Patents by Inventor Wei Wang

Wei Wang has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11933937
    Abstract: Methods and systems for generating a nanofluidic chip as a reservoir model are provided. In an example described herein, a nanofluidic chip for reservoir modeling includes a microfluidic chip that includes microchannels etched in a substrate. Silica spheres are assembled in the microchannels to form nanochannels. A carbonate coating is disposed over the surfaces of the nano channels and the silica spheres.
    Type: Grant
    Filed: May 24, 2022
    Date of Patent: March 19, 2024
    Assignee: Saudi Arabian Oil Company
    Inventors: Wei Wang, Sehoon Chang
  • Patent number: 11934454
    Abstract: Provided are a video retrieval method and apparatus, a medium, and a server. The video retrieval method includes: receiving a video retrieval request from a terminal, the video retrieval request carrying retrieval key information; searching a video database for a natural sentence matching the retrieval key information, the video database including a plurality of videos, each video having a natural sentence obtained through processing frames of the video using an encoder, a decoder and a reconstructor of a neural network; obtaining a video corresponding to the natural sentence matching the retrieval key information; and returning the matching video to the requesting terminal.
    Type: Grant
    Filed: May 17, 2022
    Date of Patent: March 19, 2024
    Assignee: TENCENT TECHNOLOGY (SHENZHEN) COMPANY LIMITED
    Inventors: Bairui Wang, Lin Ma, Wei Liu
  • Patent number: 11933809
    Abstract: The present application discloses an inertial sensor comprising a proof mass, an anchor, a flexible member and several sensing electrodes. The anchor is positioned on one side of the sensing, mass block in a first axis. The flexible member is connected to the anchor point and extends along the first axis towards the proof mass to connect the proof mass, in which the several sensing electrodes are provided. In this way, the present application can effectively solve the problems of high difficulty in the production and assembly of inertial sensors and poor product reliability thereof.
    Type: Grant
    Filed: April 6, 2022
    Date of Patent: March 19, 2024
    Assignee: SENSORTEK TECHNOLOGY CORP.
    Inventors: Shih-Wei Lee, Chia-Hao Lin, Shih-Hsiung Tseng, Kuan-Ju Tseng, Chao-Shiun Wang
  • Patent number: 11931208
    Abstract: The present application discloses a cerebral perfusion state classification apparatus and method, a device, and a storage medium. The method includes: acquiring, by a transceiving module, cervical blood flow data from an ultrasound data collecting device; determining, by a processor, cerebral perfusion data corresponding to the cervical blood flow data based on the cervical blood flow data and a mapping relationship between the cervical blood flow data and the cerebral perfusion data, and classifying cerebral perfusion states of a plurality of brain regions based on blood perfusion characteristics of the plurality of brain regions in the cerebral perfusion data.
    Type: Grant
    Filed: May 20, 2022
    Date of Patent: March 19, 2024
    Assignee: BEIJING FRIENDSHIP HOSPITAL, CAPITAL MEDICAL UNIVERSITY
    Inventors: Zhenchang Wang, Wei Zheng, Han Lv, Pengling Ren, Dehong Luo, Linkun Cai, Yawen Liu, Hongxia Yin, Pengfei Zhao, Jing Li, Dong Liu, Erwei Zhao, Tingting Zhang
  • Patent number: 11934027
    Abstract: An optical system affixed to an electronic apparatus is provided, including a first optical module, a second optical module, and a third optical module. The first optical module is configured to adjust the moving direction of a first light from a first moving direction to a second moving direction, wherein the first moving direction is not parallel to the second moving direction. The second optical module is configured to receive the first light moving in the second moving direction. The first light reaches the third optical module via the first optical module and the second optical module in sequence. The third optical module includes a first photoelectric converter configured to transform the first light into a first image signal.
    Type: Grant
    Filed: June 21, 2022
    Date of Patent: March 19, 2024
    Assignee: TDK TAIWAN CORP.
    Inventors: Chao-Chang Hu, Chih-Wei Weng, Chia-Che Wu, Chien-Yu Kao, Hsiao-Hsin Hu, He-Ling Chang, Chao-Hsi Wang, Chen-Hsien Fan, Che-Wei Chang, Mao-Gen Jian, Sung-Mao Tsai, Wei-Jhe Shen, Yung-Ping Yang, Sin-Hong Lin, Tzu-Yu Chang, Sin-Jhong Song, Shang-Yu Hsu, Meng-Ting Lin, Shih-Wei Hung, Yu-Huai Liao, Mao-Kuo Hsu, Hsueh-Ju Lu, Ching-Chieh Huang, Chih-Wen Chiang, Yu-Chiao Lo, Ying-Jen Wang, Shu-Shan Chen, Che-Hsiang Chiu
  • Patent number: 11934216
    Abstract: A constant current generation circuit for optocoupler isolation amplifier and a current precision adjustment method are provided. The constant current generation circuit includes a start circuit, a current generation circuit and a precision adjustment and output circuit integrated into a same substrate. The start circuit can generate and output a first start current and a second start current. The current generation circuit includes a negative temperature change rate current generation circuit connected to a first start current output and a positive temperature change rate current generation circuit connected to a second start current output. The precision adjustment and output circuit outputs constant current meeting application requirements of optocoupler isolation amplifier by adjusting proportional precision of two currents output from a current generation circuit.
    Type: Grant
    Filed: September 30, 2021
    Date of Patent: March 19, 2024
    Assignee: Hefei AICHUANGWEI Electronic Technology Co., Ltd.
    Inventors: Jun Pan, Lei Qiu, Dianwu Li, Fenfen Ji, Wei Wang, Lei Han, Ke Wang
  • Patent number: 11935271
    Abstract: A method, computer program, or computer system is provided for compressing a neural network model. One or more blocks are identified from among a superblock corresponding to a multi-dimensional tensor associated with a neural network. A set of weight coefficients associated with the superblock is unified. A model of the neural network is compressed based on the unified set of weight coefficients.
    Type: Grant
    Filed: November 2, 2020
    Date of Patent: March 19, 2024
    Assignee: TENCENT AMERICA LLC
    Inventors: Wei Jiang, Wei Wang, Shan Liu
  • Patent number: 11933999
    Abstract: An optical structure film and a light source module are provided. The optical structure film includes multiple optical unit microstructures. Each of the optical unit microstructures has four side surfaces and an inwardly concave beam splitting surface. The beam splitting surface is respectively connected to the side surfaces, and the beam splitting surface has four endpoints when viewed from a front viewing angle. Connection lines of the four endpoints form a rectangle. The beam splitting surface includes at least one beam splitting curved surface. A junction of the at least one beam splitting curved surface and one of the four side surfaces is a first line segment. A projection of a midpoint of an edge of the rectangle on the beam splitting surface overlaps with a relative extreme point of the first line segment.
    Type: Grant
    Filed: December 1, 2022
    Date of Patent: March 19, 2024
    Assignee: Coretronic Corporation
    Inventors: Wen-Chun Wang, Chih-Jen Tsang, Chung-Wei Huang
  • Patent number: 11935596
    Abstract: In certain aspects, a three-dimensional (3D) memory device includes a first semiconductor structure, a second semiconductor structure, and a bonding interface between the first semiconductor structure and the second semiconductor structure. The first semiconductor structure includes an array of memory cells, a first peripheral circuit of the array of memory cells, and a polysilicon layer between the array of memory cells and the first peripheral circuit. The first peripheral circuit includes a first transistor. The second semiconductor structure includes a second peripheral circuit of the array of memory cells. The second peripheral circuit includes a second transistor.
    Type: Grant
    Filed: September 22, 2021
    Date of Patent: March 19, 2024
    Assignee: YANGTZE MEMORY TECHNOLOGIES CO., LTD.
    Inventors: Yanhong Wang, Wei Liu, Liang Chen, Zhiliang Xia, Wenxi Zhou, Kun Zhang, Yuancheng Yang
  • Publication number: 20240089697
    Abstract: The disclosed technology is directed towards efficiently identifying a first entity (e.g., a user or sensor) as a potential witness to an event. A first dataset describing event time data and event location data of an event are obtained from a first device. A second dataset describing device time data and device location data are obtained via a device associated with a second entity, e.g., a user. By analyzing the first and second datasets, e.g., for time and location intersection, the second entity can be identified as a potential witness to the event, and notified of such. Factors such as line of sight, speed and direction, audio sensing range versus event volume, and the like of the second entity can be used in determining whether the second entity is a likely witness. A witness to a live event can be identified and asked to send in live (e.g., video) evidence.
    Type: Application
    Filed: September 12, 2022
    Publication date: March 14, 2024
    Inventors: Adrianne Luu, Robert Moton, JR., Ryan Schaub, Timothy Knezevich, Barrett Kreiner, Wei Wang, Ari Craine, Robert Koch
  • Publication number: 20240081352
    Abstract: The present disclosure provides a blending method of high-quality and dual-purpose flour for bread and noodles, belonging to the technical field of flour processing. The method includes: selecting flour of a high-quality and dual-purpose wheat variety for bread and noodles as a high-quality basic flour for blending; according to a large gradient experimental design, selecting a gradient range ratio with a sedimentation value ?46.0 mL and a dough development time ?9.6 min, followed by subdividing for small gradient experiments; selecting a ratio with flour sedimentation value and dough development time that reach an ideal value to blend a large amount of flour; and making bread and noodles for scoring, followed by determining a blending ratio if a scoring result reaches an ideal value.
    Type: Application
    Filed: September 11, 2022
    Publication date: March 14, 2024
    Inventors: Yan Zi, Jianmin Song, Xiao Ma, Aifeng Liu, Wei Ju, Haosheng Li, Dungong Cheng, Canguo Wang, Jun Guo, Jianjun Liu, Xinyou Cao, Cheng Liu, Shengnan Zhai, Faji Li, Ran Han, Zhendong Zhao
  • Publication number: 20240088078
    Abstract: Packaged memory devices including memory devices hybrid bonded to logic devices and methods of forming the same are disclosed. In an embodiment, a semiconductor device includes a first memory die including a first memory cell electrically coupled to a first word line; a second memory cell electrically coupled to the first word line; and a first interconnect structure electrically coupled to the first word line; a circuitry die including a second interconnect structure, a first conductive feature of the first interconnect structure being bonded to a second conductive feature of the second interconnect structure through metal-to-metal bonds; and a word line driver electrically coupled to the first word line between the first memory cell and the second memory cell, the word line driver being electrically coupled to the first word line through the first interconnect structure and the second interconnect structure.
    Type: Application
    Filed: January 4, 2023
    Publication date: March 14, 2024
    Inventors: Chung-Hao Tsai, Yih Wang, Wei-Ting Chen, Chuei-Tang Wang, Chen-Hua Yu
  • Publication number: 20240082749
    Abstract: An interactive toy comprising a function device for performing user-perceptible, controllable functions. The interactive toy also includes a rechargeable power source and a charging circuit for contactless receipt of electrical energy and for charging the rechargeable power source when the interactive toy is positioned in a charging zone of a contactless charging device. The interactive toy is adapted to determine a charging rate at respective positions relative to the charging device and to generate a user-perceptible output indicative of the determined charging rate.
    Type: Application
    Filed: November 21, 2023
    Publication date: March 14, 2024
    Applicant: LEGO A/S
    Inventors: Thomas Alan DONALDSON, Mark Ross CHAMPKINS, Radost Radoslavova KEREFEYNA, Rasmus Bissenbakker KÆRSGAARD, Yufan Wei WANG, Arun VENKATASUBRAMANIAN, Simon Mark JORDAN, Andrew James KNIGHTS, Isobel Jane ASHBEY, Martin Edward BROCK, Rosanna Elizabeth PARRISH, Silviu TOMA, Robert George MILNER
  • Publication number: 20240084051
    Abstract: Disclosed are support-activators and catalyst compositions comprising the support-activators for polymerizing olefins in which the support-activator includes clay heteroadduct, prepare from a colloidal phyllosilicate such as a colloidal smectite clay, which is chemically-modified with a heterocoagulation agent. By limiting the amount of heterocoagulation reagent relative to the colloidal smectite clay as described herein, the smectite heteroadduct support-activator is a porous and amorphous solid which can be readily isolated from the resulting slurry by a conventional filtration process, and which can activate metallocenes and related catalysts toward olefin polymerization. Related compositions and processes are disclosed.
    Type: Application
    Filed: October 11, 2023
    Publication date: March 14, 2024
    Applicant: Formosa Plastics Corporation, U.S.A.
    Inventors: Michael D. Jensen, Kevin Chung, Daoyong Wang, Wei-Chun Shih, Guangxue Xu, Chih-Jian Chen, Charles R. Johnson, II, Mary Lou Cowen
  • Publication number: 20240088261
    Abstract: The structure of a semiconductor device with dual silicide contact structures and a method of fabricating the semiconductor device are disclosed. A method of fabricating the semiconductor device includes forming first and second fin structures on a substrate, forming first and second epitaxial regions on the first and second fin structures, respectively, forming first and second contact openings on the first and second epitaxial regions, respectively, selectively forming an oxide capping layer on exposed surfaces of the second epitaxial region, selectively forming a first metal silicide layer on exposed surfaces of the first epitaxial region, removing the oxide capping layer, and forming first and second conductive regions on the metal silicide layer and on the exposed surfaces of the second epitaxial region, respectively. The first metal silicide layer includes a first metal. The first and second conductive regions includes a second metal different from the first metal.
    Type: Application
    Filed: November 21, 2023
    Publication date: March 14, 2024
    Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.
    Inventors: Peng-Wei CHU, Yasutoshi OKUNO, Ding-Kang SHIH, Sung-Li WANG
  • Publication number: 20240088004
    Abstract: A stacked wiring structure includes a first wiring substrate and a second wiring substrate. The first wiring substrate includes a first glass substrate, multiple first conductive through vias penetrating through the first glass substrate, and a first multi-layered redistribution wiring structure disposed on the first glass substrate. The second wiring substrate includes a second glass substrate, multiple second conductive through vias penetrating through the second glass substrate, and a second multi-layered redistribution wiring structure disposed on the second glass substrate. The first conductive through vias are electrically connected to the second conductive through vias. The first glass substrate is spaced apart from the second glass substrate. The first multi-layered redistribution wiring structure is spaced apart from the second multi-layered redistribution wiring structure by the first glass substrate and the second glass substrate.
    Type: Application
    Filed: August 21, 2023
    Publication date: March 14, 2024
    Applicant: Industrial Technology Research Institute
    Inventors: Tai-Jui Wang, Jui-Wen Yang, Chieh-Wei Feng, Chih Wei Lu, Hsien-Wei Chiu
  • Publication number: 20240087563
    Abstract: Enabling machine-to-machine communication for digital assistants can include initiating a call with a called device, generating audio stream data having a first instance of audio and a first spoken command, which can be provided to the called device. A second instance of audio stream data can be received from the called device, can include a second spoken command, and can be analyzed to determine if it includes assistant signature data. If the second instance of audio stream data includes the assistant signature data, the devices can switch to machine-to-machine communications.
    Type: Application
    Filed: September 8, 2022
    Publication date: March 14, 2024
    Applicant: AT&T Intellectual Property I, L.P.
    Inventors: Lars Johnson, Wei Wang
  • Publication number: 20240090233
    Abstract: A semiconductor device includes a sense amplifier, a first magnetic tunneling junction (MTJ) connected to the sense amplifier at a first distance, a second MTJ connected to the sense amplifier at a second distance, and a third MTJ connected to the sense amplifier at a third distance. Preferably, the first distance is less than the second distance, the second distance is less than the third distance, a critical dimension of the first MTJ is less than a critical dimension of the second MTJ, and the critical dimension of the second MTJ is less than a critical dimension of the third MTJ.
    Type: Application
    Filed: November 21, 2023
    Publication date: March 14, 2024
    Applicant: UNITED MICROELECTRONICS CORP.
    Inventors: Po-Wei Wang, Yi-An Shih, Huan-Chi Ma
  • Publication number: 20240084484
    Abstract: The present disclosure provides a method and a device for preparing a modified poly (m-phenylene isophthalamide) (PMIA) fiber by continuous polymerization-dry-wet spinning. The method includes the following steps: (1) preparing a mixed solution of m-phenylenediamine (MPD) and a copolymerized diamine monomer in N,N-dimethylacetamide (DMAC) serving as a solvent using a cosolvent; (2) mixing isophthaloyl chloride (IPC) with the mixed solution of the MPD and the copolymerized diamine monomer in the DMAC, and conducting pre-polycondensation and polycondensation in sequence to obtain a modified PMIA resin solution; and (3) subjecting the modified PMIA resin solution to additive addition, filtration, defoaming, and dry-wet spinning to obtain the modified PMIA fiber.
    Type: Application
    Filed: October 11, 2022
    Publication date: March 14, 2024
    Applicant: ZHUZHOU TIMES NEW MATERIAL TECHNOLOGY CO., LTD.
    Inventors: Jun YANG, Kaikai CAO, Jin WANG, Yufeng LIU, Zhicheng SONG, You YANG, Feng YUAN, Wei WU, Zhijun ZHANG, Lei CHEN
  • Patent number: D1018537
    Type: Grant
    Filed: November 7, 2023
    Date of Patent: March 19, 2024
    Assignee: HTC CORPORATION
    Inventors: Shu-Kuen Chang, Natalia Amijo, Ian James McGillivray, Chin-Wei Chou, Yi-Shen Wang, Chih-Sung Fang, Hung-Yu Chen