Patents by Inventor Wen (Phil) Shih CHEN

Wen (Phil) Shih CHEN has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20250138594
    Abstract: A laptop computer including a casing, an inner frame, and a plurality of electronic modules is provided. The inner frame is detachably assembled to the casing and forms a plurality of receiving zones separated from each other. The electronic modules are respectively disposed in the receiving zones and connected to each other via a plurality of flexible electrical conducting members, and the electrical conducting members pass through a recess structure of the inner frame.
    Type: Application
    Filed: April 1, 2024
    Publication date: May 1, 2025
    Applicant: Acer Incorporated
    Inventors: Yu-Shih Wang, Wen-Chieh Tai, Chih-Chun Liu, Dong-Sheng Wu, Tzu-Wei Lin, Yi-Mu Chang
  • Publication number: 20250140383
    Abstract: Disclosed in the present invention is a temporal information enhancement-based method for 3D medical image segmentation, belonging to the field of medical image segmentation. The method provides a circle transformer module for extraction and fusion of temporal information, and uses temporal input to improve the training effect of a deep learning model, thereby effectively eliminating interference of similar features and blurred images. In a training phase, an input sample is a temporal sequence, the model training effect is enhanced by extracting temporal information, and segmentation results before and after the combination of temporal information are both constrained, so that the model is no longer temporally dependent. In comparison with a training method in which a single sample is input, the present invention can improve the accuracy of an encoder-decoder structure-based segmentation model without costs.
    Type: Application
    Filed: April 12, 2024
    Publication date: May 1, 2025
    Inventors: Xuming ZHANG, Mingwei WEN
  • Publication number: 20250135229
    Abstract: A method for reconstructing a dose distribution for a region of interest includes determining a predicted source intensity distribution of a radiation source; determining a calculated transmission dose distribution based on the predicted source intensity distribution; determining a target source intensity distribution based on the calculated transmission dose distribution and the predicted source intensity distribution; and reconstructing the dose distribution of the region of interest based on the target source intensity distribution.
    Type: Application
    Filed: November 1, 2024
    Publication date: May 1, 2025
    Inventors: Mingming Zhang, Fei Zhao, Libin Wen, Yanfang Liu, Zhao Jin, Fuwei Zhao
  • Publication number: 20250135737
    Abstract: Disclosed herein is an injection molding method for making optical thermoplastic lenses using 3D-printed functional wafers. The method employs a variable injection molding cavity temperature that is heated to at least wafer Tg?10° C.
    Type: Application
    Filed: January 6, 2025
    Publication date: May 1, 2025
    Applicant: Essilor International
    Inventors: Haifeng SHAN, Aref JALLOULI, Hao-Wen CHIU
  • Publication number: 20250134621
    Abstract: A tooth surface laser processing method and a laser processing system for the same are provided. The laser processing method adapted for a tooth comprises the following steps. The tooth is first checked up to obtain tooth information so that one may determine whether the tooth is suitable for laser processing steps. A laser processing system is chosen according to the tooth information, and laser parameters are selected and loaded according to the part on the surface of the tooth and the degree required to be processed. The laser processing steps are performed on the surface of the tooth by the laser processing system to form a laser processed structure on the surface of the tooth. The laser processed structure comprises a plurality of micro-grooves and a plurality of micro-bumps therebetween.
    Type: Application
    Filed: March 26, 2024
    Publication date: May 1, 2025
    Applicant: NATIONAL TSING HUA UNIVERSITY
    Inventors: HUNG-WEN CHEN, YI-JIUN SHEN, CHIA-HUNG CHOU, CHIEN-HUNG CHEN
  • Publication number: 20250136400
    Abstract: The present application discloses a winding method and a winding system, and relates to the technical field of battery fabrication. The winding method includes: obtaining a first parameter and a second parameter of each electrode assembly on a winding needle in real time, the first parameter being any one of a number of winding layers, a sheet length and a winding roll diameter, and the second parameter being one or both of the remaining two of the number of winding layers, the sheet length and the winding roll diameter; comparing the second parameters respectively with corresponding preset parameter ranges, the preset parameter ranges being the ranges of the second parameters corresponding to the first parameters of preset standard models corresponding to the electrode assemblies; and adjusting, in response to the second parameter exceeding the corresponding preset parameter range, sheets to be wound of the corresponding electrode assembly.
    Type: Application
    Filed: January 3, 2025
    Publication date: May 1, 2025
    Inventors: Xiaowei Zhang, Hui Wei, Xiang Wu, Guoda Huang, Yuqian Wen, Minghao Tang, Shengwu Zhang
  • Publication number: 20250135044
    Abstract: The present disclosure relates to a multivalent glyco-complex, an imaging agent and uses thereof. The multivalent glyco-complex includes a plurality of glucose molecules, each of which connects to a central nitrogen atom through a linker, and a chelating group G. The multivalent glyco-complex can be used as an imaging agent to diagnose cancers and to evaluate the therapeutic efficacy of cancers.
    Type: Application
    Filed: October 27, 2023
    Publication date: May 1, 2025
    Inventors: HUNG-WEN YU, Kun-Liang Lin, Mei-Hui Wang
  • Publication number: 20250142728
    Abstract: Provided is a coil carrier board, including a base coil layer, a conductive layer stacked on and bonded to the base coil layer, at least one build-up coil layer stacked on and bonded to the conductive layer, and an opening connecting the base coil layer, the conductive layer and the build-up coil layer. The coil carrier board has thick copper, fine line spacing and appropriate rigidity by means of the build-up circuit process and the structural design of the insulating layer of a photosensitive dielectric material bonded with a thermosetting dielectric material. Accordingly, the high current-carrying efficiency of the coil carrier board is enhanced, and the overall structure of the coil carrier board has better flatness, rigidity and high interlayer alignment accuracy, thereby facilitating miniaturization and automated assembly production.
    Type: Application
    Filed: October 25, 2024
    Publication date: May 1, 2025
    Applicant: PHOENIX PIONEER TECHNOLOGY CO., LTD.
    Inventors: Che-Wei HSU, Wen-Hung HU, Shih-Ping HSU
  • Publication number: 20250142815
    Abstract: A semiconductor device includes a substrate having a medium-voltage (MV) region and an one time programmable (OTP) capacitor region, a MV device on the MV region, and an OTP capacitor on the OTP capacitor region. Preferably, the MV device includes a first gate dielectric layer on the substrate, a first gate electrode on the first gate dielectric layer, and a shallow trench isolation (STI) adjacent to two sides of the first gate electrode. The OTP capacitor includes a fin-shaped structure on the substrate, a doped region in the fin-shaped structure, a second gate dielectric layer on the doped region, and a second gate electrode on the second gate dielectric layer.
    Type: Application
    Filed: November 27, 2023
    Publication date: May 1, 2025
    Applicant: UNITED MICROELECTRONICS CORP.
    Inventors: Chang-Yih Chen, Kuo-Hsing Lee, Chun-Hsien Lin, Wen-Chieh Chang, Kun-Szu Tseng, Sheng-Yuan Hsueh, Yao-Jhan Wang
  • Patent number: 12287507
    Abstract: An illuminated keyboard includes a keyboard module, a circuit board and a backlight module. The keyboard module includes a bracket and at least one first key cap, disposed above the bracket. The circuit board has a first surface facing towards the at least one first key cap and a second surface facing away from the at least one first key cap, at least one top-emitting element is disposed on the first surface, and at least one side-emitting element is disposed on the second surface. The backlight module is disposed below the keyboard module and includes a light guide plate having a slot. The at least one side-emitting element extends into the slot such that the light emitted from the at least one side-emitting element enters the light guide plate. The light passes through a light output zone of the bracket and illuminate the at least one first key cap.
    Type: Grant
    Filed: April 17, 2024
    Date of Patent: April 29, 2025
    Assignee: Lite-On Technology Corporation
    Inventor: Yi-Wen Chen
  • Patent number: 12288730
    Abstract: A semiconductor device includes a substrate, an interconnect structure, and conductive vias. The substrate has a first side, a second side and a sidewall connecting the first side and the second side, wherein the sidewall includes a first planar sidewall of a first portion of the substrate, a second planar sidewall of a second portion of the substrate and a curved sidewall of a third portion of the substrate, where the first planar sidewall is connected to the second planar sidewall through the curved sidewall. The interconnect structure is located on the first side of the substrate, where a sidewall of the interconnect structure is offset from the second planar sidewall. The conductive vias are located on the interconnect structure, where the interconnect structure is located between the conductive vias and the substrate.
    Type: Grant
    Filed: December 27, 2023
    Date of Patent: April 29, 2025
    Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Chang-Jung Hsueh, Cheng-Nan Lin, Wan-Yu Chiang, Wei-Hung Lin, Ching-Wen Hsiao, Ming-Da Cheng
  • Patent number: 12289734
    Abstract: An apparatus and a method of wireless communication are provided. The method by a user equipment (UE) includes being configured by a base station with uplink (UL) grant resources for the UE to perform UL data transmission in an inactive state based on the configured UL grant resources; and performing the UL data transmission on the configured UL grant resources in the inactive state based on traffic characteristic of the UL data transmission and at least one transmission threshold. This can solve issues in the prior art, improve an issue of increasing in power consumption and signalling overhead, provide a good communication performance, and/or provide high reliability.
    Type: Grant
    Filed: August 4, 2021
    Date of Patent: April 29, 2025
    Assignee: PURPLEVINE INNOVATION COMPANY LIMITED
    Inventor: Chiu-Wen Chen
  • Patent number: 12289877
    Abstract: A semiconductor device includes: first and second active regions extending in a first direction and separated by a gap relative to a second direction substantially perpendicular to the first direction; and gate structures correspondingly over the first and second active regions, the gate structures extending in the second direction; and each of the gate structures extending at least unilaterally substantially beyond a first side of the corresponding first or second active region that is proximal to the gap or a second side of the corresponding first or second active region that is distal to the gap; and some but not all of the gate structures also extending bilaterally substantially beyond each of the first and second sides of the corresponding first or second active region.
    Type: Grant
    Filed: November 27, 2023
    Date of Patent: April 29, 2025
    Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
    Inventors: Yu-Jen Chen, Wen-Hsi Lee, Ling-Sung Wang, I-Shan Huang, Chan-yu Hung
  • Patent number: 12285015
    Abstract: Agrochemical formulation, comprising afidopyropen, a cypermethrin like alpha-cypermethrin, a) at least one organic solvent S, b) at least one alkanol substituted amine D, c) at least one aryl sulfonic acid E or their salts, d) at least one organic tricarboxylic acid F or their salts, e) at least one nonionic surfactant G different from components c) to f) and h), f) optionally further components.
    Type: Grant
    Filed: January 18, 2019
    Date of Patent: April 29, 2025
    Assignee: BASF AGRO B.V.
    Inventors: Wen Xu, Kara Walden Benton
  • Patent number: 12288282
    Abstract: This disclosure is directed to a method and apparatus for displaying an expression in a virtual scene. The method includes: displaying a virtual scene; displaying an expression selection region at a first target position in the virtual scene in response to a drag operation on an expression addition icon; and displaying the first target expression in the virtual scene in response to a selection operation on a first target expression in a plurality of first candidate expressions.
    Type: Grant
    Filed: October 24, 2022
    Date of Patent: April 29, 2025
    Assignee: Tencent Technology (Shenzhen) Company Limited
    Inventors: Lin Lin, Haohui Liang, Zixi Liu, Bokai Su, Shanshan Qian, Yiqi Li, Ya Zhang, Yinchao Chen, Han Wen
  • Patent number: 12289040
    Abstract: A driving circuit for driving a light source and a projection device are provided. The driving circuit includes a power converter, a detection circuit, and a control circuit. The power converter provides a driving power to the light source. The detection circuit provides a feedback signal according to a current value of the light source. The control circuit receives an operation command and the feedback signal. The control circuit determines whether the driving circuit enters a light-load state according to at least one of the operation command and the feedback signal. When the driving circuit is determined to enter the light-load state, the control circuit controls the power converter to decrease a current value of the driving power and controls the power converter to increase a switching frequency of the driving power. The driving circuit and the projection device may prevent the light source from flickering under the light-load state.
    Type: Grant
    Filed: September 14, 2022
    Date of Patent: April 29, 2025
    Assignee: Coretronic Corporation
    Inventors: Chia-Wen Hsu, Chen-Wang Chen, Tung-Min Lee
  • Patent number: 12287374
    Abstract: The invention presents a method for estimating a direct current internal resistance of a battery, which defines a depth of discharge detection interval including a first threshold and a second threshold. When the battery is discharging, a currently battery voltage are periodically measured, a currently depth of discharge is calculated, and an open-circuit voltage is queried. The currently battery voltage is subtracted from the open-circuit voltage to obtain a voltage difference. The voltage difference is continuously accumulated to obtain a currently accumulated voltage difference. The currently depth of discharge reaches the first threshold or the second threshold, the currently accumulated voltage difference is a first accumulated voltage difference or a second accumulated voltage difference.
    Type: Grant
    Filed: July 10, 2023
    Date of Patent: April 29, 2025
    Inventors: Shih Fa Hung, Chong-Yong Wu, Wen-Fan Chang
  • Patent number: 12288752
    Abstract: A semiconductor package includes a first die and a through via. The through via is electrically connected to the first die. The through via includes a first conductive layer having a first width, a second conductive layer having a second width different from the first width and a first seed layer disposed aside an interface between the first conductive layer and the second conductive layer.
    Type: Grant
    Filed: July 5, 2023
    Date of Patent: April 29, 2025
    Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Ming-Fa Chen, Nien-Fang Wu, Sung-Feng Yeh, Tzuan-Horng Liu, Chao-Wen Shih
  • Patent number: 12288715
    Abstract: In a method of manufacturing a semiconductor device, a source/drain structure is formed over a substrate, a first interlayer dielectric (ILD) layer including one or more dielectric layers is formed over the source/drain structure, a first opening is formed in the first ILD layer to at least partially expose the source/drain structure, a sacrificial layer is formed on an inner wall of the first opening, a first insulating layer is formed on the sacrificial layer, a conductive layer is formed on the first insulating layer so as to form a source/drain contact in contact with the source/drain structure, the sacrificial layer is removed to form a space between the first insulating layer and the first ILD layer, and a second insulating layer is formed over the source/drain contact and the first ILD layer to cap an upper opening the space, thereby forming an air gap.
    Type: Grant
    Filed: April 17, 2023
    Date of Patent: April 29, 2025
    Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
    Inventors: Yi-Hua Cheng, Ya-Wen Chiu, Yi Che Chan, Lun-Kuang Tan
  • Patent number: D1072801
    Type: Grant
    Filed: January 3, 2025
    Date of Patent: April 29, 2025
    Inventor: Wen Tian