Abstract: A device includes a first biosensor of a biosensor array; a second biosensor of a biosensor array; a readout circuit electrically connected to the biosensor array; a decoder electrically connected to the biosensor array; a voltage generator electrically connected to the biosensor array; and a decision system electrically connected to the voltage generator and the readout circuit.

Abstract: Methods for manufacturing a FinFET and a FinFET are provided. In various embodiments, the method for manufacturing a FinFET includes etching a base substrate to form a trapezoidal fin structure. Next, an isolation layer is deposited covering the etched base substrate. Then, the trapezoidal fin structure is exposed. The trapezoidal fin structure includes a top surface and a bottom surface, and the top surface has a width larger than that of the bottom surface.

Abstract: A method for manufacturing an electronic device casing having a coupling structure is provided. The electronic device casing is made of a casing material including a supportive substrate and a first thermoplastic substrate. A preliminary connecting section is formed on the first thermoplastic substrate by a hot-pressing molding process, and a molding plastic material is injected onto the preliminary connecting section by an in-mold injection process. After being cooled, the molding plastic material engages with the preliminary connecting section to form a secondary connecting section for a coupling element to couple with. Thus, the coupling structure of the electronic device casing can be directly formed during a manufacturing process without any additional procedures, thereby overall manufacturing time and costs are reduced.

Abstract: A method for integrating complementary metal-oxide-semiconductor (CMOS) devices with a microelectromechanical systems (MEMS) device using a flat surface above a sacrificial layer is provided. In some embodiments, a back-end-of-line (BEOL) interconnect structure is formed covering a semiconductor substrate, where the BEOL interconnect structure comprises a first dielectric region. A sacrificial layer is formed over the first dielectric region, and a second dielectric region is formed covering the sacrificial layer and the first dielectric region. A planarization is performed into an upper surface of the second dielectric region to planarize the upper surface. A MEMS structure is formed on the planar upper surface of the second dielectric region. A cavity etch is performed into the sacrificial layer, through the MEMS structure, to remove the sacrificial layer and to form a cavity in place of the sacrificial layer. An integrated circuit (IC) resulting from the method is also provided.

Abstract: The present disclosure provides a bio-field effect transistor (BioFET) and a method of fabricating a BioFET device. The method includes forming a BioFET using one or more process steps compatible with or typical to a complementary metal-oxide-semiconductor (CMOS) process. The BioFET device may include a substrate; a gate structure disposed on a first surface of the substrate and an interface layer formed on the second surface of the substrate. The interface layer may allow for a receptor to be placed on the interface layer to detect the presence of a biomolecule or bio-entity.

Abstract: A method includes providing a semiconductor device disposed on a substrate, wherein the semiconductor device includes a semiconductor device feature, forming a conductive layer over the substrate such that the conductive layer is electrically coupled to the semiconductor device feature, forming a getter layer over the conductive layer, wherein the getter layer includes a first layer that is formed of titanium and a second layer overlying the first layer that is formed of tantalum nitride, and forming an interconnect layer over the getter layer such that the interconnect layer is electrically coupled to the semiconductor device feature.

Abstract: The present disclosure relates to a microelectromechanical systems (MEMS) package having two MEMS devices with different pressures, and an associated method of formation. In some embodiments, the (MEMS) package includes a device substrate and a cap substrate bonded together. The device substrate includes a first trench and a second trench. A first MEMS device is disposed over the first trench and a second MEMS device is disposed over the second trench. A first stopper is raised from a first trench bottom surface of the first trench but below a top surface of the device substrate and a second stopper is raised from a second trench bottom surface of the second trench but below the top surface of the device substrate. A first depth of the first trench is greater than a second depth of the second trench.

Abstract: An equalization enhancing module includes: a multiplication unit, multiplying a plurality of equalized signals by a scaling coefficient to obtain a plurality of scaled signals; a determination unit, coupled to the multiplication unit, determining whether the plurality of scaled signals are located in a predetermined region to generate a plurality of determination results; a ratio calculating unit, coupled to the determination unit, calculating an inner ratio associated with a ratio of the plurality of scaled signals located in the predetermined region; and a coefficient calculating unit, coupled to the ratio calculating unit, calculating the scaling coefficient according to the inner ratio.

Abstract: A voice wakeup detecting device for an electronic product includes a front end detecting circuit, a speech recognition processor and a main processor. The front end detecting circuit judges whether a voice signal contains a sub-keyword according to sub-keyword model parameters. If the front end detecting circuit confirms that the voice signal contains the sub-keyword, then it generates a first interrupt signal. In response to the first interrupt signal, the speech recognition processor is enabled to judge whether the voice signal contains a keyword according to keyword model parameters. If the speech recognition processor confirms that the voice signal contains the keyword, then it generates a second interrupt signal. In response to the second interrupt signal, the main processor is enabled. Consequently, the electronic produce is waked up from a sleep state to a normal working state.

Abstract: An embodiment of the invention provides a calibration control method performed by a microphone system. The microphone system includes a plurality of microphones configured to generate a plurality of microphone signals. First, the microphone system equalize the microphone signals to generate a plurality of equalized microphone signals. Next, the microphone system calculates a set of similarity indicators based on the equalized microphone signals. Then, the microphone system compares the set of similarity indicators with a set of predetermined thresholds to determine whether to calibrate the microphone signals.

Abstract: The present invention provides an audio-data transmission system including a channel encoder, a data modulator and a speaker. The channel encoder is utilized to receive and encode a bit signal and generates an encoding signal. The data modulator is utilized to receive the encoding signal and modulates it to an audio signal whose frequency is on a frequency band. The audio signal includes at least four different sub-audio signals. The frequency band includes at least four sub-frequency bands with different frequencies. The frequencies of the at least four sub-audio signals are respectively on the at least four sub-frequency bands. The speaker is utilized to transmit the audio signal including the at least four different sub-audio signals.

Abstract: A vacuum sealed MEMS and CMOS package and a process for making the same may include a capping wafer having a surface with a plurality of first cavities, a first device having a first surface with a second plurality of second cavities, a hermetic seal between the first surface of the first device and the surface of the capping wafer, and a second device having a first surface bonded to a second surface of the first device. The second device is a CMOS device with conductive through vias connecting the first device to a second surface of the second device, and conductive bumps on the second surface of the second device. Conductive bumps connect to the conductive through vias and wherein a plurality of conductive bumps connect to the second device. The hermetic seal forms a plurality of micro chambers between the capping wafer and the first device.

Abstract: A voice wakeup detecting device for an electronic product includes a digital microphone and an application processor. The digital microphone has a function of judging whether a digital voice signal contains a subword according to subword model parameters. If the digital microphone confirms that the digital voice signal contains the subword, the digital microphone generates a first interrupt signal and outputs the digital voice signal. The application processor is enabled in response to the first interrupt signal. The application processor judges whether the digital voice signal contains a keyword according to keyword model parameters. If the application processor confirms that the digital voice signal contains the keyword, the electronic product is waked up from a sleep state to a normal working state under control of the application processor.

Abstract: A flame simulating device includes an upper part, a light source, a container and an oscillation device. The upper part has a flame element which freely swings relative to the upper part, and the light source located in the upper part emits light toward the flame-shaped portion. The container is located below the upper part and contains liquid therein. The oscillation device is located at the underside of the container and oscillates the liquid in the container to generate liquid vapor and liquid droplets, the liquid droplets hit and irregularly swing the flame element. The liquid vapor provides a foggy environment.

Abstract: A multiband antenna is provided. A resonance path is provided by a first connection segment and a low-frequency radiating element with a closed pattern to enable the multiband antenna to support a low frequency band, wherein a first side of the closed pattern is wider than a second side of the closed pattern. The second side of the closed pattern is connected to one end of the first connection segment. The other end of the first connection segment is connected to a feed element.

Abstract: An audio synchronization method includes: receiving a first audio signal from a first recording device; receiving a second audio signal from a second recording device; performing a correlation operation upon the first audio signal and the second audio signal to align a first pattern of the first audio signal and the first pattern of the second audio signal; after the first patterns of the first audio signal and the second audio signal are aligned, calculating a difference between a second pattern of the first audio signal and the second pattern of the second audio signal; and obtaining a starting-time difference between the first audio signal and the second audio signal for audio synchronization according to the difference between the second pattern of the first audio signal and the second pattern of the second audio signal.

Abstract: Representative methods for sealing MEMS devices include depositing insulating material over a substrate, forming conductive vias in a first set of layers of the insulating material, and forming metal structures in a second set of layers of the insulating material. The first and second sets of layers are interleaved in alternation. A dummy insulating layer is provided as an upper-most layer of the first set of layers. Portions of the first and second set of layers are etched to form void regions in the insulating material. A conductive pad is formed on and in a top surface of the insulating material. The void regions are sealed with an encapsulating structure. At least a portion of the encapsulating structure is laterally adjacent the dummy insulating layer, and above a top surface of the conductive pad. An etch is performed to remove at least a portion of the dummy insulating layer.

Abstract: Methods and apparatus of reconstructing 360 audio/video (AV) file from multiple AV tracks captured by multiple capture devices are disclosed. According to the present invention, for multi-track audio/video data comprising a first and second audio tracks and a first and second video tracks, the first audio track and the first video track are aligned with the second audio track and the second video track by utilizing video synchronization information derived from the first video track and the second video track if the video synchronization information is available. When the video synchronization information is available, the first audio track and the first video track are aligned with the second audio track and the second video track by utilizing the video synchronization information.

Abstract: A method for forming a semiconductor device structure is provided. The method includes forming a target layer over a substrate and forming a seed layer over the target layer. The method includes forming a hard mask layer over the seed layer, and the hard mask layer includes an opening to expose a portion of the seed layer. The method includes forming a conductive layer in the opening, and the conductive layer is selectively formed on the portion of the seed layer. The method includes etching a portion of the target layer by using the conductive layer as a mask.

Abstract: An audio refocusing method includes receiving an indication signal indicating which sound source in a recorded signal has to be refocused on; determining a direction of the sound source or a location of the sound source; and enhancing sound generated by the sound source in the recorded signal according to the direction or the location of the sound source to generate a processed signal.