Abstract: An illuminated push button, an illuminated instrument cluster for a conveyance, and a lighting system for a conveyance are discussed. The push button can include a light sheet mounted on a base portion, such that light from the LED chips in the light sheet travels away from the base portion. The illuminated instrument cluster can include a lens mask assembly; an appliqué disposed behind the lens mask assembly with translucent graphical information and optically transmissive diffusion material, a housing, a light sheet, and a printed circuit board configured to address and drive the light sheet material. The light active sheet material is mounted behind the appliqué, such that light from the LED chips travels through the graphical information of the appliqué. The lighting system includes a light sheet; and an adhesive disposed on the light sheet. The light active sheet material is formed as lighting for a conveyance.

Abstract: A lighting system includes a leadframe, and a light active sheet material laminated on the leadframe and electrically connected to the leadframe. The light active sheet material includes a transparent electrically conductive top substrate, a pattern of one or more light emitting diode (LED) chip(s) sandwiched between the leadframe and the top substrate, and a non-conductive transparent adhesive material disposed between the leadframe, the LED chip(s), and the top substrate. The LED chip(s) is (are) preformed before being patterned in the light active sheet material as an unpackaged discrete semiconductor device having an anode p-junction side and a cathode n-junction side. Either of the anode and the cathode side is in electrical communication with the top substrate and the other of the anode and the cathode side is in electrical communication with the leadframe.

Abstract: A transparent lighting system for a conveyance includes a transparent light active sheet material and an adhesive disposed on the transparent light active sheet material. The transparent light active sheet material includes top and bottom electrically conductive transparent substrates, a pattern of light emitting diode (LED) chips sandwiched between the electrically conductive transparent substrates, and a non-conductive transparent adhesive material disposed between the top and bottom electrically conductive transparent substrates and the LED chips. The LED chips are preformed before being patterned in the light active sheet material as an unpackaged discrete semiconductor device having an anode p-junction side and a cathode n-junction side.

Abstract: A LED lamp mounting assembly for use in motor vehicle lamps is described. The LED lamp mounting assembly connects a LED lamp to a pre-existing incandescent lamp socket in a motor vehicle. The LED lamp mounting assembly therefore allows a LED lamp to be operated from incandescent lamp hardware. In one embodiment, the LED lamp mounting assembled includes a LED lamp assembly, a heat sink, a cradle, printed circuit boards and an electrical connector. The electrical connector is insertable into the incandescent lamp socket and connects to the printed circuit boards. The printed circuit boards power the LED lamp assembly and the heat sink adsorbs excess heat created by the LED lamp assembly. The motor vehicle lamp becomes a LED lamp without any changes to the existing incandescent lamp hardware.