Patents by Inventor William B. Mullen, III
William B. Mullen, III has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 6242802Abstract: An integrated circuit package (10) comprises a semiconductor die (14), and a substrate (16) for receiving the semiconductor die. The substrate has an aperture(s) (18) below the semiconductor die for providing moisture relief during temperature excursions. The semiconductor die is wirebonded to the substrate. An encapsulant (12) seals the top surface of the semiconductor die and serves to bond the semiconductor die to the substrate. The encapsulant also covers portions of the top side of the substrate.Type: GrantFiled: July 17, 1995Date of Patent: June 5, 2001Assignee: Motorola, Inc.Inventors: Barry M. Miles, William B. Mullen, III, Glenn E. Gold
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Patent number: 5623127Abstract: A solder clad printed circuit board (100) consists of an electrically insulating substrate that has copper circuit traces (105), portions of which are solderable. A substantially planar layer (120) of a soldering composition is fused to the solderable traces, to form a solder pad that is not domed. The layer is composed of a mass of off-eutectic solder particles (115) that are fused together to form an agglomeration (120) having a porous structure. The solder particles are fused together by heating the off-eutectic solder to a temperature that is between the solidus temperature and the liquidus temperature of the solder. The solder is then cooled below the solidus temperature to solidify it.Type: GrantFiled: December 2, 1994Date of Patent: April 22, 1997Assignee: Motorola, Inc.Inventors: Edwin L. Bradley, III, Kingshuk Banerji, William B. Mullen, III
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Patent number: 5540379Abstract: A soldering process using two different types of solder alloys is disclosed. The first solder alloy (115) undergoes a solid-to-liquid transition at a first temperature. The second solder alloy (120) undergoes this solid-to-liquid transition at a second temperature, the second temperature being greater than the first temperature. The soldering composition is deposited (20) on a substrate (100) having solderable portions (105) and is heated to a temperature that is above the first temperature but below the second temperature (32). During this time, the first solder alloy liquifies, while the second solder alloy remains solid. The soldering composition is subsequently cooled (40) to solidify the first solder material. A part or electronic component is added (80) to the solidified solder material and the solder materials is again heated above the second temperature (30) in order to reflow the solder and form a metallurgical bond between the substrate and the electronic component.Type: GrantFiled: May 2, 1994Date of Patent: July 30, 1996Assignee: Motorola, Inc.Inventors: Vahid Kazem-Goudarzi, Henry F. Liebman, Kingshuk Banerji, William B. Mullen, III, Edwin L. Bradley, III
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Patent number: 5446625Abstract: A chip carrier (20) includes a substrate (11) having a first copper pattern (12) deposited on a first surface (13), and a second copper pattern (14) deposited on a second surface (16). The second copper pattern (14) is plated with a metallic material to form wire bondable areas (18) on the second copper pattern (14), however, the first copper pattern (12) is substantially devoid of the metallic material. A device (21) is wire bonded to the wire bondable areas (18) of the second copper pattern (14), and a protective covering (23) covers the wire bondable areas (18).Type: GrantFiled: December 28, 1994Date of Patent: August 29, 1995Assignee: Motorola, Inc.Inventors: Glenn F. Urbish, William B. Mullen, III, Kingshuk Banerji
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Patent number: 5435481Abstract: A soldering process for use with solder clad printed circuit boards (10) uses a pin transfer means to apply a tacking agent to the substrate. An array of pins (24) is dipped into a film of tacking agent (22). The pins are removed from the tacking agent (26) carrying with them a predetermined amount of tacking agent. The pins are then contacted (27) to the printed circuit board and removed (28). During this process, a predetermined amount of tacking agent is deposited at selective locations on the printed circuit board. A component is placed (30) on the printed circuit board in the tacking agent and the circuit board and component are heated (40) in order to reflow the solder and effect the solder joint between the component and the board.Type: GrantFiled: January 18, 1994Date of Patent: July 25, 1995Assignee: Motorola, Inc.Inventors: Francisco Da Costa Alves, William B. Mullen, III, John M. Nickelsen, Jr.
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Patent number: 5427865Abstract: A solder preform (250) has solder particles of one alloy (210) arranged within a matrix of a second solder alloy (200). This arrangement forms a structure having the desired predetermined shape of the solder preform. The solder particles comprise one or more of the following elements: tin, lead, bismuth, indium, copper, antimony, cadmium, arsenic, aluminum, gallium, gold, silver. The particles have a predetermined melting temperature. The second solder alloy is compositionally distinct from the solder particles, and has a melting temperature that is lower than the melting temperature of the solder particles. The solder particles may comprise about 88% by weight of the solder preform, and the second solder alloy comprises about 12% by weight of the preform.Type: GrantFiled: May 2, 1994Date of Patent: June 27, 1995Assignee: Motorola, Inc.Inventors: William B. Mullen, III, Kingshuk Banerji, Edwin L. Bradley, III, Vahid Kazem-Goudarzi
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Patent number: 5338391Abstract: A selectively releasing runner and substrate assembly (10) comprises a plurality of conductive runners (16) adhered to a substrate (12). A portion (18) of at least some of the conductive runners have a lower adhesion to the substrate for selectively releasing the conductive runner from the substrate when subjected to thermal stress. The selectively releasing runner and substrate assembly is made by selectively depositing an adhesion layer (14) of a first metal to portions of the surface of the substrate where maximum adhesion is desired. The other portions of the substrate are not covered with the first metal. The first metal layer and the uncovered portions of the substrate surface are covered with a second metal layer (16). The adhesion of the second metal layer to the substrate is less than the adhesion of the second metal layer to the first metal layer, and less than the adhesion of the first metal layer tot he substrate. The second metal layer may be copper.Type: GrantFiled: October 12, 1993Date of Patent: August 16, 1994Assignee: Motorola, Inc.Inventors: Anthony B. Suppelsa, William B. Mullen, III, Glenn F. Urbish
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Patent number: 5311059Abstract: A semiconductor device package comprises a substrate (20) having a metallization pattern (22) on at least one surface, and a semiconductor device (10) having an active surface (12) and a grounded surface (14) on opposed sides. The semiconductor device is electrically attached to the substrate metallization pattern with the active surface (12) facing the substrate. A polymeric underfill material (30) substantially fills the space between the semiconductor device and the substrate. An electrically conductive material (35) covers the exposed grounded surface (14) of the semiconductor device and at least a portion of the metallization pattern (22), providing electrical connection between the grounded surface of the semiconductor and the metallization pattern (22) on the substrate.Type: GrantFiled: January 24, 1992Date of Patent: May 10, 1994Assignee: Motorola, Inc.Inventors: Kingshuk Banerji, Fadia Nounou, William B. Mullen, III
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Patent number: 5293067Abstract: An integrated circuit chip carrier assembly, comprising a semiconductor device (10) having interconnection pads (14) disposed on an active surface (12) of the device. The device (10) is attached by means of electrically conducting bumps (26) to a circuitry pattern (18) on a first side of a circuit carrying substrate (16). The substrate is typically an aramid reinforced organic resin, such as epoxy. The circuitry (18, 20) is electrically connected by conductive through-holes (22) to an array of solder pads on a second side of the substrate. Some or all of the through-holes (22) are covered by the device. The overall length and width of the circuit carrying substrate (16) are each a maximum of about 0.15 inches greater than the equivalent dimensions of the device (10), creating a carrier that is only slightly larger than the semiconductor device itself.Type: GrantFiled: June 12, 1992Date of Patent: March 8, 1994Assignee: Motorola, Inc.Inventors: Kenneth R. Thompson, Kingshuk Banerji, William B. Mullen, III
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Patent number: 5280139Abstract: A selectively releasing runner and substrate assembly 10 comprises a plurality of conductive runners 16 adhered to a substrate 12, a portion 18 of at least some of the conductive runners 16 have a lower adhesion to the substrate for selectively releasing the conductive runner from the substrate when subjected to a predetermined stress.Type: GrantFiled: August 17, 1992Date of Patent: January 18, 1994Assignee: Motorola, Inc.Inventors: Anthony B. Suppelsa, William B. Mullen, III, Glenn F. Urbish
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Patent number: 5241133Abstract: A leadless pad array chip carrier package is disclosed, employing a printed circuit board (22) having an array of solder pads (34) on the bottom side. A semiconductor device (24) is electrically wire bonded (49) and attached with conductive adhesive (47) to the metallization patterns (43, 25) of the printed circuit board (22). A protective plastic cover (26) is transfer molded about the semiconductor device (24) covering substantially all of the top side of the printed circuit board (22).Type: GrantFiled: November 16, 1992Date of Patent: August 31, 1993Assignee: Motorola, Inc.Inventors: William B. Mullen, III, Glenn F. Urbish, Bruce J. Freyman
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Patent number: 5184768Abstract: A solder interconnection verification system is used in verifying the formation of solder joints which are hidden from view under a component (25). Solder material (28) is attached or reflow soldered to component solder pads (26). The substrate solder pads (22) have a small solderable portion (24) attached to, and extending outward from, the solder pads (22). The component is placed on the substrate (20) and reflow soldered to wet the solder (38) to the substrate solder pads (32 and 34), creating an irregularly shaped solder joint (38). The joint (38) thus formed is inspected using x-rays after reflow.Type: GrantFiled: November 29, 1990Date of Patent: February 9, 1993Assignee: Motorola, Inc.Inventors: Robert S. Hall, Glenn F. Urbish, William B. Mullen, III
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Patent number: 5177134Abstract: A tacking agent is provided for use in temporarily adhering electronic components and providing fluxing properties for soldering electronic assemblies. The tacking agent comprises a fluxing agent and a tackifier. The fluxing agent is composed of one or more carboxylic acids having the formula ##STR1## where R is an alkyl group containing from 1 to 6 carbon atoms, R' is selected from the group consisting of hydrogen and hydroxyl, and R" is selected from the group consisting of hydrogen, hydroxyl and carboxyl. The tackifier comprises one or more alcohols, aromatic hydrocarbon solvents, aliphatic hydrocarbon solvents, or polymers. The tacking agent is deposited onto a printed circuit board or other substrate, the electronic components are placed into the deposited tacking agent and soldered. During solder reflow the fluxing agent provides fluxing action for the soldering process, and the tackifier volatilizes, leaving little or no residue on the printed circuit board.Type: GrantFiled: December 3, 1990Date of Patent: January 5, 1993Assignee: Motorola, Inc.Inventors: William B. Mullen, III, Anthony B. Suppelsa, Robert W. Pennisi
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Patent number: 5166774Abstract: A selectively releasing runner and substrate assembly 100 comprises a plurality of conductive runners 116 adhered to a substrate 112, a portion 118 of at least some of the conductive runners 116 have non-planar areas with the substrate 112. Additionally the portion 118 has a lower adhesion to the substrate for selectively releasing the conductive runner 118 from the substrate 112 when subjected to a predetermined stress.Type: GrantFiled: October 5, 1990Date of Patent: November 24, 1992Assignee: Motorola, Inc.Inventors: Kingshuk Banerji, Anthony B. Suppelsa, William B. Mullen, III.
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Patent number: 5024372Abstract: A method of forming solder bumps includes the steps of applying a thick layer of solder resist to a substrate. The resist is selectively removed to provide wells at solder pads on the substrate. The solder paste is applied to the substrate in the wells. The solder paste is reflowed to form solder bumps on the pads. A socket for a solder bumped member is obtained by first providing a substrate having metalized pads corresponding to the solder bumps of the member. A thick layer of photo definable solder resist is applied to the substrate. The resist is selectively removed to provide wells at the metalized pads of the substrate. Solder paste is then deposited in the wells. The solder bumped member can then be positioned so that the solder bumps are located in the wells. The solder paste is reflowed to bond to the solder bumps and the metalized pads. The solder paste can be selected to have a lower melting temperature than the solder bumps.Type: GrantFiled: May 9, 1990Date of Patent: June 18, 1991Assignee: Motorola, Inc.Inventors: Leonard F. Altman, Jill L. Flaugher, Anthony B. Suppelsa, William B. Mullen, III
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Patent number: 4889275Abstract: A method for effecting high density solder interconnects between a substrate and at least one metalized film having through holes therein is provided. Solder is first applied to metalized portions of the substrates and the solder is then subject to a reflow process to provide reflowed solder. Pressure is applied to the reflowed solder during a second reflow process to provide prestressed or shaped solder. The metalized film is then positioned with at least one metalized portion adjacent to the shaped solder. Heat, as from a laser, is directed through the through holes in the film to melt the solder and form solder interconnections between the substrate and the metalized film.Type: GrantFiled: November 2, 1988Date of Patent: December 26, 1989Assignee: Motorola, Inc.Inventors: William B. Mullen, III, Douglas W. Hendricks
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Patent number: 4878851Abstract: An electrical socket is provided which includes a connector element to which a soluble temporary housing is attached. The socket is suitable for mounting on a printed circuit board or other substrate. The temporary housing provides a handle which an automatic component placement machine can grip. Once the socket is installed in an aperture in the printed circuit board, the housing is removed via solvent to free-up space on the board.Type: GrantFiled: January 4, 1989Date of Patent: November 7, 1989Assignee: Motorola, Inc.Inventor: William B. Mullen, III
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Patent number: 4877569Abstract: A solvent soluble plastic form (104) is molded around a spring-type battery contact (102) such that one end (102A) of the battery contact projects from the form. A one-piece injection molded thermoplastic housing (202) is then molded around the battery contact and form, thereby molding the end of the battery contact into the housing. The soluble plastic form is then dissolved in an appropriate solvent, leaving a housing with a cavity (202D) that contains the battery contact.Type: GrantFiled: June 6, 1988Date of Patent: October 31, 1989Assignee: Motorola, Inc.Inventors: Glenn F. Urbish, William B. Mullen, III, Charles W. Mooney
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Patent number: 4752244Abstract: An electrical interconnect pin, particularly suitable for attachment to the edge of a flexible printed circuit board or "flex circuit", has an edge clip with an opening that can be temporarily enlarged to facilitate the attachment of the pin to the edge of a circuit board. The pin includes an elongated shank with a rectangular cross section and two substantially identical clips attached to opposite sides of the shank. To attach the pin to a printed circuit board, the pin is placed on a flat surface with the shank parallel to the surface. A force is then applied to the shank just below the clips and perpendicular to the surface. This force opens up the edge clip and the edge of the printed circuit board is then inserted into the opening of the edge clip. After the force is removed, the edge clip clamps down on the circuit board, temporarily attaching the pin to the board. The pins can then be permanently affixed to the board by soldering.Type: GrantFiled: June 25, 1987Date of Patent: June 21, 1988Assignee: Motorola, Inc.Inventors: Virgil F. Kuhl, Lamar Q. Williams, Kenneth M. Wasko, William B. Mullen, III
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Patent number: 4626309Abstract: An interconnection mask which is sandwiched between two members to be bonded together is comprised of a thin sheet of preselected material which has a plurality of apertures therein which are positioned, sized, and shaped to define the common bonding areas between the two members whereby structural failures induced by bonding and loading characteristics of the two members are minimized.Type: GrantFiled: July 2, 1984Date of Patent: December 2, 1986Assignee: Motorola, Inc.Inventors: William B. Mullen, III, James H. Grotelueschen, Robert Henschel