Abstract: An electrical contact assembly for use as a component of an automated system for testing electronic devices, such as silicon chips. The contact assembly comprises a ring element, a plurality of spring loaded contact probes, an elastic retaining band and alignment pins. The ring element has a plurality of holes that extend through the element from the top to the bottom surfaces, and a groove that encircles the ring element, extending inwardly from its outer peripheral surface, and connects through a small window with each hole. A spring loaded contact probe is positioned in each hole and has a small portion of its surface projecting into the groove through the window associated with each hole. An elastic retaining band is placed in the groove, and partially grasps a portion of the surface of each spring-loaded contact probe, where the surface thereof projects into the groove.

Abstract: A plurality of small articles, such as beam-lead semiconductor devices, are precisely positioned by placing them on the ends of tubular members which are centered in cavities having the form of inverted, truncated, pyramids. The smallest cross section of the cavities is smaller than the smallest article to be positioned. The members slide vertically within the cavities and are resiliently supported by a vacuum chamber for movement therewith. The chamber is lowered with a vertical oscillatory motion, while a slight vacuum is applied, to lower the articles into the cavities and engage them intermittently with the walls of the cavity. This orients and centers the articles in the cavities. A substrate, having sites to which the articles are to be bonded, is coated with a liquefiable substance to render the sites adherent. The substrate is then positioned over the cavities.

Abstract: An article, such as a beam-lead semiconductor device, is precisely oriented by placing it on the end of a tubular member which is centered in a cavity having the form of inverted, truncated, pyramid. The smallest cross section of the cavity is smaller than the smallest article to be positioned. The member slides vertically within the cavity and is resiliently supported by a vacuum chamber for movement therewith. The chamber is lowered with a vertical oscillatory motion, while a slight vacuum is applied, to lower the article into the cavity and engage it intermittently with the walls of the cavity. This orients and centers the article in the cavity.

Abstract: A plurality of small articles, such as beam-lead semiconductor devices, are precisely positioned by placing them on the ends of tubular members which are centered in cavities having the form of inverted, truncated, pyramids. The smallest cross section of the cavities is smaller than the smallest article to be positioned. The members slide vertically within the cavities and are resiliently supported by a vacuum chamber for movement therewith. The chamber is lowered with a vertical oscillatory motion, while a slight vacuum is applied, to lower the articles into the cavities and engage them intermittently with the walls of the cavity. This orients and centers the articles in the cavities. A substrate, having sites to which the articles are to be bonded, is coated with a liquefiable substance to render the sites adherent. The substrate is then positioned over the cavities.