Patents by Inventor Wico Hopman
Wico Hopman has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 10473546Abstract: A hermetic pressure sensor for measuring a fluid pressure includes a hermetic housing, formed of a first housing structure with a membrane section, a second housing structure hermetically connected to the first structure, and one or more strain sensing elements attached to the membrane section. The second housing structure includes openings for one or more electrical pins while a non-conductive hermetic seal holds the electrical pins in place. The pressure sensor measures the pressure of fluid entering the housing while also providing a hermetic seal.Type: GrantFiled: July 28, 2016Date of Patent: November 12, 2019Assignee: Sensata Technologies, Inc.Inventors: Frank Hendri Jacobs, Wico Hopman, Jochem Hendrik Talsma, Jochem Christiaan Nijs, Erik Hop
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Publication number: 20170038272Abstract: A hermetic pressure sensor for measuring a fluid pressure includes a hermetic housing, formed of a first housing structure with a membrane section, a second housing structure hermetically connected to the first structure, and one or more strain sensing elements attached to the membrane section. The second housing structure includes openings for one or more electrical pins while a non-conductive hermetic seal holds the electrical pins in place. The pressure sensor measures the pressure of fluid entering the housing while also providing a hermetic seal.Type: ApplicationFiled: July 28, 2016Publication date: February 9, 2017Inventors: Frank Hendri Jacobs, Wico Hopman, Jochem Hendrik Talsma, Jochem Christiaan Nijs, Erik Hop
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Patent number: 9146164Abstract: In an embodiment, an apparatus includes a first substrate. The first substrate may have a first side for accommodating a first diaphragm. The first substrate may also have a second side. The second side may include a polygonal-shaped depression that is sized to accommodate a second diaphragm associated with a second substrate. The first substrate and first diaphragm may be included in a first assembly and the second substrate and second diaphragm may be included in a second assembly. The first assembly and the second assembly may be included in a stack where at least a portion of the second diaphragm is positioned to fit inside the polygonal-shaped depression in the stack.Type: GrantFiled: March 7, 2013Date of Patent: September 29, 2015Assignee: Sensata Technologies, Inc.Inventors: Wico Hopman, George Van Der Donk, Maarten Van Noorden, Sean DiStefano
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Patent number: 9027410Abstract: Techniques disclosed herein include systems and methods for pressure measurement of fluids including vehicular fluids. The pressure sensor includes a microelectromechanical system (MEMS) sensor for pressure measurement. The MEMS sensor is attached to a glass tube which is compressively sealed to a mounting frame that is attachable to a pressure port of a fluid-containing enclosure. Techniques disclosed herein provide an hermetic seal between the tube and the mounting frame and a rigid seal between the MEMS sensor to a pressure sensor while decoupling thermal expansion stress from the MEMS sensor. With such decoupling techniques, pressure sensing reliability and accuracy can be improved because thermal expansion stress is decoupled from the MEMS sensor. Such techniques provide an accurate, durable, and cost-effective pressure sensor.Type: GrantFiled: September 14, 2012Date of Patent: May 12, 2015Assignee: Sensata Technologies, Inc.Inventors: Erik Hop, Gerard Klaasse, Rob Slakhorst, Wico Hopman, Arnout van den Bos
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Publication number: 20140251030Abstract: In an embodiment, an apparatus includes a first substrate. The first substrate may have a first side for accommodating a first diaphragm. The first substrate may also have a second side. The second side may include a polygonal-shaped depression that is sized to accommodate a second diaphragm associated with a second substrate. The first substrate and first diaphragm may be included in a first assembly and the second substrate and second diaphragm may be included in a second assembly. The first assembly and the second assembly may be included in a stack where at least a portion of the second diaphragm is positioned to fit inside the polygonal-shaped depression in the stack.Type: ApplicationFiled: March 7, 2013Publication date: September 11, 2014Inventors: Wico Hopman, George Van Der Donk, Maarten Van Noorden, Sean DiStefano
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Patent number: 8820170Abstract: Techniques disclosed herein include systems and methods for pressure measurement of fluids including vehicular fluids. The pressure sensor includes a MEMS die for pressure measurement. The MEMS die is attached to a glass pedestal member. The pedestal member is mechanically held in place via a mounting frame that attachable to a pressure port of a fluid-containing enclosure. Techniques herein provide a strong connection of a MEMS die to a pressure sensor while decoupling thermal expansion stress from the MEMS die. With such decoupling techniques, pressure sensing reliability and accuracy can be improved. With thermal expansion stress decoupled from the MEMS die, sensor sealing materials can be selected for their robust chemical properties instead of structural properties. Such techniques provide an accurate, durable, and cost-effective pressure sensor.Type: GrantFiled: September 14, 2012Date of Patent: September 2, 2014Assignee: Sensata Technologies, Inc.Inventors: Rob Slakhorst, Gerard Klaasse, Erik Hop, Arnout van den Bos, Wico Hopman
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Publication number: 20140076057Abstract: Techniques disclosed herein include systems and methods for pressure measurement of fluids including vehicular fluids. The pressure sensor includes a MEMS die for pressure measurement. The MEMS die is attached to a glass pedestal member. The pedestal member is mechanically held in place via a mounting frame that attachable to a pressure port of a fluid-containing enclosure. Techniques herein provide a strong connection of a MEMS die to a pressure sensor while decoupling thermal expansion stress from the MEMS die. With such decoupling techniques, pressure sensing reliability and accuracy can be improved. With thermal expansion stress decoupled from the MEMS die, sensor sealing materials can be selected for their robust chemical properties instead of structural properties. Such techniques provide an accurate, durable, and cost-effective pressure sensor.Type: ApplicationFiled: September 14, 2012Publication date: March 20, 2014Applicant: SENSATA TECHNOLOGIES, INC.Inventors: Rob Slakhorst, Gerard Klaasse, Erik Hop, Arnout van den Bos, Wico Hopman
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Publication number: 20140076059Abstract: Techniques disclosed herein include systems and methods for pressure measurement of fluids including vehicular fluids. The pressure sensor includes a microelectromechanical system (MEMS) sensor for pressure measurement. The MEMS sensor is attached to a glass tube which is compressively sealed to a mounting frame that is attachable to a pressure port of a fluid-containing enclosure. Techniques disclosed herein provide an hermetic seal between the tube and the mounting frame and a rigid seal between the MEMS sensor to a pressure sensor while decoupling thermal expansion stress from the MEMS sensor. With such decoupling techniques, pressure sensing reliability and accuracy can be improved because thermal expansion stress is decoupled from the MEMS sensor. Such techniques provide an accurate, durable, and cost-effective pressure sensor.Type: ApplicationFiled: September 14, 2012Publication date: March 20, 2014Applicant: SENSATA TECHNOLOGIES, INC.Inventors: Erik Hop, Gerard Klaasse, Rob Slakhorst, Wico Hopman, Arnout van den Bos
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Patent number: 8499642Abstract: The invention relates to a fluid pressure sensing device comprising a pressure sensing transducer having a support structure and a diaphragm attached to said support structure, the diaphragm having a fluid facing side. A housing has a transducer receiving cavity defined by a bottom wall and a housing sidewall extending upwardly from the bottom wall. The bottom wall is formed with a fluid pressure receiving recess. A fluid pressure port is formed in the housing in communication with the recess. The diaphragm is positioned between the support structure and the fluid pressure receiving recess and a seal material around a support structure sidewall fixes the pressure sensing transducer in the housing and provides a hermetic seal.Type: GrantFiled: April 29, 2011Date of Patent: August 6, 2013Assignee: Sensata Technologies, Inc.Inventors: Wico Hopman, Robert Zwijze, Paul Gennissen, Maarten van Noorden, George van der Donk, Jans Kruise
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Publication number: 20110296927Abstract: The invention relates to a fluid pressure sensing device comprising a pressure sensing transducer having a support structure and a diaphragm attached to said support structure, the diaphragm having a fluid facing side. A housing has a transducer receiving cavity defined by a bottom wall and a housing sidewall extending upwardly from the bottom wall. The bottom wall is formed with a fluid pressure receiving recess. A fluid pressure port is formed in the housing in communication with the recess. The diaphragm is positioned between the support structure and the fluid pressure receiving recess and a seal material around a support structure sidewall fixes the pressure sensing transducer in the housing and provides a hermetic seal.Type: ApplicationFiled: April 29, 2011Publication date: December 8, 2011Inventors: Wico Hopman, Robert Zwijze, Paul Gennissen, Maarten van Noorden, George van der Donk, Jans Kruise