Abstract: A device for use in a sputter system, comprising at least a first end block and a second end block positioned at opposite sides of the sputter system. The device is adapted such that a target assembly comprising at least one target tube or sputter magnetron, when mounted on the first and second end blocks, may be powered actively with RF power at both sides of the assembly, and such that the target assembly, when mounted, is not actively powered continuously with RF power simultaneously at both extremities of a target tube or sputter magnetron. An assembly comprising said device and a control unit for controlling powering of opposite sides of the target assembly by RF power such that the target assembly, when mounted, is not actively powered continuously with RF power simultaneously at both extremities of a target tube or sputter magnetron.

Abstract: A sputtering target having a one-piece top coat comprising a mixture of oxides of zinc, tin, and optionally gallium, characterized in that said one-piece top coat has a length of at least 80 cm; a method for forming such a sputtering target and the use of such a target for forming films.

Abstract: A sputter device for depositing a layer on a substrate in a vacuum chamber and having a layer property in each point of the substrate surface. The sputter device comprises at least one end block adapted for holding a cylindrical target having a longitudinal axis in a first direction, and a first drive means for providing a rotational movement of the at least one cylindrical target around its longitudinal axis. The sputter device includes a second drive means for applying a translational movement to an end block in a second direction. The first and the second drive means are adapted for, during sputtering, being simultaneously operational in the vacuum chamber. The movement of the first drive means does not impact the uniformity of the layer sputtered on the substrate in the direction on the surface of the substrate corresponding to a perpendicular projection of the second direction onto the substrate.

Abstract: A magnetron deposition system for depositing material is disclosed. The magnetron deposition system comprises at least two magnetron units, each magnetron unit comprising a magnet configuration, the at least two magnetron units being arranged so that the magnetron units share a common plasma in a plasma region between the at least two magnetron units. The system furthermore comprises at least one gas inlet for supplying a gas. The at least one gas inlet for supplying a gas and the at least two magnetron units thereby are arranged for directly injecting the first gas in the plasma region between the two magnetron units.

Abstract: A sputter system for applying a coating on a substrate is described. The sputter system comprises at least two cylindrical sputter units for the joint sputtering of a single coating. Each sputter unit comprising an elongated magnet configuration and at least one elongated magnet configuration comprising a plurality of magnet structures and magnet structure control systems along the length direction of the elongated magnet configuration. At least one magnet structure is adjustable in position and/or shape by a magnet structure control system, while a sputter target is mounted on the sputter unit.

Abstract: A cover for a configurable measuring system of a configurable sputtering system which is adapted for sputtering multilayer coatings with varying compositions and comprising a plurality of sputtering zones and having a plurality of apertures on which the cover is detachably attachable, and wherein the cover comprises a sensor system for in situ detection of a property of the multilayer coating on a substrate, wherein said at least one sensor system is attached to the cover.

Abstract: A sputter deposition magnetron system for sputtering material comprises at least a first and a second sputter magnetron unit. Each of the magnetron units comprises a magnet configuration and a mounting element for mounting a target so that the first and second magnet configuration contribute to the formation and confinement of a plasma allowing sputtering of the first respectively second target. The sputter deposition magnetron system furthermore comprises at least one extra magnet configuration distanced from the mounting element for targets, whereby the first, the second and the at least one magnet configuration are arranged for each contributing to a confined plasma configuration wherein at least part of the plasma is shared across the first and the second sputter magnetron unit.

Abstract: A sputtering method and apparatus having at least one set of dual rotatable cylindrical sputtering targets mounted in a vacuum chamber. Magnet assemblies in hollow target cylinders provide erosion zones running long the parallel sides of a racetrack that act as target flux sources towards a substrate. These parallel erosion zones have a highly concentrated plasma density for rapid sputtering of the target and any reactive material. Features include the angular distance between normals to adjacent parallel erosion zones, the angle greater than 45° subtended at the center of the cylindrical target, placement of the substrate with respect to the targets, and pointing angles (orientation or tilt) of the racetracks toward the substrate and/or each other. These parameters form a relatively wide and efficient constant flux deposition region at the substrate, and allows for high deposition rates at constant reactive gas partial pressures with substantially uniform film stoichiometry and thickness.

Abstract: An end-block for rotatably carrying a sputtering target tube and for rotatably restraining a magnet bar inside the sputtering target tube includes a receptacle for receiving a magnet bar fitting. The receptacle comprises a first part of a signal connector arranged to receive a second part of a signal connector from the magnet bar fitting, and allow a signal connector between the end-block and the magnet bar to be formed. The end-block is adapted for providing protection means to the signal connector for protecting it from degradation, destruction or interference of a power and/or data signal transmitted between the end-block and the magnet bar, due to surrounding cooling fluid and/or surrounding high energy fields. The disclosure provides a corresponding magnet bar, and a method for adjusting a magnetic configuration of a magnet bar in a cylindrical sputtering apparatus.

Abstract: A sputtering target having a one-piece top coat comprising a mixture of oxides of zinc, tin, and optionally gallium, characterized in that said one-piece top coat has a length of at least 80 cm; a method for forming such a sputtering target and the use of such a target for forming films.

Abstract: A coating apparatus is revealed that is designed to coat substrates by means of a physical vacuum deposition process or a chemical vacuum deposition process or a combination thereof. Said coating apparatus is particular in that it uses a rotatable magnetron (14) that is coverable with an axially moveable shutter (18). Such an arrangement enables to keep the magnetron target clean or to clean the target in between or even during subsequent coating steps. The shutter further provides for a controllable gas atmosphere in the vicinity of the target. The arrangement wherein the magnetron is centrally placed is described. Substrates are then exposed to the sputtering source from all angles by hanging them on a planetary carousel (24) that turns around the magnetron.

Abstract: An end-block for use in a tubular magnetron sputtering apparatus is disclosed. Such an end-block rotatably transfers movement, coolant 5 and electrical current to the target while maintaining vacuum integrity and a closed coolant circuit. It hence comprises a drive means, a rotary electrical contact means, a bearing means, a number of rotary coolant seal means and a number of vacuum seal means. The inventive end-block occupies a minimal axial length along the target thus allowing 10 space savings in existing equipment such as e.g. display coaters. The axial length is reduced by mounting at least two of the means radial to one another.

Abstract: A sputtering method and apparatus having at least one set of dual rotatable cylindrical sputtering targets mounted in a vacuum chamber. Magnet assemblies in hollow target cylinders provide erosion zones running long the parallel sides of a racetrack that act as target flux sources towards a substrate. These parallel erosion zones have a highly concentrated plasma density for rapid sputtering of the target and any reactive material. Features include the angular distance between normals to adjacent parallel erosion zones, the angle greater than 45° subtended at the center of the cylindrical target, placement of the substrate with respect to the targets, and pointing angles (orientation or tilt) of the racetracks toward the substrate and/or each other. These parameters form a relatively wide and efficient constant flux deposition region at the substrate, and allows for high deposition rates at constant reactive gas partial pressures with substantially uniform film stoichiometry and thickness.

Abstract: A coating apparatus (100) for batch coating of substrates is presented. In the batch coater layers of a stack can be deposited by means of physical vapor deposition, by means of chemical vapor deposition or by a mixture of both processes. When compared to previous apparatus, the mixed mode process is particularly stable. This is achieved by using a rotatable magnetron (112) rather than the prior-art planar magnetrons. The apparatus is further equipped with a rotatable shutter that allows for concurrent or alternating process steps.

Abstract: A module to carry targets in a sputter deposition installation for coating two-sided substrates is described. The module is mountable to the installation through an interface flange that carries at least two targets with their associated magnet systems. When the module is mounted, the targets take positions at opposite sides of the two-sided substrate, while the magnet systems orient the sputter deposition towards the substrate. The module enables coating of both sides of the substrate in one single pass. Different configurations are described with gas distribution systems and additional substrate supports. An enclosure with adjustable blinds in order to reduce gas spreading is also included.

Abstract: The invention relates to a rotatable sputter target and to a method to manufacture such a sputter target. The sputter target comprises a target material and a magnet array located at the interior of the target material. The magnet array defines a central zone extending along the major part of the length of the target material and defines an end zone at each end of the central zone. The target material comprises a first material and a second material. The target material comprises the first material at least on the central zone and comprises the second material at least on the end zones. The second material has a lower sputter deposition rate than the first material. The second material is preferably applied by thermal spraying. The first material comprises a first element and the second material comprises a compound of the first element of the first material.

Abstract: The invention relates to a method to manufacture an oxide sputter target. The method comprises the steps of providing a target holder; applying an outer layer of a sputterable material on the target holder by simultaneously spraying at least one oxide and at least one metal. The outer layer of sputterable material comprises a first phase and a second phase. The first phase comprises an oxide of at least a first metal and a second metal; the second phase comprises a metal in its metallic phase. The metal in its metallic phase forms discrete volumes arranged in or between the oxide of the first phase. The outer layer of sputterable material comprises between 0.1 and 20 wt % metal in its metallic phase. The invention further relates to an oxide sputter target.

Abstract: The invention relates to a substrate covered at least partially with a layered coating. The layered coating comprises an intermediate coating and a hard carbon coating. The intermediate coating comprises a first metal layer deposited on the substrate, the first metal layer comprising at least one element of group IVB, group VB or group VIB; a nitride layer deposited on the first metal layer, the nitride layer comprising at least one nitride of an element of group IVB, group VB or group VIB; a second metal layer deposited on the nitride layer, the second metal layer comprising at least one element of group IVB, group VB or group VIB; a transition layer deposited on the second metal layer, the transition layer comprising at least one carbide of an element of group IVB, group VB or group VIB.

Abstract: An end-block for electrically energising a rotatable tubular target in a vacuum coating installation is disclosed. The end-block has a rotary electrical contact that reduces the joule heating effects when operating in alternating current mode. When compared to known end-blocks, this is achieved by increasing the number of contact areas between a contacting ring and a series of circumferentially mounted contacting shoes. Also the contact shoes are being pressed radially outwardly by means of resilient elements against the contacting ring.

Abstract: An insert piece (340) is described for introducing between the mounting base (314) and the end-block (310) of a magnetron sputtering installation. Such an insert piece replicates (320?, 322?) on one end the end-block interface (322) and at the other end the mounting base interface (320). Inside the insert, transfer rods (342) and tubing (444,444?) are provided for the transfer of coolant, electrical current and motive force between the mounting base (314) and the end-block (310). The insert piece (340) is useful to adjust the distance between the target and the substrate. An advantageous embodiment of the insert piece incorporates resilient means into it for accommodating small movements of the end-block caused by thermal expansion or sagging of the target tube. In another advantageous embodiment, the inserts are so long that they cross the plane of the substrate.