Abstract: Inspection of a surface (14) on a circuit board (10) to detect for defects, such as misinserted leads (18--18) or missing or mis-sized components (20'--20'), is accomplished by directing beams of light (34--34) towards the surface along a first angular direction. The intensity of the light reflected along a second direction from each of a plurality of successive thin strips (40--40) running across the surface (14) is sensed by a linescan camera (36) which moves relative to the circuit board. The output signals produced by the linescan camera, as the linescan camera moves across the circuit board, are processed to obtain image data representative of each of the strips. Only the image data representative of predetermined regions (75--75) within each strip where defects may occur are retained. The retained image data are then analyzed to determine if defects are present.

Abstract: A method and apparatus is disclosed for detecting insulation faults in the insulation of wires being stranded into cable. A voltage is applied to a bead-chain electrode through which the wires are passed, a signal pulse generated upon voltage breaking down between the electrode and a wire, and the simultaneous presence of signal pulses in two or more wires detected. In this manner adjacent insulation faults in two or more wires may be recognized.