Patents by Inventor Wim Christiaens

Wim Christiaens has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 7759167
    Abstract: A method of manufacturing a semiconductor device is provided, involving forming a first flexible film on a rigid carrier substrate, attaching a die to the flexible film, so as to leave contacts on the die exposed, forming a wiring layer to contact the contacts of the die, and releasing the flexible film where the die is attached, from the carrier. An area of the first flexible film where the die is attached can have a lower adhesion to the rigid carrier substrate than other areas, so that releasing can involve cutting the first flexible film to release a part of the area of lower adhesion, and leaving an area of higher adhesion. A combined thickness of the die, the first flexible film and the wiring layer can be less than 150 ?m, so that the device is bendable. Devices can be stacked.
    Type: Grant
    Filed: November 21, 2006
    Date of Patent: July 20, 2010
    Assignees: IMEC, Universiteit Gent (RUG)
    Inventors: Jan Vanfleteren, Wim Christiaens
  • Publication number: 20070134849
    Abstract: A method of manufacturing a semiconductor device is provided, involving forming a first flexible film on a rigid carrier substrate, attaching a die to the flexible film, so as to leave contacts on the die exposed, forming a wiring layer to contact the contacts of the die, and releasing the flexible film where the die is attached, from the carrier. An area of the first flexible film where the die is attached can have a lower adhesion to the rigid carrier substrate than other areas, so that releasing can involve cutting the first flexible film to release a part of the area of lower adhesion, and leaving an area of higher adhesion. A combined thickness of the die, the first flexible film and the wiring layer can be less than 150 ?m, so that the device is bendable. Devices can be stacked.
    Type: Application
    Filed: November 21, 2006
    Publication date: June 14, 2007
    Inventors: Jan Vanfleteren, Wim Christiaens