Patents by Inventor Wen-Yi Rai

Wen-Yi Rai has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 6948947
    Abstract: A socket connector for carrying an integrated circuit package includes an insulative housing, a stiffener surrounding the housing, a load plate pivotably assembled with one end of the stiffener and a load lever pivotably attached to the other end of the stiffener. The load plate defines a pair of pressing portions. Each of the pressing portions defines a wider part and a narrower part. During the rotation process of the load plate, the wider part firstly presses a pressing point of the IC package. A critical point, on which the wider part firstly presses, is ascertained that a distance from the critical point to a center of the IC package is approximately 5/24 of the entire length along the same direction. The pressing point is within a range from the critical point to the center of the IC package.
    Type: Grant
    Filed: August 27, 2004
    Date of Patent: September 27, 2005
    Assignee: Hon Hai Precision Ind. Co., Ltd
    Inventors: Genn-Sheng Lee, Chao-Chung Cheng, Wen-Yi Rai
  • Publication number: 20050142919
    Abstract: A socket connector for carrying an integrated circuit package includes an insulative housing, a stiffener surrounding the housing, a load plate pivotably assembled with one end of the stiffener and a load lever pivotably attached to the other end of the stiffener. The load plate defines a pair of pressing portions. Each of the pressing portions defines a wider part and a narrower part. During the rotation process of the load plate, the wider part firstly presses a pressing point of the IC package. A critical point, on which the wider part firstly presses, is ascertained that a distance from the critical point to a center of the IC package is approximately {fraction (5/24)} of the entire length along the same direction. The pressing point is within a range from the critical point to the center of the IC package.
    Type: Application
    Filed: August 27, 2004
    Publication date: June 30, 2005
    Inventors: Genn-Sheng Lee, Chao-Chung Cheng, Wen-Yi Rai