Patents by Inventor Wen Hsiung Chang

Wen Hsiung Chang has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20120049338
    Abstract: In one embodiment, a semiconductor device package includes: (1) a substrate unit; (2) connecting elements disposed adjacent to a periphery of the substrate unit and extending upwardly from an upper surface of the substrate unit; (3) a semiconductor device disposed adjacent to the upper surface of the substrate unit and electrically connected to the substrate unit; and (4) a package body disposed adjacent to the upper surface of the substrate unit and covering the semiconductor device. A lateral surface of the package body is substantially aligned with a lateral surface of the substrate unit. The package body defines openings that at least partially expose respective ones of the connecting elements. At least one of the connecting elements has a width WC, and at least one of the openings has a width WU adjacent to an upper surface of the package body, such that WU>WC.
    Type: Application
    Filed: November 7, 2011
    Publication date: March 1, 2012
    Inventors: Kuang-Hsiung Chen, Chi-Chih Shen, Jen-Chuan Chen, Wen-Hsiung Chang, Hui-Shan Chang, Pei-Yu Hsu, Fa-Hao Wu, Chen-Yu Chia, Chi-Chih Chu, Cheng-Yi Weng, Ya-Wen Hsu
  • Publication number: 20120009716
    Abstract: In a package process of backside illumination image sensor, a wafer including a plurality of pads is provided. A first carrier is processed to form a plurality of blind vias therein. The first carrier is adhered to the wafer so that the blind vias face to the pads correspondingly. A spacing layer is formed and a plurality of sensing components are disposed. A second carrier is adhered on the spacing layer. Subsequently, a carrier thinning process is performed so that the blind vias become the through holes. An insulating layer is formed on the first carrier. An electrically conductive layer is formed on the insulating layer and filled in the though holes to electrically connect to the pads. The package process can achieve the exact alignment of the through holes and the pads, thereby increasing the package efficiency and improving the package quality.
    Type: Application
    Filed: July 7, 2010
    Publication date: January 12, 2012
    Applicant: MOS Art Pack Corporation
    Inventor: Wen-Hsiung CHANG
  • Patent number: 8076765
    Abstract: In one embodiment, a semiconductor device package includes: (1) a substrate unit; (2) connecting elements disposed adjacent to a periphery of the substrate unit and extending upwardly from an upper surface of the substrate unit; (3) a semiconductor device disposed adjacent to the upper surface of the substrate unit and electrically connected to the substrate unit; and (4) a package body disposed adjacent to the upper surface of the substrate unit and covering the semiconductor device. A lateral surface of the package body is substantially aligned with a lateral surface of the substrate unit. The package body defines openings that at least partially expose respective ones of the connecting elements. At least one of the connecting elements has a width WC, and at least one of the openings has a width WU adjacent to an upper surface of the package body, such that WU>WC.
    Type: Grant
    Filed: July 22, 2009
    Date of Patent: December 13, 2011
    Assignee: Advanced Semiconductor Engineering, Inc.
    Inventors: Kuang-Hsiung Chen, Chi-Chih Shen, Jen-Chuan Chen, Wen-Hsiung Chang, Hui-Shan Chang, Pei-Yu Hsu, Fa-Hao Wu, Chen-Yu Chia, Chi-Chih Chu, Cheng-Yi Weng, Ya-Wen Hsu
  • Publication number: 20110294237
    Abstract: In a packaging method of semiconductor device, firstly, a wafer including a number of dies is provided. The wafer has an active surface and a back surface. The active surface adheres to a carrier. Subsequently, a number of openings are formed in each of the dies. Then, an insulating layer is formed on the back surface and on the side walls of the openings. A metal layer is formed to cover the insulating layer and the bottoms of the openings. A pattern protective layer is formed to cover the metal layer and to expose the metal layer outside the openings. Afterwards, the carrier is removed and the wafer is sawed. Later, a transparent substrate having a number of package units is provided. A spacer is formed at peripheral of each of the package units. A number of good dies are choose from the dies and disposed on the spacer.
    Type: Application
    Filed: May 27, 2010
    Publication date: December 1, 2011
    Inventor: Wen-Hsiung CHANG
  • Publication number: 20110285014
    Abstract: A package structure and a package process are proposed in using pillar bumps to connect an upper second chip and through silicon vias of a lower first chip, wherein a gap between the first chip and the second chip can be controlled by adjusting a height of the pillar bumps. In other words, the pillar bumps compensate the height difference between the first chip and a molding compound surrounding the first chip so as to ensure the bondibility between the pillar bumps and the corresponding through silicon vias and improve the process yield. Furthermore, the pillar bumps maintain the gap between the second chip and the molding compound for allowing an underfill being properly filled into the space between the first chip and the second chip.
    Type: Application
    Filed: June 17, 2010
    Publication date: November 24, 2011
    Applicant: ADVANCED SEMICONDUCTOR ENGINEERING, INC.
    Inventors: Chi-Chih Shen, Jen-Chuan Chen, Hui-Shan Chang, Wen-Hsiung Chang
  • Publication number: 20110272795
    Abstract: Exemplary semiconductor device packaging structure and packaging method are provided. The packaging method uses an adhesive layer to bond multiple wafer pieces onto a first surface of a carrier substrate, each adjacent two of the wafer pieces having a gap formed therebetween for exposing a part of the adhesive layer. A packaging layer is filled in each of the gaps. At least one through silicon via is formed each of the wafer pieces to expose a bonding pad formed on an active surface of the wafer pieces. Redistribution circuit layers are formed on back surfaces of the respective wafer pieces and filled into the through silicon vias for electrical connection with the bonding pads. A sawing process is performed to saw starting from each of the packaging layers to a second surface of the carrier substrate, and thereby multiple semiconductor device packaging structures are obtained.
    Type: Application
    Filed: May 6, 2010
    Publication date: November 10, 2011
    Inventor: Wen-Hsiung CHANG
  • Publication number: 20110272808
    Abstract: A semiconductor process includes the following steps. Firstly, a conductive substrate is provided. Then, at least one insulating pattern is formed on the conductive substrate. Thereafter at least one metal pattern is formed on the insulating pattern. After that, a passivation layer is formed on the conductive substrate to cover the metal pattern by an electroplating process.
    Type: Application
    Filed: May 6, 2010
    Publication date: November 10, 2011
    Inventor: Wen-Hsiung CHANG
  • Publication number: 20110275194
    Abstract: A method for manufacturing semiconductor device includes the following steps. First, a carrier substrate and a plurality of pieced segments of wafer are provided. Each of the pieced segments of wafer has an active surface and a back surface on opposite sides thereof. Further, there is at least a bonding pad disposed on the active surface. Next, an adhering layer is formed between the carrier substrate and the active surfaces of the pieced segments of wafer, so as to make the pieced segments of wafer adhere to the carrier substrate. Next, a through silicon via is formed in each of the pieced segments of wafer to electrically connect to the bonding pad correspondingly. Then, the pieced segments of wafer are separated from the carrier substrate.
    Type: Application
    Filed: May 6, 2010
    Publication date: November 10, 2011
    Inventor: Wen-Hsiung Chang
  • Publication number: 20110272809
    Abstract: A semiconductor structure and a manufacturing method thereof are provided. The method includes the following steps. Firstly, a semiconductor substrate having an active surface and a back surface is provided. The active surface is opposite to the back surface, and the semiconductor substrate includes at least one grounding pad disposed on the active surface. Secondly, at least one through silicon via is formed through the semiconductor substrate from the back surface to the active surface thus exposing the grounding pad. Then, a conductive layer is formed on the back surface of the semiconductor substrate and filled into the through silicon via to electrically connect to the grounding pad and the semiconductor substrate.
    Type: Application
    Filed: May 6, 2010
    Publication date: November 10, 2011
    Inventor: Wen-Hsiung CHANG
  • Patent number: 8012797
    Abstract: In one embodiment, a manufacturing method includes: (1) applying a first electrically conductive material to an upper surface of a substrate to form first conductive bumps; (2) electrically connecting a semiconductor device to the upper surface of the substrate; (3) applying a molding material to form a molded structure covering the first conductive bumps and the semiconductor device, upper ends of the first conductive bumps being recessed below an upper surface of the molded structure; (4) forming openings adjacent to the upper surface of the molded structure, the openings exposing the upper ends of the first conductive bumps; (5) applying, through the openings, a second electrically conductive material to form second conductive bumps; and (6) forming cutting slits extending through the molded structure and the substrate.
    Type: Grant
    Filed: August 25, 2009
    Date of Patent: September 6, 2011
    Assignee: Advanced Semiconductor Engineering, Inc.
    Inventors: Chi-Chih Shen, Jen-Chuan Chen, Wen-Hsiung Chang, Chi-Chih Chu, Cheng-Yi Weng
  • Publication number: 20110080661
    Abstract: A lens displacement device includes a flexible piece, a fixed element and a mobile element. The flexible piece has a support, a flexible part and an oscillation absorber. The flexible part connects to the support and at least one gap exists between the flexible part and the support. The oscillation absorber is installed in the gap between the flexible part and the support. Moreover, the fixed element couples to the support of the flexible piece, and the mobile element couples to the flexible part of the flexible piece. Furthermore, the flexible part of the flexible piece is deformed in shape for providing a restoration force with the mobile element. A manufacturing process of the flexible piece is also disclosed.
    Type: Application
    Filed: October 5, 2010
    Publication date: April 7, 2011
    Applicant: WAH HONG INDUSTRIAL CORP.
    Inventors: LI-TE KUO, CHIEN-LIANG CHEN, MEI-LING LAI, WEN-HSIUNG CHANG
  • Publication number: 20100171207
    Abstract: In one embodiment, a manufacturing method includes: (1) applying a first electrically conductive material to an upper surface of a substrate to form first conductive bumps; (2) electrically connecting a semiconductor device to the upper surface of the substrate; (3) applying a molding material to form a molded structure covering the first conductive bumps and the semiconductor device, upper ends of the first conductive bumps being recessed below an upper surface of the molded structure; (4) forming openings adjacent to the upper surface of the molded structure, the openings exposing the upper ends of the first conductive bumps; (5) applying, through the openings, a second electrically conductive material to form second conductive bumps; and (6) forming cutting slits extending through the molded structure and the substrate.
    Type: Application
    Filed: August 25, 2009
    Publication date: July 8, 2010
    Inventors: Chi-Chih Shen, Jen-Chuan CHEN, Wen-Hsiung CHANG, Chi-Chih CHU, Cheng-Yi WENG
  • Publication number: 20100171205
    Abstract: In one embodiment, a semiconductor device package includes: (1) a substrate unit; (2) connecting elements disposed adjacent to a periphery of the substrate unit and extending upwardly from an upper surface of the substrate unit; (3) a semiconductor device disposed adjacent to the upper surface of the substrate unit and electrically connected to the substrate unit; and (4) a package body disposed adjacent to the upper surface of the substrate unit and covering the semiconductor device. A lateral surface of the package body is substantially aligned with a lateral surface of the substrate unit. The package body defines openings that at least partially expose respective ones of the connecting elements. At least one of the connecting elements has a width WC, and at least one of the openings has a width WU adjacent to an upper surface of the package body, such that WU>WC.
    Type: Application
    Filed: July 22, 2009
    Publication date: July 8, 2010
    Inventors: Kuang-Hsiung CHEN, Chi-Chih SHEN, Jen-Chuan CHEN, Wen-Hsiung CHANG, Hui-Shan CHANG, Pei-Yu HSU, Fa-Hao WU, Chen-Yu CHIA, Chi-Chih CHU, Cheng-Yi WENG, Ya-Wen HSU
  • Patent number: 7260318
    Abstract: A computer device capable of playing DVD films without the need of running an operating system is disclosed. The computer device comprises a computer keyboard unit comprising a keyboard controller, a low-voltage differential signal (LVDS) transmitter, wherein the LVDS transmitter has an output end connected to a liquid crystal display (LCD) monitor; a DVD-ROM for reading and outputting audio/video DVD data; a DVD format and image decoder connected to the DVD-ROM through a multiplexer; and a DVD control switch disposed on the computer keyboard unit and connected to the power switching module, wherein the power switching module functions as a controller when the DVD control switch is activated to turn on the work power of the keyboard controller, the DVD-ROM, the DVD format and image decoder, the multiplexer, the image processor, the LVDS transmitter, the LCD monitor, the audio amplifier, and the speaker.
    Type: Grant
    Filed: June 23, 2003
    Date of Patent: August 21, 2007
    Assignee: Clevo Co.
    Inventors: Ming-Chang Wang, Wen Hsiung Chang, Chih Wen Liu
  • Publication number: 20070129101
    Abstract: A telecommunication notebook computer functions as a mobile communication apparuatus and a notebook computer with both monitors. There is a mobile communication module configured in the computer system, which electrically configured to the system chipset, I/O system, built-in controller and other devices via the associated bus. The telecommunication notebook computer utilizes a secondary monitor to display a telecommunication frame to achieve the functionality of mobile communication. The functionality displayed on the secondary monitor provides various data including incoming caller information, short messaging alert, email alert, call receiving, voice dialing, virtual keyboard dialing, incoming/outgoing call history and plurality of mobile phone functionality.
    Type: Application
    Filed: December 4, 2006
    Publication date: June 7, 2007
    Applicant: CLEVO CO.
    Inventors: Ming-Chang Wang, Wen-Hsiung Chang, Chad-Cheng Linwu, Yi-Cih Wu
  • Publication number: 20070104452
    Abstract: A computer apparatus and system having the functionality of one-click video recording enables and stops the video camera module via a controller requesting the system chip. By method of matching to loopup the mapping table embedded in input/output (I/O) system, the functional hotkey is pressing to approach recording image and audio via the execution of the video application program.
    Type: Application
    Filed: October 23, 2006
    Publication date: May 10, 2007
    Applicant: CLEVO CO.
    Inventors: Ming-Chang Wang, Wen-Hsiung Chang, Chia-Chang Chuang, Chad-Cheng Linwu
  • Publication number: 20060292775
    Abstract: A method to make DRAM capable of avoiding bit line leakage is provided. The method comprise the steps of forming transistors on substrate, forming an insulating layer to cover the substrate and the transistors, forming a poly-silicon layer over the insulating layer, forming contact holes in the poly-silicon layer and the insulating layer, the contact holes touching the substrate, filling the contact holes with a conducting layer, and etching the surface of the conducting layer with O2/O3 plasma or an etchant of H2SO4, H2O2 and HF.
    Type: Application
    Filed: June 28, 2005
    Publication date: December 28, 2006
    Inventors: Ping Hsu, Yinan Chen, Wen-Hsiung Chang
  • Publication number: 20040258401
    Abstract: A computer device capable of playing DVD films without the need of running an operating system is disclosed. The computer device comprises a computer keyboard unit comprising a keyboard controller, a low-voltage differential signal (LVDS) transmitter, wherein the LVDS transmitter has an output end connected to a liquid crystal display (LCD) monitor; a DVD-ROM for reading and outputting audio/video DVD data; a DVD format and image decoder connected to the DVD-ROM through a multiplexer; and a DVD control switch disposed on the computer keyboard unit and connected to the power switching module, wherein the power switching module functions as a controller when the DVD control switch is activated to turn on the work power of the keyboard controller, the DVD-ROM, the DVD format and image decoder, the multiplexer, the image processor, the LVDS transmitter, the LCD monitor, the audio amplifier, and the speaker.
    Type: Application
    Filed: June 23, 2003
    Publication date: December 23, 2004
    Inventors: Ming-Chang Wang, Wen Hsiung Chang, Chih Wen Liu
  • Publication number: 20040257320
    Abstract: A computer device capable of displaying television programs without the need of running an operating system is disclosed. The computer device comprises a computer keyboard unit comprising a keyboard controller, a low-voltage differential signal (LVDS) transmitter. The LVDS transmitter has an output end connected to a LCD monitor. A television tuner module is installed in the computer keyboard unit and connected to the keyboard controller. The television tuner module has an output end connected to an audio amplifier having an output end connected to a speaker. A television control switch is installed on the computer keyboard unit and connected to a power switching module.
    Type: Application
    Filed: June 23, 2003
    Publication date: December 23, 2004
    Inventors: Ming-Chang Wang, Chih Wen Liu, Wen Hsiung Chang
  • Publication number: 20040040569
    Abstract: A hair clip comprises first and second clip pieces each having a medial portion with a clipping portion having a plurality of teeth. A first end of the first clip piece is pivoted to a first end of the second clip piece by a pin extending in a direction substantially perpendicular to an extending direction of the teeth. A second end of the first clip piece has a first clipping member formed thereon. A second end of the second clip piece has a second clipping member formed thereon for releasably engaging with the first clipping member. A torsion spring is mounted around the pin for urging the first clip piece and the second clip piece to move away from each other to an open state.
    Type: Application
    Filed: September 3, 2002
    Publication date: March 4, 2004
    Inventor: Wen-Hsiung Chang