Abstract: A computing device includes memory configured for storing executable instructions, a processor configured for executing the instructions, a spine member, where the spine member includes the memory and the processor, and a plurality of display pages, each display page coupled at a first edge of the page to the spine member and having a second edge, opposite the first edge that is free to rotate about an axis defined by the spine member, wherein at least one page includes two separately controllable OLED displays on opposite sides of the page.

Abstract: The present disclosure provides an electronic device utilizing a flexible display panel with multiple relief features formed in a periphery bending portion of the flexible display panel. The multiple relief features may facilitate lamination of the flexible display to a curved cover layer. The flexible display panel may have a circular shape utilized in a wearable device. An active area for displaying images may extend to the periphery bending portion of the flexible display panel, thus provided a wide viewing range for a user as well as enhancing an overall aesthetic appearance of the electronic device.

Abstract: A computing device includes memory configured for storing executable instructions, a processor configured for executing the instructions, a spine member, where the spine member includes the memory and the processor, and a plurality of display pages, each display page coupled at a first edge of the page to the spine member and having a second edge, opposite the first edge that is free to rotate about an axis defined by the spine member, wherein at least one page includes two separately controllable OLED displays on opposite sides of the page.

Abstract: A computing device includes memory configured for storing executable instructions, a processor configured for executing the instructions, a foldable display layer configured for displaying information in response to the execution of the instructions, and a bend limit layer coupled to the foldable display layer and arranged substantially parallel to a display surface of the foldable display layer. The bend limit layer is configured to increase its stiffness non-linearly when a radius of a bend of the bend limit layer is less than a threshold radius of curvature of the foldable display layer, the threshold radius of curvature being greater than 1 mm and less than 20 mm.

Abstract: An apparatus includes a first layer including unidirectional first fibers oriented in a first direction and embedded within the first layer, where the first layer has a thickness of less than 25 ?m and a second layer bound to the first layer, the second layer including unidirectional second fibers oriented in a second direction and embedded within the second layer, where the first layer has a thickness of less than 25 ?m and where the first direction is nonparallel to the second direction.

Abstract: A foldable display of a computing device includes a back stiffening layer, a transparent frontplate layer, a transparent cover window layer, and an OLED display layer disposed between the back stiffening layer and the transparent frontplate layer. The OLED display layer characterized by a Young's modulus that is lower than the Young's modulus of the transparent frontplate layer and that is lower than the Young's modulus of the back stiffening layer; a neutral plane of the foldable display is located within the OLED display layer.

Abstract: A foldable display of a computing device includes a back stiffening layer, a transparent frontplate layer, a transparent cover window layer, and an OLED display layer disposed between the back stiffening layer and the transparent frontplate layer. The OLED display layer characterized by a Young's modulus that is lower than the Young's modulus of the transparent frontplate layer and that is lower than the Young's modulus of the back stiffening layer; a neutral plane of the foldable display is located within the OLED display layer.

Abstract: A foldable display of a computing device includes a back stiffening layer, a transparent frontplate layer, a transparent cover window layer, and an OLED display layer disposed between the back stiffening layer and the transparent frontplate layer. The OLED display layer characterized by a Young's modulus that is lower than the Young's modulus of the transparent frontplate layer and that is lower than the Young's modulus of the back stiffening layer; a neutral plane of the foldable display is located within the OLED display layer.

Abstract: A computing device includes a case enclosure, a heat-generating electrical component, and a thermal insulator. The thermal insulator has a first surface adhesively bonded to the surface of the case enclosure and has a second surface adhesively bonded to the surface of the heat-generating component. The thermal insulator includes a layer of thermally-insulating material between the first and second surfaces, and the thermally-insulating material has a thermal conductivity less than 35 mW/m-K.

Abstract: A foldable display of a computing device includes a back stiffening layer, a transparent frontplate layer, a transparent cover window layer, and an OLED display layer disposed between the back stiffening layer and the transparent frontplate layer. The OLED display layer characterized by a Young's modulus that is lower than the Young's modulus of the transparent frontplate layer and that is lower than the Young's modulus of the back stiffening layer; a neutral plane of the foldable display is located within the OLED display layer.

Abstract: A computing device includes memory configured for storing executable instructions, a processor configured for executing the instructions, a foldable display layer configured for displaying information in response to the execution of the instructions, and a bend limit layer coupled to the foldable display layer and arranged substantially parallel to a display surface of the foldable display layer. The bend limit layer is configured to increase its stiffness non-linearly when a radius of a bend of the bend limit layer is less than a threshold radius of curvature of the foldable display layer, the threshold radius of curvature being greater than 1 mm and less than 20 mm.

Abstract: In one aspect, a cooling system is provided for use in computing devices, such as laptops, cell phones, and tablet computers. The cooling system includes a heat spreader coupled to a radiator via a heat pipe having a midline. The heat pipe includes a first end portion longitudinally extending along the midline, a second end portion longitudinally extending along the midline, and a mid-portion longitudinally extending along the midline. The mid-portion is located between the first end portion and the second end portion and it has a thickness that is greater than the thicknesses of both the first portion and the second portion thereby reducing the overall thermal resistance of the heat pipe.

Abstract: Techniques of managing heat within an electronic device involve providing a vapor chamber in a ring shape within an electronic device. In some implementations, the vapor chamber forms an outer case wall of an enclosure of the electronic device. In further implementations, the vapor chamber has a fill port attached to the inner edge of the vapor chamber. Advantageously, by using a vapor chamber with a ring geometry in an electronic device according to the improved techniques, a form factor of the electronic device (e.g., a laptop, a tablet, etc.) is not affected by the introduction of the vapor chamber as an outer case wall.

Abstract: Techniques of managing heat within an electronic device involve providing a vapor chamber in a ring shape within an electronic device. In some implementations, the vapor chamber forms an outer case wall of an enclosure of the electronic device. In further implementations, the vapor chamber has a fill port attached to the inner edge of the vapor chamber. Advantageously, by using a vapor chamber with a ring geometry in an electronic device according to the improved techniques, a form factor of the electronic device (e.g., a laptop, a tablet, etc.) is not affected by the introduction of the vapor chamber as an outer case wall.

Abstract: Aspects of the disclosure relate generally to active cooling or removing heat generated by a processor in a computing device. More specifically, a cooling system in a computing device may include a heatpipe which moves heat along a fin pack. The fin pack may include top and bottom ends as well as a plurality of fins. The fins may extend only a portion of the way between the ends thus creating an air duct. The air duct may allow debris to move along an edge of the fin and out of the computing device. The fins may also be curved to promote the forcing of debris through the fin pack while still allowing the heat to be expelled through the fins.

Abstract: An apparatus includes one or more light sources configured to provide light having at least three different colors and a backlight layer configured for diffusing the light. A MEMS-based shutter layer includes a plurality of pixel elements having shutters programmably controlled to allow light from the backlight layer to pass through the shutter layer when the MEMS-based shutter is in an open configuration and to block light from passing through the shutter layer when in a closed configuration. A processor is configured to control the provision of the different colored light from the one or more light sources to the backlight layer and configured to control the passage of light from the backlight layer through the plurality of pixel elements to provide a predetermined image on the display apparatus. A hard, scratch resistant cover glass layer is stacked above the MEMS-based shutter layer.

Abstract: Aspects of the disclosure relate generally to active cooling or removing heat generated by a processor in a computing device. More specifically, a cooling system in a computing device may include a heatpipe which moves heat along a fin pack. The fin pack may include top and bottom ends as well as a plurality of fins. The fins may extend only a portion of the way between the ends thus creating an air duct. The air duct may allow debris to move along an edge of the fin and out of the computing device. The fins may also be curved to promote the forcing of debris through the fin pack while still allowing the heat to be expelled through the fins.

Abstract: Aspects of the disclosure relate generally to active cooling or removing heat generated by a processor in a computing device. More specifically, a cooling system in a computing device may include a heatpipe which moves heat along a fin pack. The fin pack may include top and bottom ends as well as a plurality of fins. The fins may extend only a portion of the way between the ends thus creating an air duct. The air duct may allow debris to move along an edge of the fin and out of the computing device. The fins may also be curved to promote the forcing of debris through the fin pack while still allowing the heat to be expelled through the fins.

Abstract: A method of using a heat pipe to spot cool a component in a computer case involves disposing an evaporator portion of the heat pipe to be laterally or horizontally adjacent to, but not in direct contact with, the component in the computer case. The method further involves thermally coupling the laterally adjacent component and the evaporator portion of the heat pipe with a bridging heat transfer component.

Abstract: In one aspect, a cooling system is provided for use in computing devices, such as laptops, cell phones, and tablet computers. The cooling system includes a heat spreader coupled to a radiator via a heat pipe having a midline. The heat pipe includes a first end portion longitudinally extending along the midline, a second end portion longitudinally extending along the midline, and a mid-portion longitudinally extending along the midline. The mid-portion is located between the first end portion and the second end portion and it has a thickness that is greater than the thicknesses of both the first portion and the second portion thereby reducing the overall thermal resistance of the heat pipe.