Abstract: Process, voltage and temperature corners of an on-chip device under calibration are obtained by comparing the outputs of different on-chip components such as active on-chip components and passive-on chip components in response to an input. A first on-chip delay line including a number of active devices, which generate an array of outputs D[ ]) at different stages of the delay. A second on-chip delay line generates a single output (CLK). A DFF array samples the array of outputs (D[ ]) with the single output clock CLK. The different delay variations in different process and temperature corners cause different outputs from the DFF array. The different outputs from the DFF array provide information about the process and temperature corner that can be for rapid calibration of the on-chip device under calibration within one cycle of the CLK.

Abstract: In examples, apparatus and methods are provided that mitigate buffer slew rate variations due to variations in output capacitive loading, a fabrication process, a voltage, and/or a temperature (PVT). An exemplary embodiment includes an inverting buffer having an input and an output, as well as an active resistance series-coupled with a capacitor between the input and the output. The resistance of the active resistance varies based on a variation in a fabrication process, a voltage, and/or temperature. The active resistance can be a passgate. In another example, a CMOS inverter's output is coupled to the input of the inverting buffer, and two series-coupled inverting buffers are coupled between the input of the CMOS inverter and the output of the inverting buffer.

Abstract: Output driver feedback circuitry is configured to sense an amount of output capacitance of an output pad and to adjust the strength of the output driver accordingly. The feedback circuitry adjusts the output driver within a single cycle. A chain of delay reference signals is generated by representative capacitive loads that replicate a range of actual output loads. Adjustments to the output driver are based on a comparison of the delay reference signals with output of the output driver.

Abstract: Output driver feedback circuitry limits output slew rates across a wide range of output loads. A transition time lock loop architecture of the feedback circuitry compares a transition time pulse with a reference pulse to adjusts transition time of an output signal for various process-voltage-temperature (PVT) process corners, output voltage domains and output capacitances. Reference pulse generation circuitry provides a reference pulse in phase with the transition time pulse for each rise and fall of the output signal.

Abstract: Output driver feedback circuitry limits output slew rates across a wide range of output loads. A transition time lock loop architecture of the feedback circuitry compares a transition time pulse with a reference pulse to adjusts transition time of an output signal for various process-voltage-temperature (PVT) process corners, output voltage domains and output capacitances. Reference pulse generation circuitry provides a reference pulse in phase with the transition time pulse for each rise and fall of the output signal.

Abstract: Process, voltage and temperature corners of an on-chip device under calibration are obtained by comparing the outputs of different on-chip components such as active on-chip components and passive-on chip components in response to an input. A first on-chip delay line including a number of active devices, which generate an array of outputs D[ ]) at different stages of the delay. A second on-chip delay line generates a single output (CLK). A DFF array samples the array of outputs (D[ ]) with the single output clock CLK. The different delay variations in different process and temperature corners cause different outputs from the DFF array. The different outputs from the DFF array provide information about the process and temperature corner that can be for rapid calibration of the on-chip device under calibration within one cycle of the CLK.

Abstract: Output driver feedback circuitry is configured to sense an amount of output capacitance of an output pad and to adjust the strength of the output driver accordingly. The feedback circuitry adjusts the output driver within a single cycle. A chain of delay reference signals is generated by representative capacitive loads that replicate a range of actual output loads. Adjustments to the output driver are based on a comparison of the delay reference signals with output of the output driver.

Abstract: In examples, apparatus and methods are provided that mitigate buffer slew rate variations due to variations in output capacitive loading, a fabrication process, a voltage, and/or a temperature (PVT). An exemplary embodiment includes an inverting buffer having an input and an output, as well as an active resistance series-coupled with a capacitor between the input and the output. The resistance of the active resistance varies based on a variation in a fabrication process, a voltage, and/or temperature. The active resistance can be a passgate. In another example, a CMOS inverter's output is coupled to the input of the inverting buffer, and two series-coupled inverting buffers are coupled between the input of the CMOS inverter and the output of the inverting buffer.