Abstract: The bond strength of electrical leads (12) bonded to a device (13), such as a silicon integrated circuit chip, is tested by mounting the device (13) onto a pedestal (22) and then pulling on such lead with a freely manipulatable grasping tool (52). The pedestal (22) is coupled to a load sensitive mechanism, such as a simple balance arm (19), or a movable element (21) coupled to a load cell (56). Such mechanism is adjusted to register that part of the pulling force exerted by the grasping tool (52), which is transmitted through the interface between the lead (12) and the device (13).

Abstract: An oriented array of small, fragile electrical devices such as beam lead transistors or integrated circuits, partially embedded in wax, are removed from the wax and transferred to a releasable mounting without disrupting the orientation of the devices. The releasable mounting comprises a plate with a layer of silicone rubber or resin which exerts a suction or vacuum holding force on the array of oriented devices.

Abstract: An oriented array of small, fragile electrical devices such as beam lead transistors or integrated circuits, partially embedded in wax, are removed from the wax and transferred to a releasable mounting without disrupting the orientation of the devices. The releasable mounting comprises a plate with a layer of silicone rubber or resin which exerts a suction or vacuum holding force on the array of oriented devices.

Abstract: An array of discrete semiconductor devices is formed by photoresist and etching techniques in a semiconductor wafer waxed to a support. The photoresist material is then removed and the devices are tested. Next, a substrate is coated with silicone resin to which the devices will adhere. The devices found from the test to have a first characteristic are transferred to the resin-coated substrate to form a new array of first characteristic semiconductor devices with the original orientation. The devices are pressed against the resin by means of a polytetrafluoroethylene screen overlaid with a stainless steel screen and trichlorethylene is flowed through the screens to the devices to remove any remanent wax. When the screens are removed the devices do not stick to the polytetrafluorethylene screen, which had been against them, but remain held on the resin coated substrate in their originally oriented array.

Abstract: An oriented array of small, fragile electrical devices such as beam lead transistors or integrated circuits, partially embedded in wax, are removed from the wax and transferred to a releasable mounting without disrupting the orientation of the devices. The releasable mounting comprises a plate with a layer of silicone rubber or resin which exerts a suction or vacuum holding force on the array of oriented devices.