Patents by Inventor William R. Zdanis

William R. Zdanis has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 5077115
    Abstract: A thermoplastic composite material is presented which comprises a thermoplastic matrix which is highly filled with a coated ceramic filler. In an important feature of the present invention, the ceramic filler has been coated with a rubbery polymer that bonds to the filler. In a preferred embodiment, the thermoplastic matrix comprises a fluoropolymer, preferably a chlorofluoropolymer and the ceramic filler is a fused amorphous silica coated with a rubbery polymeric material. The thermoplastic composite material of this invention exhibits numerous advantages which makes it well suited for use as a bonding film, particularly a bonding film for producing multilayer printed wiring boards.
    Type: Grant
    Filed: May 8, 1990
    Date of Patent: December 31, 1991
    Assignee: Rogers Corporation
    Inventors: David J. Arthur, Allen F. Horn, III, Kenneth W. Kristal, Gwo S. Swei, William R. Zdanis
  • Patent number: 4987274
    Abstract: A ceramic filled fluoropolymer composite coaxial cable insulation and the coaxial cable made therefrom is presented. In accordance with the present invention, the coaxial cable insulation is comprised of 60-25% fluoropolymer that is fibrillatable, 40-75% ceramic filler and a void content which is effective to provide a dielectric constant of approximately less than 2.30. In a preferred embodiment of the present invention, the coaxial cable insulative composite comprises approximately 40 weight percent PTFE, 60 weight percent fused amorphus silica and a void volume percent of between 30 and 60. Also in certain preferred embodiemnts, the composite may include 1-4% by weight of microfiberglass filler and the ceramic filler may be coated with a silane coating. The provision of the void volume is an important feature of the present invention and acts to substantially lower the overall dielectric constant of the insulative composite.
    Type: Grant
    Filed: June 9, 1989
    Date of Patent: January 22, 1991
    Assignee: Rogers Corporation
    Inventors: Terry L. Miller, William R. Zdanis, Jr., Graham A. Woerner, Allen F. Horn, III