Patents by Inventor Weiyang YAP

Weiyang YAP has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20230135000
    Abstract: A semiconductor substrate includes: a base substrate layer doped with a first type dopant; a first epitaxial layer on the base substrate layer that has a first thickness and is doped with the first type dopant to provide a first resistivity; a second epitaxial layer on the first epitaxial layer that has a second thickness and is doped with the first type dopant to provide a second resistivity (less than the third resistivity); and a third epitaxial layer on the second epitaxial layer that has a third thickness and is doped with the first type dopant to provide a third resistivity (less than the second resistivity). An oxide field trench transistor includes a trench with insulated polygate and polysource regions extending into the semiconductor substrate and passing through the first doped region, the second doped region, the third epitaxial layer and partially into the second epitaxial layer.
    Type: Application
    Filed: October 10, 2022
    Publication date: May 4, 2023
    Applicant: STMicroelectronics Pte Ltd
    Inventors: Yean Ching YONG, Jianhua JIN, Weiyang YAP, Voon Cheng NGWAN