Abstract: An insert piece (340) is described for introducing between the mounting base (314) and the end-block (310) of a magnetron sputtering installation. Such an insert piece replicates (320?, 322?) on one end the end-block interface (322) and at the other end the mounting base interface (320). Inside the insert, transfer rods (342) and tubing (444,444?) are provided for the transfer of coolant, electrical current and motive force between the mounting base (314) and the end-block (310). The insert piece (340) is useful to adjust the distance between the target and the substrate. An advantageous embodiment of the insert piece incorporates resilient means into it for accommodating small movements of the end-block caused by thermal expansion or sagging of the target tube. In another advantageous embodiment, the inserts are so long that they cross the plane of the substrate.

Abstract: The invention relates to a process for manufacturing a sputter target. The process comprises the steps of—providing a target holder (12); —applying an intermediate layer (14) on said target holder; —applying a top layer (16) on top of said intermediate layer; said top layer comprising a material having a melting point which is substantially higher than the melting point of said target material; —heating the target holder coated with said intermediate layer and said top layer.

Abstract: The invention relates to a rotatable sputter target and to a method to manufacture such a sputter target. The sputter target comprises a target material and a magnet array located at the interior of the target material. The magnet array defines a central zone extending along the major part of the length of the target material and defines an end zone at each end of the central zone. The target material comprises a first material and a second material. The target material comprises the first material at least on the central zone and comprises the second material at least on the end zones. The second material has a lower sputter deposition rate than the first material. The second material is preferably applied by thermal spraying. The first material comprises a first element and the second material comprises a compound of the first element of the first material.

Abstract: A coating apparatus (100) for batch coating of substrates is presented. In the batch coater layers of a stack can be deposited by means of physical vapour deposition, by means of chemical vapour deposition or by a mixture of both processes. When compared to previous apparatus, the mixed mode process is particularly stable. This is achieved by using a rotatable magnetron (112) rather than the prior-art planar magnetrons. The apparatus is further equipped with a rotatable shutter that allows for concurrent or alternating process steps.

Abstract: A coating apparatus is revealed that is designed to coat substrates by means of a physical vacuum deposition process or a chemical vacuum deposition process or a combination thereof. Said coating apparatus is particular in that it uses a rotatable magnetron (14) that is coverable with an axially moveable shutter (18). Such an arrangement enables to keep the magnetron target clean or to clean the target in between or even during subsequent coating steps. The shutter further provides for a controllable gas atmosphere in the vicinity of the target. The arrangement wherein the magnetron is centrally placed is described. Substrates are then exposed to the sputtering source from all angles by hanging them on a planetary carousel (24) that turns around the magnetron.

Abstract: A module to carry targets in a sputter deposition installation for coating two-sided substrates is described. The module is mountable to the installation through an interface flange that carries at least two targets with their associated magnet systems. When the module is mounted, the targets take positions at opposite sides of the two-sided substrate, while the magnet systems orient the sputter deposition towards the substrate. The module enables coating of both sides of the substrate in one single pass. Different configurations are described with gas distribution systems and additional substrate supports. An enclosure with adjustable blinds in order to reduce gas spreading is also included.

Abstract: A single, right-angled end-block is claimed for rotatably carrying a target in a sputtering apparatus. The end-block comprises all necessary means to drive, energise, bear and seal (coolant and gas) the target in the sputtering apparatus from the outside through a single opening in a wall or door. The right-angled end-block rotates the target around an axis of rotation that is parallel to the wall on which the target is mounted. By preference the end-block is situated below the target in order to allow easy drainage of the coolant.

Abstract: An end-block for use in a tubular magnetron sputtering apparatus is disclosed. Such an end-block rotatably transfers movement, coolant 5 and electrical current to the target while maintaining vacuum integrity and a closed coolant circuit. It hence comprises a drive means, a rotary electrical contact means, a bearing means, a number of rotary coolant seal means and a number of vacuum seal means. The inventive end-block occupies a minimal axial length along the target thus allowing 10 space savings in existing equipment such as e.g. display coaters. The axial length is reduced by mounting at least two of the means radial to one another.

Abstract: An end-block for electrically energising a rotatable tubular target in a vacuum coating installation is disclosed. The end-block has a rotary electrical contact that reduces the joule heating effects when operating in alternating current mode. When compared to known end-blocks, this is achieved by increasing the number of contact areas between a contacting ring and a series of circumferentially mounted contacting shoes. Also the contact shoes are being pressed radially outwardly by means of resilient elements against the contacting ring.

Abstract: A tubular magnet assembly mountable inside a cylindrical target to which the magnet assembly can relatively rotate or translate is disclosed. The magnet assembly discriminates itself from the state-of-the-art in that it comprises both a ‘near’ magnetic field for confinement of charge in the vicinity of the target in combination with a ‘far’ magnetic field reaching the substrate for guidance of charge towards the substrate. Such a magnet assembly also has the advantage that it is angularly directional and can be mounted centrally in an ion plating deposition unit.

Abstract: The invention relates to a vacuum sputter reactor comprising a rotatable vacuum tight coupling. The coupling comprises a first tubular section in the form of a spindle, and a second tubular section in the form of a cylindrical target, axially slidable over the first tubular section to abut against a peripheral outer abutment ring. The coupling further comprising at least one sealing ring located between the outer diameter of the first tubular section and the inner diameter of the second tubular section in a sliding overlapping contact area of the first and second tubular sections. The outer diameter of the first tubular section is generally parallel to the opposing surface of the inner wall of the second tubular section from the sealing ring to the end of the first tubular section.

Abstract: The invention relates to a method to reduce thermal stresses in a sputter target during sputtering. The method provides the following steps providing a target holder, applying a target material comprising indium-tin-oxide on the target holder by spraying and introducing pores in the target material while applying the target material on the target holder. These pores leading to a porosity of at least 2% in the sprayed target material to reduce thermal stresses. The invention further relates to a sputter target having reduced thermal stresses and to a process for coating a substrate surface with indium-tin-oxide.

Abstract: A coupling system (10) to releasably affix a cylindrical target (12) to a spindie (14) comprises the following parts: a) a spindle (14) terminating in a flange portion (16); b) a cylindrical target (12) having at its end a grooved outside circumferential surface (18); c) an interface ring (20) having a circumferential inner or outer surface (22) adapted to engage respectively with the grooved outside or inside circumferential surface (22) of the cylindrical target (12); d) a clamping ring (26) adapted to engage at its one side with the flange portion (16) and to engage radially at its other side with the interface ring (20) to hold the cylindrical target (12) to the spindle (14); e) one or more sealing rings (30) between the spindle (14) and the cylindrical target (12). The interface ring (20) makes it possible to use particular types of cylindrical targets (12) with other types of spindles (14).

Abstract: The invention relates to a substrate covered at least partially with a layered coating. The layered coating comprises an intermediate coating and a hard carbon coating. The intermediate coating comprises a first metal layer deposited on the substrate, the first metal layer comprising at least one element of group IVB, group VB or group VIB; a nitride layer deposited on the first metal layer, the nitride layer comprising at least one nitride of an element of group IVB, group VB or group VIB; a second metal layer deposited on the nitride layer, the second metal layer comprising at least one element of group IVB, group VB or group VIB; a transition layer deposited on the second metal layer, the transition layer comprising at least one carbide of an element of group IVB, group VB or group VIB.

Abstract: A target assembly is claimed for use in e.g. a magnetron deposition apparatus. The target assembly is characterised in that at least one of the functions—bearing of the tube, rotation of the tube, electrical contact, coolant sealing and vacuum sealing—is integrated into the tube itself. Such an assembly has the advantage that it better uses the vacuum space by reducing the volume incorporated by the end blocks. Due to the compactness of the assembly it can also be used in smaller scale installations where now only planar target assemblies can be used.

Abstract: A method for improving the sputter deposition process is provided. The method comprises the following steps: a) providing a vacuum; b) providing an electrode (10, 34, 34?, 44, 44?) in the provided vacuum ; c) providing a substrate in said vacuum, said substrate having no contact with said electrodes (10, 34, 34?, 44, 44?) providing a device (22, 22?, 24, 24?, 26, 26?, 28, 28?, 30, 36, 36?, 48, 48?) in the vacuum. The device is in relative motion to the electrode and is in contact with the electrode over a contact zone. The device removes solid material from the electrode or applies solid material to the electrode. The method is carried out by means of a simple mechanism. There is no need for complicated electronics or sophisticated control algorithms. The method is carried out in vacuum, i.e. there is no need to break the vacuum, so that the machine downtime is reduced.

Abstract: A method of heating in a vacuum atmosphere in the presence of a plasma, comprises the following steps: a) providing infrared radiation means (16) in a vacuum chamber (10); b) providing a first electrical conductor (18) to the infrared radiation means (16); c) providing a second electrical conductor (20) from the infrared radiation means (16); d) putting an electrical voltage over said infrared radiation means (16); e) preventing the first conductor (18) and the second conductor (20) from having an electrical voltage above +55 Volt. The advantage is that arcing is avoided.

Abstract: The invention relates to a process for manufacturing a sputter target. The process comprises the steps of—providing a target holder (12);—applying an intermediate layer (14) on said target holder;—applying a top layer (16) on top of said intermediate layer; said top layer comprising a material having a melting point which is substantially higher than the melting point of said target material;—heating the target holder coated with said intermediate layer and said top layer.

Abstract: The invention relates to a sputter target and more particularly to a zinc sputter target. The target comprises a target holder having an outer surface and a target material formed on said outer surface. The target material has a relative density higher than 92% of the theoretical density of the metal or metal alloy. Furthermore the invention relates to a process for the manufacturing of a sputter target.

Abstract: A magnetron including a target (2) for sputtering onto a substrate in described. The magnetron comprises a magnetic field generator (4) for generating a closed loop magnetic field adapted to generate a plasma race-track above the target (2) and a driving device for establishing relative substantially translational movement between the race-track and the target (2) and adapted to influence the magnetic field generated by the magnetic field generator (4) at least during part of the relative substantially translational movement, the distance between any point on the race track and the momentarily closest part of the one or more pieces (50) of ferromagnetic material varying in accordance with the relative substantially translational movement of the race-track and the target (2).