apparatus and the method thereof are disclosed. Wherein, the brittle object cutting apparatus comprises a first heating laser unit, a second heating laser unit, a scribing laser unit, two cooling units and a processing module. A heating laser from the heating laser units respectively located on opposite sides of a scribing laser from the scribing laser unit, and a coolant of the cooling unit followed behind the heating laser. In the moving process of the brittle object, the processing module controls the scribing laser for a scribing operation, and controls one of the heating lasers and the coolant form one of the cooling units to heat and cool the brittle object. As a result, the machining time of dicing the brittle objects may be effectively reduced.
    Type: Grant
    Filed: November 13, 2017
    Date of Patent: August 23, 2022
    Assignee: NANOPLUS LTD.
    Inventors: Hung-Tu Lu, Vladimir Kondratenko, Alexander Naumov, Chih-Peng Hsu, Wei-Nung Hsu
  • Patent number: 10245701
    Abstract: A 3D magnetorheological polishing device and a magnetorheological polishing fluid are provided. The 3D magnetorheological polishing device includes a container and a magnetic field generator. The container is disposed with an accommodation space to accommodate a polishing fluid and a workpiece that is to be polished. The container is disposed on the magnetic field generator and rotates synchronously with the magnetic field generator. The container and the magnetic field generator are capable of rotating in conjunction at a predetermined speed, such that the polishing efficiency is improved.
    Type: Grant
    Filed: April 26, 2017
    Date of Patent: April 2, 2019
    Assignee: Kunshan Nano New Material Technology Co., Ltd.
    Inventors: Hung-Tu Lu, Wu-Chu Shih, Wei-Nung Hsu, Dingai Xiang
  • Publication number: 20180200862
    Abstract: A 3D magnetorheological polishing device and a magnetorheological polishing fluid are provided. The 3D magnetorheological polishing device includes a container and a magnetic field generator. The container is disposed with an accommodation space to accommodate a polishing fluid and a workpiece that is to be polished. The container is disposed on the magnetic field generator and rotates synchronously with the magnetic field generator. The container and the magnetic field generator are capable of rotating in conjunction at a predetermined speed, such that the polishing efficiency is improved.
    Type: Application
    Filed: April 26, 2017
    Publication date: July 19, 2018
    Inventors: Hung-Tu Lu, Wu-Chu Shih, Wei-Nung Hsu, Dingai Xiang
  • Publication number: 20180065210
    Abstract: A brittle object cutting apparatus and the method thereof are disclosed. Wherein, the brittle object cutting apparatus comprises a first heating laser unit, a second heating laser unit, a scribing laser unit, two cooling units and a processing module. A heating laser from the heating laser units respectively located on opposite sides of a scribing laser from the scribing laser unit, and a coolant of the cooling unit followed behind the heating laser. In the moving process of the brittle object, the processing module controls the scribing laser for a scribing operation, and controls one of the heating lasers and the coolant form one of the cooling units to heat and cool the brittle object. As a result, the machining time of dicing the brittle objects may be effectively reduced.
    Type: Application
    Filed: November 13, 2017
    Publication date: March 8, 2018
    Inventors: Hung-Tu LU, Vladimir KONDRATENKO, Alexander NAUMOV, Chih-Peng HSU, Wei-Nung HSU
  • Publication number: 20170050285
    Abstract: A polishing system based on a non-Newtonian fluid and a polishing method thereof are provided. The polishing system includes a polishing device, a non-Newtonian fluid auxiliary device and a control device. The polishing device is able to move a work piece in a polishing container containing the non-Newtonian fluid with abrasives that cause the polishing action. The non-Newtonian fluid auxiliary device is able to manipulate the viscosity of the non-Newtonian fluid by varying the pressure, speed, vibration or ultrasonic frequency, which causes the abrasives to polish the work piece. The control device is used to optimize the polishing process by controlling how the polishing device moves the work piece inside the polishing container. In this way, by using the polishing method, the polishing system provided is able to polish a work piece with any three-dimensional shape.
    Type: Application
    Filed: August 17, 2016
    Publication date: February 23, 2017
    Inventors: HUNG-TU LU, WU-CHU SHIH, DINGAI XIANG, WEI-NUNG HSU
  • Publication number: 20160311060
    Abstract: A brittle object cutting apparatus and the method thereof are disclosed. Wherein, the brittle object cutting apparatus comprises a first heating laser unit, a second heating laser unit, a scribing laser unit, two cooling units and a processing module. A heating laser from the heating laser units respectively located on opposite sides of a scribing laser from the scribing laser unit, and a coolant of the cooling unit followed behind the heating laser. In the moving process of the brittle object, the processing module controls the scribing laser for a scribing operation, and controls one of the heating lasers and the coolant form one of the cooling units to heat and cool the brittle object. As a result, the machining time of dicing the brittle objects may be effectively reduced.
    Type: Application
    Filed: April 24, 2015
    Publication date: October 27, 2016
    Inventors: HUNG-TU LU, VLADIMIR KONDRATENKO, ALEXANDER NAUMOV, CHIH-PENG HSU, WEI-NUNG HSU