Patents by Inventor William DOS SANTOS FEGADOLLI

William DOS SANTOS FEGADOLLI has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11506838
    Abstract: A photonic integrated circuit (PIC) having a substrate in which vertically coupled photodetectors and in-line optical modulators are integrated to enable vertical coupling of light using a fiber assembly block (FAB), with the planar end surface thereof being attached to a substantially planar main surface of the substrate. In an example embodiment, the photodetectors are buried in deep vias formed in the substrate, and the in-line optical modulators are waveguide-connected to the corresponding vertical-coupling optical gratings. The photodetectors and optical gratings may be arranged in a linear array along the main surface of the substrate to enable uncomplicated optical alignment of end segments of the optical fibers in the FAB with the corresponding photodetectors and optical gratings for vertical coupling of light therebetween. In some embodiments, the FAB may have more than one hundred optical fibers. In some embodiments, the PIC can be implemented using the silicon photonics material platform.
    Type: Grant
    Filed: April 22, 2020
    Date of Patent: November 22, 2022
    Assignee: Nokia Solutions and Networks Oy
    Inventor: William dos Santos Fegadolli
  • Patent number: 11256049
    Abstract: An apparatus includes a dielectric support substrate with one or more planar major surfaces and one or more optical fiber interfaces fixed to the support substrate adjacent one of the one or more planar major surfaces. Each optical fiber interface has optical modulators and photodetectors. The apparatus also includes one or more digital signal processing chips fixed to the support substrate adjacent one of the one or more planar major surfaces, and laterally separated from and communicatively connected via metallic lines to the one or more optical fiber interfaces. The apparatus also includes a first set of one or more metallic heatsinks adjacent the one or more digital signal processing chips to provide heat dissipation therefrom. The apparatus also includes a second set of one or more metallic heatsinks being located adjacent the one or more optical fiber interfaces to provide heat dissipation therefrom and physically separated by a distance from the one or more metallic heatsinks of the first set.
    Type: Grant
    Filed: April 22, 2020
    Date of Patent: February 22, 2022
    Assignee: Nokia Solutions and Networks Oy
    Inventor: William dos Santos Fegadolli
  • Publication number: 20210333472
    Abstract: A photonic integrated circuit (PIC) having a substrate in which vertically coupled photodetectors and in-line optical modulators are integrated to enable vertical coupling of light using a fiber assembly block (FAB), with the planar end surface thereof being attached to a substantially planar main surface of the substrate. In an example embodiment, the photodetectors are buried in deep vias formed in the substrate, and the in-line optical modulators are waveguide-connected to the corresponding vertical-coupling optical gratings. The photodetectors and optical gratings may be arranged in a linear array along the main surface of the substrate to enable uncomplicated optical alignment of end segments of the optical fibers in the FAB with the corresponding photodetectors and optical gratings for vertical coupling of light therebetween. In some embodiments, the FAB may have more than one hundred optical fibers. In some embodiments, the PIC can be implemented using the silicon photonics material platform.
    Type: Application
    Filed: April 22, 2020
    Publication date: October 28, 2021
    Applicant: Nokia Solutions and Networks OY
    Inventor: William dos Santos Fegadolli
  • Publication number: 20210333494
    Abstract: An apparatus includes a dielectric support substrate with one or more planar major surfaces and one or more optical fiber interfaces fixed to the support substrate adjacent one of the one or more planar major surfaces. Each optical fiber interface has optical modulators and photodetectors. The apparatus also includes one or more digital signal processing chips fixed to the support substrate adjacent one of the one or more planar major surfaces, and laterally separated from and communicatively connected via metallic lines to the one or more optical fiber interfaces. The apparatus also includes a first set of one or more metallic heatsinks adjacent the one or more digital signal processing chips to provide heat dissipation therefrom. The apparatus also includes a second set of one or more metallic heatsinks being located adjacent the one or more optical fiber interfaces to provide heat dissipation therefrom and physically separated by a distance from the one or more metallic heatsinks of the first set.
    Type: Application
    Filed: April 22, 2020
    Publication date: October 28, 2021
    Inventor: William dos Santos Fegadolli
  • Patent number: 10120133
    Abstract: A method of forming an optical device includes obtaining a wafer having multiple optical device dies that each includes a waveguide. The method also includes forming a facet on the waveguide of different dies. The method further includes separating the dies from the wafer after forming the facets. The dies are separated from the wafer such that the facets are positioned at an edge of the dies.
    Type: Grant
    Filed: December 18, 2015
    Date of Patent: November 6, 2018
    Assignee: Mellanox Technologies Silicon Photonics Inc.
    Inventors: Scott Benjamin Golper, William Dos Santos Fegadolli, Arin Abed
  • Publication number: 20170176682
    Abstract: A method of forming an optical device includes obtaining a wafer having multiple optical device dies that each includes a waveguide. The method also includes forming a facet on the waveguide of different dies. The method further includes separating the dies from the wafer after forming the facets. The dies are separated from the wafer such that the facets are positioned at an edge of the dies.
    Type: Application
    Filed: December 18, 2015
    Publication date: June 22, 2017
    Inventors: Scott Benjamin Golper, William Dos Santos Fegadolli, Arin Abed
  • Publication number: 20160025626
    Abstract: A silicon photonic crystal nanobeam cavity device is described, including a heater that can set a desired temperature on the cavity device in order to control its resonant wavelength. The device has no cladding, which is advantageous for sensing. Biosensing applications with temperature control can be carried out with the nanobeam cavity device.
    Type: Application
    Filed: July 16, 2015
    Publication date: January 28, 2016
    Inventors: William DOS SANTOS FEGADOLLI, Axel SCHERER
  • Patent number: 9214787
    Abstract: Novel methods and systems for miniaturized lasers are described. A photonic crystal is bonded to a silicon-on-insulator wafer. The photonic crystal includes air-holes and can include a waveguide which couples the laser output to a silicon waveguide.
    Type: Grant
    Filed: April 17, 2015
    Date of Patent: December 15, 2015
    Assignee: CALIFORNIA INSTITUTE OF TECHNOLOGY
    Inventors: Seheon Kim, William Dos Santos Fegadolli, Axel Scherer
  • Publication number: 20150222092
    Abstract: Novel methods and systems for miniaturized lasers are described. A photonic crystal is bonded to a silicon-on-insulator wafer. The photonic crystal includes air-holes and can include a waveguide which couples the laser output to a silicon waveguide.
    Type: Application
    Filed: April 17, 2015
    Publication date: August 6, 2015
    Inventors: Seheon KIM, William DOS SANTOS FEGADOLLI, Axel SCHERER
  • Patent number: 9091807
    Abstract: Methods and devices for a tunable photonic crystal nanobeam cavity are disclosed. Such nanobeam cavity has high Q-factor and can be integrated with a microheater. The resonant wavelength of the cavity can be tuned to attain a high modulation depth with low power consumption.
    Type: Grant
    Filed: October 10, 2013
    Date of Patent: July 28, 2015
    Assignee: CALIFORNIA INSTITUTE OF TECHNOLOGY
    Inventors: William Dos Santos Fegadolli, Axel Scherer
  • Patent number: 9042418
    Abstract: Novel methods and systems for miniaturized lasers are described. A photonic crystal is bonded to a silicon-on-insulator wafer. The photonic crystal includes air-holes and can include a waveguide which couples the laser output to a silicon waveguide.
    Type: Grant
    Filed: December 23, 2013
    Date of Patent: May 26, 2015
    Assignee: CALIFORNIA INSTITUTE OF TECHNOLOGY
    Inventors: Seheon Kim, William Dos Santos Fegadolli, Axel Scherer
  • Publication number: 20140226691
    Abstract: Novel methods and systems for miniaturized lasers are described. A photonic crystal is bonded to a silicon-on-insulator wafer. The photonic crystal includes air-holes and can include a waveguide which couples the laser output to a silicon waveguide.
    Type: Application
    Filed: December 23, 2013
    Publication date: August 14, 2014
    Applicant: CALIFORNIA INSTITUTE OF TECHNOLOGY
    Inventors: Seheon KIM, William DOS SANTOS FEGADOLLI, Axel SCHERER
  • Publication number: 20140161386
    Abstract: Methods and devices for a tunable photonic crystal nanobeam cavity are disclosed. Such nanobeam cavity has high Q-factor and can be integrated with a microheater. The resonant wavelength of the cavity can be tuned to attain a high modulation depth with low power consumption.
    Type: Application
    Filed: October 10, 2013
    Publication date: June 12, 2014
    Inventors: William DOS SANTOS FEGADOLLI, Axel SCHERER