Patents by Inventor William Vieira

William Vieira has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Processes, systems and devices for metal filling of high temperature superconductor cables
    Patent number: 11948704
    Abstract: Techniques described herein relate to systems and methods for obtaining a high temperature superconducting (HTS) cable assembly and filling the HTS cable assembly with a molten metal, such as solder.
    Type: Grant
    Filed: November 12, 2020
    Date of Patent: April 2, 2024
    Assignee: Massachusetts Institute of Technology
    Inventors: Amanda Hubbard, James Irby, Rui Vieira, William Beck, Richard Murray, Andrew Pfeiffer, Thomas Toland, William Burke
  • Projected score area calculator and method of use
    Patent number: 7487045
    Abstract: A device and system for measuring variables relative to a moving object on or over a geographic area, collecting such motion data, collecting environmental data including environmental conditions in the geographic area, collecting field data including data relating to the geographic area, and using the motion data, the environmental data, and the field data to calculate a score factor which defines where on the geographic area the moving object could have been moved from to land in a desired location and transmitting that extracted data to and through a variety of media including a portable device with a display, a personal computer, a broadcasting network or other storage device or system and using that extracted data for entertainment and educational purposes.
    Type: Grant
    Filed: March 10, 2006
    Date of Patent: February 3, 2009
    Inventor: William Vieira