Patents by Inventor William D. Morton, Jr.

William D. Morton, Jr. has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 5673966
    Abstract: A seat, which is rectangular shaped (1) pivots on a round plastic member (2) which is fixed to a metal tube (3). A plastic retainer tab (4) when depressed with the fingers, allows the seat to slide along the aluminum extrusion extentions, until the seat assembly is clear from the round plastic member (2). Installing the seat, on the storage platform in the form of a unitary cross-bar (5) is accomplished by engaging the platform with the end of the seat aluminum-extrusion, and sliding the seat to the middle of the seat until the plastic retainer (4) snaps into place. A large disc assembly (6) is attached to the lower end of the metal tube (3) with a retainer pin (7) which engages the disc assembly (6) to the metal tube (3) in one of several selective positions. Storage of the disc assembly (6) to the storage platform (5) is accomplished by removing the retainer pin (7) then separating it from the metal tube (3).
    Type: Grant
    Filed: October 7, 1996
    Date of Patent: October 7, 1997
    Assignee: William D. Morton, Jr.
    Inventor: William D. Morton, Jr.
  • Patent number: 4928934
    Abstract: A carrier for an integrated circuit (IC) can has a plurality of low profile symmetrically distributed flexible arms extending from the carrier base with small hook projections for engaging a flange on the perimeter of the can. The low arm profile enables information to be printed on the side of the can while it is in the carrier. The symmetrical distribution of the flexible arms imparts an even load upon the can to prevent bending of the leads. The carrier base has round holes for receiving electrical leads projecting from the can to minimize the scraping of the leads during insertion and removal of the can from the carrier.
    Type: Grant
    Filed: July 27, 1989
    Date of Patent: May 29, 1990
    Assignee: Precision Monolithics, Inc.
    Inventor: William D. Morton, Jr.
  • Patent number: 4454413
    Abstract: A plurality of carriers for integrated circuit devices are each uniquely coded so as to be recognizable by an automatic decoding apparatus. The devices are tested and the test results accurately correlated with the appropriate devices by recording the test results for each device, reading the identification code for each carrier in the same sequence in which the devices are tested, and then correlating the test results with the device identifications. A prior art requirement of maintaining the carriers in the order in which they were tested is eliminated once the carriers have been thus identified. In a preferred embodiment the carrier body is provided with an array of perforations, the transmission of light through each perforation being blocked by a breakable membrane. Each carrier is coded by breaking a selected combination of its membranes to establish a unique binary identification code for each carrier.
    Type: Grant
    Filed: February 19, 1982
    Date of Patent: June 12, 1984
    Assignee: Precision Monolithics, Inc.
    Inventor: William D. Morton, Jr.
  • Patent number: 4444309
    Abstract: A carrier for a leadless integrated circuit chip has a cavity into which a chip is laterally inserted through an opening in a side wall of the carrier. A spring arm formed integrally with the carrier flexes backward in a recess to permit insertion of the chip, which has a plurality of electrical contact pads on its upper surface, and then bears against the chip under an internal spring bias to retain it within the cavity. Tabs at the upper corners of the cavity are positioned over the corners of the chip which are free of electrical contact pads, thereby preventing the chip from escaping while exposing the pads for both single and dual pin probing. The external configuration of the carrier conforms to industry standards so that the chip can be fully processed and tested without removing it from the carrier.
    Type: Grant
    Filed: February 19, 1982
    Date of Patent: April 24, 1984
    Assignee: Bourns, Inc.
    Inventor: William D. Morton, Jr.