Patents by Inventor William Fred Martin-Otto

William Fred Martin-Otto has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 7471508
    Abstract: A computer has a cover supporting a display and a base supporting a processor and hingedly coupled to the cover. A locking assembly includes a locking mechanism that is advanceable into a lock hole of the computer and that can be tethered to a stationary object to prevent theft of the computer. As the locking assembly is advanced into the hole, it moves a coupling that blocks the computer's cover latch mechanism from releasing the cover from a closed position against the base of the computer, thereby also locking the computer in the closed configuration.
    Type: Grant
    Filed: July 1, 2006
    Date of Patent: December 30, 2008
    Assignee: Lenovo (Singapore) Pte. Ltd.
    Inventor: William Fred Martin-Otto
  • Publication number: 20080001507
    Abstract: A computer has a cover supporting a display and a base supporting a processor and hingedly coupled to the cover. A locking assembly includes a locking mechanism that is advanceable into a lock hole of the computer and that can be tethered to a stationary object to prevent theft of the computer. As the locking assembly is advanced into the hole, it moves a coupling that blocks the computer's cover latch mechanism from releasing the cover from a closed position against the base of the computer, thereby also locking the computer in the closed configuration.
    Type: Application
    Filed: July 1, 2006
    Publication date: January 3, 2008
    Inventor: William Fred Martin-Otto
  • Patent number: 7224587
    Abstract: A chip sandwich includes a heat sink, a retention module, a computer chip mounted in a socket on a mother board, a wave washer spring and a mounting plate. The heat sink is mounted on the retention module using cams, hooks and heat sink tabs to provide an initial orientation of the heat sink over the computer chip. To provide final contact pressure between the heat sink and the computer chip, a wave washer spring oriented beneath the computer chip and under the mother board provides an upward pressure against the bottom of the mother board, and particularly against the center of the computer chip. Thus, by the wave washer spring pushing against the center of the computer chip, secure contact pressure is provided between the heat sink and the computer chip, while minimizing the amount of pressure between the computer chip's pins and the chip socket.
    Type: Grant
    Filed: June 18, 2004
    Date of Patent: May 29, 2007
    Assignee: International Business Machines Corporation
    Inventors: Karl Klaus Dittus, Timothy Samuel Farrow, Walter Adrian Goodman, Dean Frederick Herring, William Fred Martin-Otto, Rodrigo Samper, John Paul Scavuzzo
  • Patent number: 7009844
    Abstract: A retention module firmly secures a heat sink for a computer chip. The retention module is oriented about the computer chip on a circuit board. The retention module has a rotatable wire form that has two loops. When the rotatable wire form is rotated, the two loops press against an impingement shelf on the heat sink, forcing the heat sink against the retention module and the computer chip. The two loops are angularly offset to each other, thus compensating for torsion lag between the two loops when the two loops are pressed against the impingement shelf.
    Type: Grant
    Filed: June 18, 2004
    Date of Patent: March 7, 2006
    Assignee: International Business Machines Corporation
    Inventors: Timothy Samuel Farrow, Dean Frederick Herring, William Fred Martin-Otto