Patents by Inventor Wing Yew Wong

Wing Yew Wong has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Method for Producing Optoelectronic Semiconductor Devices and Optoelectronic Semiconductor Device
    Publication number: 20210359174
    Abstract: In an embodiment a method includes providing a light-emitting diode chip and a phosphor body, applying a sacrificial layer to a top side of the phosphor body only, placing the phosphor body onto the light-emitting diode chip, molding an encapsulation body directly around the light-emitting diode chip and the phosphor body by a film assisted molding, wherein at least in places a top face of the sacrificial layer facing away from the phosphor body remains unsealed with a molding film, and removing the sacrificial layer so that the top side of the phosphor body is free of the sacrificial layer.
    Type: Application
    Filed: October 22, 2018
    Publication date: November 18, 2021
    Inventors: Mei See Boon, Hui Chiang Teoh, Tomin Liu, Hui Ying Pee, Asliza Alias, Lay Teng Tan, Yuan Liang, Alex Kheng Hooi Lim, Wing Yew Wong
  • Package for an electronic component, electronic component and electronic arrangement
    Patent number: 10468337
    Abstract: A package for an electronic component includes a housing and a leadframe embedded in the housing. The leadframe includes a first section, a second section and a third section which are electrically isolated from one another. The first section and the second section each include an L-shape.
    Type: Grant
    Filed: November 12, 2015
    Date of Patent: November 5, 2019
    Assignee: OSRAM Opto Semiconductors GmbH
    Inventors: Sok Gek Beh, Siew Lee Yeoh, Wing Yew Wong
  • PACKAGE FOR AN ELECTRONIC COMPONENT, ELECTRONIC COMPONENT AND ELECTRONIC ARRANGEMENT
    Publication number: 20180374784
    Abstract: A package for an electronic component includes a housing and a leadframe embedded in the housing. The leadframe includes a first section, a second section and a third section which are electrically isolated from one another. The first section and the second section each include an L-shape.
    Type: Application
    Filed: November 12, 2015
    Publication date: December 27, 2018
    Inventors: Sok Gek Beh, Siew Lee Yeoh, Wing Yew Wong
  • Leadframe and chip package comprising a leadframe
    Patent number: 10109562
    Abstract: A leadframe includes first and second parts separated from each other, and each comprises at least one anchoring hole. The first part comprises a mounting area, the second part comprises an edge line facing the first part which is curved, and the first part comprises first, second and third portions each having a maximum width, wherein the mounting area is arranged at the third portion, and the third portion follows the second portion and the second portion follows the first portion in a direction of a longitudinal extent of the first part such that the third portion faces the second part.
    Type: Grant
    Filed: February 6, 2015
    Date of Patent: October 23, 2018
    Assignee: OSRAM Opto Semiconductors GmbH
    Inventors: Sok Gek Beh, Mei See Boon, Wing Yew Wong, Hui Ying Pee
  • LEADFRAME AND CHIP PACKAGE COMPRISING A LEADFRAME
    Publication number: 20180033932
    Abstract: A leadframe includes first and second parts separated from each other, and each comprises at least one anchoring hole. The first part comprises a mounting area, the second part comprises an edge line facing the first part which is curved, and the first part comprises first, second and third portions each having a maximum width, wherein the mounting area is arranged at the third portion, and the third portion follows the second portion and the second portion follows the first portion in a direction of a longitudinal extent of the first part such that the third portion faces the second part.
    Type: Application
    Filed: February 6, 2015
    Publication date: February 1, 2018
    Inventors: Sok Gek Beh, Mei See Boon, Wing Yew Wong, Hui Ying Pee