Patents by Inventor Wolfgang Coenen

Wolfgang Coenen has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Process for separating disk-shaped substrates with the use of adhesive powers
    Patent number: 8043890
    Abstract: The present invention relates to a device and a method for dividing up substrates (2) in wafer form (e.g. wafers), which is used in the semiconductor industry, MST (microstructure technology) industry and photovoltaic industry, whereby improved reliability of the process and lower reject rates are accomplished. This object is achieved according to the invention by using adhesion forces that act between the substrates in wafer form and the devices (1) thereby used.
    Type: Grant
    Filed: November 8, 2006
    Date of Patent: October 25, 2011
    Inventors: Wolfgang Coenen, Nils Hendrik Coenen
  • Process for Separating Disk-Shaped Substrates with the Use of Adhesive Powers
    Publication number: 20080286947
    Abstract: The present invention relates to a device and a method for dividing up substrates (2) in wafer form (e.g. wafers), which is used in the semiconductor industry, MST (microstructure technology) industry and photovoltaic industry, whereby improved reliability of the process and lower reject rates are accomplished. This object is achieved according to the invention by using adhesion forces that act between the substrates in wafer form and the devices (1) thereby used.
    Type: Application
    Filed: November 8, 2006
    Publication date: November 20, 2008
    Inventors: Wolfgang Coenen, Nils Hendrik Coenen