Patents by Inventor William Andrew Smith

William Andrew Smith has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20230319978
    Abstract: An information handling system includes a printed circuit board, a surface mount connector including first and second surface mount connector portions, first and second different pairs, and a ground plane. The first and second surface mount connector portions are mounted on the printed circuit board. The first differential pair is located on the first surface mount connector portion, and the second differential pair is located on the second surface mount connector portion. The ground plane is located in between the first and second surface mount connector portions within the printed circuit board. The first ground via is in physical communication with the ground plane and a first ground pad on a surface of the printed circuit board. The second ground via is in physical communication with the ground plane and a second ground pad on the surface of the printed circuit board.
    Type: Application
    Filed: April 5, 2022
    Publication date: October 5, 2023
    Inventors: William Andrew Smith, Mallikarjun Vasa, Bhyrav M. Mutnury
  • Patent number: 11758306
    Abstract: A cabling-based airflow routing system includes a chassis that defines a chassis housing. A first heat producing component is located in the chassis housing. A first cabling connector is located in the chassis housing. A second cabling connector that is located in the chassis housing. A first ribbon cable that extends through the chassis housing between the first cabling connector and the second cabling connector. The first ribbon cable includes a first cabling airflow routing portion that is oriented in the chassis housing in an airflow path and that is configured to redirect a first portion of an airflow provided in the airflow path towards the first heat producing component.
    Type: Grant
    Filed: July 23, 2020
    Date of Patent: September 12, 2023
    Assignee: Dell Products L.P.
    Inventors: Salvador Jimenez, III, Noman Mithani, William Andrew Smith
  • Patent number: 11436177
    Abstract: A floating device location identification system includes a chassis defining floating device housings and including respective chassis location identification features adjacent each floating device housing that identify the relative location of that floating device housing. A floating device may be positioned in a first floating device housing and adjacent a first chassis location identification feature. The first floating device includes floating device cabling connector(s) that are connected via a cabling subsystem to a device location identification subsystem, and chassis engagement elements that are coupled to the floating device cabling connector(s) and that engage the first chassis location identification feature.
    Type: Grant
    Filed: July 24, 2020
    Date of Patent: September 6, 2022
    Assignee: Dell Products L.P.
    Inventors: William Andrew Smith, Robert G. Bassman, Salvador Jimenez, III, Sanjiv Sinha, Noman Mithani
  • Publication number: 20220027302
    Abstract: A floating device location identification system includes a chassis defining floating device housings and including respective chassis location identification features adjacent each floating device housing that identify the relative location of that floating device housing. A floating device may be positioned in a first floating device housing and adjacent a first chassis location identification feature. The first floating device includes floating device cabling connector(s) that are connected via a cabling subsystem to a device location identification subsystem, and chassis engagement elements that are coupled to the floating device cabling connector(s) and that engage the first chassis location identification feature.
    Type: Application
    Filed: July 24, 2020
    Publication date: January 27, 2022
    Inventors: William Andrew Smith, Robert G. Bassman, Salvador Jimenez, III, Sanjiv Sinha, Noman Mithani
  • Publication number: 20220030331
    Abstract: A cabling-based airflow routing system includes a chassis that defines a chassis housing. A first heat producing component is located in the chassis housing. A first cabling connector is located in the chassis housing. A second cabling connector that is located in the chassis housing. A first ribbon cable that extends through the chassis housing between the first cabling connector and the second cabling connector. The first ribbon cable includes a first cabling airflow routing portion that is oriented in the chassis housing in an airflow path and that is configured to redirect a first portion of an airflow provided in the airflow path towards the first heat producing component.
    Type: Application
    Filed: July 23, 2020
    Publication date: January 27, 2022
    Inventors: Salvador Jimenez, III, Noman Mithani, William Andrew Smith
  • Patent number: 3958748
    Abstract: Folded paperboard carton provided at one end with opposed pairs of major and minor flaps and an elongated tearout tab having a free edge extending along a major portion of the distal edge of the first down major flap and an opposed concomerated edge connection therewith to provide a wide opening; enabling removal of a wide rigid premium such as a children's book or a record as well as enabling well controlled pouring of a product such as a granulated detergent, while leaving spaced apart minor portions of said distal edge on each side of said major portion adhered to the underlying minor flap to define a U-shaped flange around the opening to allow adequate sealing and to keep the carton generally rigid and resistant to bulging after opening; and wherein the second down major flap is adhered to the first down major flap proximally of said tearout tab substantially only adjacent the concamerated edge thereof; the distal edge of the second down major flap defining a reclosure tab for insertion into a mating slit
    Type: Grant
    Filed: November 11, 1975
    Date of Patent: May 25, 1976
    Assignee: The Procter & Gamble Company
    Inventors: William Andrew Smith, Richard Eugene Moyer