Abstract: Compositions that inhibit or block the interaction between Erbin and ErbB2 and methods of their use are provided. Preferred compositions include peptides that inhibit or block Erbin and ErbB2 interaction under physiologic conditions in a subject. One embodiment provides an isolated peptide fragment of ErbB2 including the C-terminal 15 amino acids of ErbB2. The peptide fragment can be about 15 to 27 amino acids in length.

Abstract: Methods for preventing and/or reducing side effects of an anti-cancer agent in a subject in need thereof are disclosed. The method comprises administering to the subject, who is under an anti-cancer agent treatment, a composition comprising a therapeutically effective amount of isolated deoxyelephantopin and/or an analogue thereof; and a pharmaceutically acceptable carrier.

Abstract: An electronic device includes a body, an electronic module, and an elastic element, wherein the body has at least an accommodating space and a first connector. The electronic module is accommodated in the accommodating space and has a plurality of connection ports and a second connector electrically connected to the plurality of connection ports. The second connector is electrically connected to the first connector, and the plurality of connection ports is exposed on the outer surface of the body. The elastic element surrounds the junction between the first connector and the second connector, wherein the electronic module presses the elastic element against the body.

Abstract: The present disclosure provides a device having a plurality of bonded substrates. The substrates are bonded by a first bond ring and a second bond ring. In an embodiment, the first bond ring is a eutectic bond and the second bond ring is at least one of an organic material and a eutectic bond. The second bond ring encircles the first bond ring. The first bond ring provides a hermetic region of the device. In a further embodiment, a plurality of wafers are bonded which include a third bond ring disposed at the periphery of the wafers.

Abstract: The present disclosure provides a magnetoresistive random access memory (MRAM) device. The MRAM device includes a magnetic tunnel junction (MTJ) stack on a substrate; and a dual-layer passivation layer disposed around the MTJ stack. The dual-layer passivation layer includes an oxygen-free film formed adjacent sidewalls of the MTJ stack; and a moisture-blocking film formed around the oxygen-free film.

Abstract: A method embodiment includes providing a MEMS wafer comprising an oxide layer, a MEMS substrate, a polysilicon layer. A carrier wafer comprising a first cavity formed using isotropic etching is bonded to the MEMS, wherein the first cavity is aligned with an exposed first portion of the polysilicon layer. The MEMS substrate is patterned, and portions of the sacrificial oxide layer are removed to form a first and second MEMS structure. A cap wafer including a second cavity is bonded to the MEMS wafer, wherein the bonding creates a first sealed cavity including the second cavity aligned to the first MEMS structure, and wherein the second MEMS structure is disposed between a second portion of the polysilicon layer and the cap wafer. Portions of the carrier wafer are removed so that first cavity acts as a channel to ambient pressure for the first MEMS structure.

Abstract: An apparatus for correcting a phase error is provided. The apparatus includes an error estimating module and a correcting module. The error estimating module receives a phase-shift keying signal, and calculates a phase error according to the phase-shift keying signal, a plurality of known candidate signals and Bayesian estimation. The correcting module corrects the phase-shift keying signal according to the phase error.

Abstract: The present invention provides a material distribution system and method thereof, comprising first, second and third conveyors, first, second, third and fourth material distribution paths, first and second material distribution rockers, and a movable material-distributing guide plate. Material conveyed on the second conveyor is delivered to the first or second material distribution rocker by switching the movable material-distributing guide plate, material conveyed on the first or second conveyor is delivered to the first or second material distribution path by switching the first material distribution rocker, and material conveyed on the second or third conveyor is delivered to the third or fourth material distribution path by switching the second material distribution rocker.

Abstract: An interface card quick plug-and-unplug device for use with a PCIe interface card is disclosed to include a shell covering a part of the PCIe interface card, and a locating member disposed at one side of the shell and/or the PCIe interface card for engagement with the PCIe slot upon insertion of the PCIe interface card into the PCIe slot. Biasing the locating member allows quick removal of the PCIe interface card from the PCIe slot without any tool. The interface card quick plug-and-unplug device enhances the flexibility of the design of computer circuit layout.

Abstract: The present disclosure provides in one embodiment, a semiconductor device that includes a MEMS switch having a substrate, a first dielectric layer disposed above the substrate, and a bottom signal electrode, a bump, and a bottom actuation electrode disposed above the first dielectric layer. The MEMS switch further includes a second dielectric layer enclosing the bottom signal electrode, and a movable member including a top signal electrode disposed above the bottom signal electrode and a top actuation electrode disposed above the bottom actuation electrode and the bump, wherein the top actuation electrode is electrically coupled to the bump. A method of fabricating a MEMS switch is also disclosed.

Abstract: A candle stand with faux flame is disclosed, including a lamp stand, power supply, support frame, holder, flame decorative element, light-emitting body, motor, driving element, first resistive magnet body, and at least a second resistive magnet body. The support frame is fixedly standing upon lamp stand; the flame decorative element is suspended at top of holder; the light-emitting body emits light towards flame decorative element. The power supply and motor are inside lamp stand for driving the driving element. The first resistive magnet body is disposed at lower end of flame decorative element. The second resistive magnet body is disposed on the driving element. When the motor drives the driving element, the second resistive magnet body moves close to or away from first resistive magnet body so as to sway flame decorative element. With projected light, the swaying flame decorative element emulates a flame.

Abstract: In an example embodiment, there is disclosed an apparatus comprising a plurality of ports and routing logic coupled with the plurality of ports. The routing logic obtains data representative of a first port configuration for the plurality of ports, the first port configuration comprises data representative of a status for individual ports selected from the plurality of ports, the status indicating whether an individual port selected from the plurality of ports is an open port, an alternate port, or a failed port. The routing logic forwards data in accordance with the first port configuration. The routing logic also obtains data representative of an alternate port configuration for the plurality of ports, the alternate port configuration is to be employed upon determining a predefined link has failed. The alternate configuration comprising a new status for individual ports selected from the plurality of ports.

Abstract: A method includes bonding a first bond layer to a second bond layer through eutectic bonding. The step of bonding includes heating the first bond layer and the second bond layer to a temperature higher than a eutectic temperature of the first bond layer and the second bond layer, and performing a pumping cycle. The pumping cycle includes applying a first force to press the first bond layer and the second bond layer against each other. After the step of applying the first force, a second force lower than the first force is applied to press the first bond layer and the second bond layer against each other. After the step of applying the second force, a third force higher than the second force is applied to press the first bond layer and the second bond layer against each other.

Abstract: Various arrangements of color sub-pixels in a group of pixels for use in a color display are disclosed. The same group of pixels is repetitively arranged in rows and columns in the color display. In particular, each group of pixels has four pixels arranged on the four quadrants of a rectangle or square. A pixel group may have two sub-pixels in R, two sub-pixels in G, two sub-pixels in B and two sub-pixels in W, but each of the pixels has two different color sub-pixels. In each of the four pixels in a pixel group, the two sub-pixels can be adjacent to each other along the column direction or along the row direction, but the two sub-pixels in at least one pixel are adjacent to each other along the column direction. A pixel group may have two pixels with R, G sub-pixels and two pixels in B.

Abstract: Exemplary microelectromechanical system (MEMS) devices, and methods for fabricating such are disclosed. An exemplary method includes providing a silicon-on-insulator (SOI) substrate, wherein the SOI substrate includes a first silicon layer separated from a second silicon layer by an insulator layer; processing the first silicon layer to form a first structure layer of a MEMS device; bonding the first structure layer to a substrate; and processing the second silicon layer to form a second structure layer of the MEMS device.

Abstract: A power supply device including a rectifying unit, a supplying unit, a controlling unit, a conversion unit and a detection unit is disclosed. The rectifying unit processes an alternating current (AC) voltage to generate a direct current (DC) voltage. The supplying unit generates an operation voltage according to an input voltage. The controlling unit receives the operation voltage and generating an enabling signal. The conversion unit transforms the DC voltage to generate an auxiliary voltage according to the enabling signal. The auxiliary voltage is not equal to the operation voltage. The detection unit detects the auxiliary voltage. When the auxiliary voltage is generated, the detection unit de-activates the supplying unit to stop generating the operation voltage.

Abstract: A method for sending a keycode of a non-keyboard apparatus is provided and includes the following steps. The non-keyboard apparatus determines the connection status between itself and a computer by the time required for device enumeration. Then, according to a value generated from device enumeration, the non-keyboard apparatus identifies the kind of operating system running on the computer. The non-keyboard apparatus sends to the computer a keycode corresponding to the Num Lock key and/or a keycode corresponding to the Caps Lock key such that a sending time and a feedback time are obtained. A parameter related to the efficiency of the computer is then calculated based.

Abstract: A source driver including a controller, a plurality of flip-flops, a plurality of shift registers and a plurality of driving channels is provided. The controller extracts control information from an image data stream. Each of the flip-flops respectively receives a corresponding control bit of the control information, and output the corresponding control bit. The shift registers correspond to the flip-flops one by one, and sequentially transmit an enable pulse. Each of the shift registers determines whether to output the enable pulse according to the control bit outputted by the corresponding flip-flop. The driving channels correspond to the shift registers one by one. Each of the driving channels switches an operation state into an enable mode or a disable mode according to the enable pulse outputted by the corresponding shift register.

Abstract: A method of forming an integrated circuit structure includes providing a silicon substrate, and implanting a p-type impurity into the silicon substrate to form a p-type region. After the step of implanting, performing an anneal to form a silicon oxide region, with a portion of the p-type region converted to the silicon oxide region.

Abstract: A radioactive waste acid is recycled. The waste acid is a fluoboric waste acid. The waste acid contains a lot of oxides and radioactive nuclei. The waste fluoboric acid is processed to obtain a purified fluoboric acid. The amount of radioactive nuclei is greatly reduced. Thus, the present invention has a simple procedure with low cost and reduced power consumption.