Patents by Inventor Wolfgang Gruber
Wolfgang Gruber has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20210362443Abstract: A method produces a fiber composite component for a motor vehicle. The method provides a semifinished fiber composite blank, wherein the semifinished fiber composite blank includes reinforcing fibers and a matrix material. The semifinished fiber composite blank is arranged between a first membrane and a second membrane. The semifinished fiber composite blank is shaped into a fiber composite molding by pressing the semifinished fiber composite blank together with the first membrane and the second membrane via a pressing device, and the fiber composite molding is consolidated.Type: ApplicationFiled: September 26, 2018Publication date: November 25, 2021Inventors: Jan BOTH, Wolfgang GRUBER, Werner SCHMIDT
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Patent number: 10633369Abstract: The present invention relates to a DYRK1B inhibitor for use in the treatment of cancer, wherein in said cancer and/or in cells of said cancer the hedgehog signaling pathway is activated, and in particular the activation of the hedgehog signaling pathway is independent of signaling by the G protein-coupled receptor Smoothened.Type: GrantFiled: March 8, 2018Date of Patent: April 28, 2020Assignee: 4 SC AGInventors: Fritz Aberger, Wolfgang Gruber, Johann Leban, Hella Kohlhof, Daniel Vitt, Roland Baumgartner
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Patent number: 10363788Abstract: A vibration damper is provided for a vehicle, preferably for a motor vehicle, having a wheel carrier made of metal for rotatably receiving a wheel, a damper tube arrangement at least partly made of a fiber-reinforced plastic for forming a damper fluid volume, a piston which is guided in the damper tube arrangement and includes a piston rod. The damper tube arrangement is rigidly connected to the wheel carrier and the piston rod can be connected to a body of the vehicle. A wheel carrier fluid volume is formed in the wheel carrier and which is connected to the damper fluid volume. The fluid in the wheel carrier fluid volume is in direct contact with the metal of the wheel carrier in order to transfer heat.Type: GrantFiled: November 25, 2016Date of Patent: July 30, 2019Assignee: Bayerische Motoren Werke AktiengesellschaftInventors: Andreas Reiser, Thomas Eifflaender, Michael Keigler, Johann Dudkowiak, Wolfgang Gruber, Matthias Stangl, Hubert Scholz, Thomas Kaespaizer, Martin Schwab
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Publication number: 20180201606Abstract: The present invention relates to a DYRK1B inhibitor for use in the treatment of cancer, wherein in said cancer and/or in cells of said cancer the hedgehog signaling pathway is activated, and in particular the activation of the hedgehog signaling pathway is independent of signaling by the G protein-coupled receptor Smoothened.Type: ApplicationFiled: March 8, 2018Publication date: July 19, 2018Applicant: 4 SC AGInventors: Fritz ABERGER, Wolfgang GRUBER, Johann LEBAN, Hella KOHLHOF, Daniel VITT, Roland BAUMGARTNER
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Patent number: 9951050Abstract: The present invention relates to a DYRK1B inhibitor for use in the treatment of cancer, wherein in said cancer and/or in cells of said cancer the hedgehog signaling pathway is activated, and in particular the activation of the hedgehog signaling pathway is independent of signaling by the G protein-coupled receptor Smoothened.Type: GrantFiled: June 18, 2014Date of Patent: April 24, 2018Assignee: 4 SC AGInventors: Fritz Aberger, Wolfgang Gruber, Johann Leban, Hella Kohlhof, Daniel Vitt, Roland Baumgartner
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Patent number: 9862254Abstract: A fiber composite component is provided, particularly for a vehicle structure, having a fiber structure which includes at least one fiber layer, wherein at least one of the at least one fiber layers is formed from a number of pre-formed fiber mats, and a first pre-formed fiber mat has a greater fiber mat thickness than a second pre-formed fiber mat from the number of pre-formed fiber mats of the at least one fiber layer. A method for producing a corresponding fiber composite component is also provided.Type: GrantFiled: March 17, 2015Date of Patent: January 9, 2018Assignee: Bayerische Motoren Werke AktiengesellschaftInventors: Florian Soldner, Wolfgang Gruber, Matthias Zeidler, Markus Vallerius, Ralf Poggenborg
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Publication number: 20170072757Abstract: A vibration damper is provided for a vehicle, preferably for a motor vehicle, having a wheel carrier made of metal for rotatably receiving a wheel, a damper tube arrangement at least partly made of a fiber-reinforced plastic for forming a damper fluid volume, a piston which is guided in the damper tube arrangement and includes a piston rod. The damper tube arrangement is rigidly connected to the wheel carrier and the piston rod can be connected to a body of the vehicle. A wheel carrier fluid volume is formed in the wheel carrier and which is connected to the damper fluid volume. The fluid in the wheel carrier fluid volume is in direct contact with the metal of the wheel carrier in order to transfer heat.Type: ApplicationFiled: November 25, 2016Publication date: March 16, 2017Inventors: Andreas REISER, Thomas EIFFLAENDER, Michael KEIGLER, Johann DUDKOWIAK, Wolfgang GRUBER, Matthias STANGL, Hubert SCHOLZ, Thomas KAESPAIZER, Martin SCHWAB
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Publication number: 20150183305Abstract: A fiber composite component is provided, particularly for a vehicle structure, having a fiber structure which includes at least one fiber layer, wherein at least one of the at least one fiber layers is formed from a number of pre-formed fiber mats, and a first pre-formed fiber mat has a greater fiber mat thickness than a second pre-formed fiber mat from the number of pre-formed fiber mats of the at least one fiber layer. A method for producing a corresponding fiber composite component is also provided.Type: ApplicationFiled: March 17, 2015Publication date: July 2, 2015Inventors: Florian SOLDNER, Wolfgang GRUBER, Matthias ZEIDLER, Markus VALLERIUS, Ralf POGGENBORG
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Publication number: 20140371251Abstract: The present invention relates to a DYRK1B inhibitor for use in the treatment of cancer, wherein in said cancer and/or in cells of said cancer the hedgehog signaling pathway is activated, and in particular the activation of the hedgehog signaling pathway is independent of signaling by the G protein-coupled receptor Smoothened.Type: ApplicationFiled: June 18, 2014Publication date: December 18, 2014Applicant: 4SC DISCOVERY GMBHInventors: Fritz ABERGER, Wolfgang GRUBER, Johann LEBAN, Hella KOHLHOF, Daniel VITT, Roland BAUMGARTNER
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Patent number: 8794275Abstract: A filling device for filling containers with a liquid, including several filling elements, each of the filling elements having a filling valve, a filling tube and a return gas tube, where the filling tubes of the filling elements are arranged at a first common support and the return gas tubes of the filling elements are arranged at a second common support, and where the position of the second common support can be adjusted relative to the position of the first common support.Type: GrantFiled: May 11, 2011Date of Patent: August 5, 2014Assignee: Krones AGInventors: Wolfgang Gruber, Walter Neumayer, Erwin Knieling
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Patent number: 8350460Abstract: The invention relates to a fluorescent coating for Hg low-pressure discharge lamps, comprising a fluorescent composition from at least one green fluorescent material emitting in the green spectral range, especially a Tb-and/or Eu-doped green fluorescent material, and a red fluorescent material emitting in the red spectral range, especially a Eu and/or Mn red fluorescent material. The invention is characterized in that a further fluorescent material is present which is adapted to absorb UV Hg and Hg-Vis radiation.Type: GrantFiled: October 22, 2007Date of Patent: January 8, 2013Assignee: OSRAM AGInventors: Claudia Castiglioni, Wolfgang Gruber, Armin Konrad
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Patent number: 8105874Abstract: A memory circuit arrangement and fabrication method thereof are presented in which the parts of the memory circuit arrangement are situated on two different substrates. An integrated memory cell array is situated on one substrate. An integrated control circuit that controls access to the memory cells is situated on the other (logic circuit) substrate. The control circuit controls sequences when reading, writing or erasing content of a memory cell. The logic circuit substrate also contains a CPU and encryption coprocessor. The memory circuit contains a sense amplifier, with the aid of which the memory state of a memory cell can be determined, and a decoding circuit that selects a word or bit line.Type: GrantFiled: October 27, 2008Date of Patent: January 31, 2012Assignee: Infineon Technologies AGInventors: Wolfgang Gruber, Ronald Kakoschke, Thomas Schweizer, Dominik Wegertseder
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Publication number: 20110277881Abstract: A filling device for filling containers with a liquid, including several filling elements, each of the filling elements having a filling valve, a filling tube and a return gas tube, where the filling tubes of the filling elements are arranged at a first common support and the return gas tubes of the filling elements are arranged at a second common support, and where the position of the second common support can be adjusted relative to the position of the first common support.Type: ApplicationFiled: May 11, 2011Publication date: November 17, 2011Applicant: KRONES AGInventors: WOLFGANG GRUBER, Walter Neumayer, Erwin Knieling
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Patent number: 8004869Abstract: A memory circuit arrangement and fabrication method thereof are presented in which the parts of the memory circuit arrangement are situated on two different substrates. An integrated memory cell array is situated on one substrate. An integrated control circuit that controls access to the memory cells is situated on the other (logic circuit) substrate. The control circuit controls sequences when reading, writing or erasing content of a memory cell. The logic circuit substrate also contains a CPU and encryption coprocessor. The memory circuit contains a sense amplifier, with the aid of which the memory state of a memory cell can be determined, and a decoding circuit that selects a word or bit line.Type: GrantFiled: May 3, 2010Date of Patent: August 23, 2011Assignee: Infineon Technologies AGInventors: Wolfgang Gruber, Ronald Kakoschke, Thomas Schweizer, Dominik Wegertseder
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Publication number: 20100210076Abstract: A memory circuit arrangement and fabrication method thereof are presented in which the parts of the memory circuit arrangement are situated on two different substrates. An integrated memory cell array is situated on one substrate. An integrated control circuit that controls access to the memory cells is situated on the other (logic circuit) substrate. The control circuit controls sequences when reading, writing or erasing content of a memory cell. The logic circuit substrate also contains a CPU and encryption coprocessor. The memory circuit contains a sense amplifier, with the aid of which the memory state of a memory cell can be determined, and a decoding circuit that selects a word or bit line.Type: ApplicationFiled: May 3, 2010Publication date: August 19, 2010Inventors: Wolfgang Gruber, Ronald Kakoschke, Thomas Schwetzer, Dominik Wegertseder
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Patent number: 7764530Abstract: A memory circuit arrangement and fabrication method thereof are presented in which the parts of the memory circuit arrangement are situated on two different substrates. An integrated memory cell array is situated on one substrate. An integrated control circuit that controls access to the memory cells is situated on the other (logic circuit) substrate. The control circuit controls sequences when reading, writing or erasing content of a memory cell. The logic circuit substrate also contains a CPU and encryption coprocessor. The memory circuit contains a sense amplifier, with the aid of which the memory state of a memory cell can be determined, and a decoding circuit that selects a word or bit line.Type: GrantFiled: October 27, 2008Date of Patent: July 27, 2010Assignee: Infineon Technologies AGInventors: Wolfgang Gruber, Ronald Kakoschke, Thomas Schwelzer, Dominik Wegertseder
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Patent number: 7714447Abstract: A patterned connection plane between two semiconductor chips which are connected using face-to-face technology is patterned into first pads, second pads, and conductor strips which are alternatively connected to one of these pads. The conductor strips are connected to a read-out circuit in one of the semiconductor chips via connections.Type: GrantFiled: August 25, 2005Date of Patent: May 11, 2010Assignee: Infineon Technologies AGInventors: Markus Eigner, Wolfgang Gruber, Manfred Roth, Stefan Ruping
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Publication number: 20100052507Abstract: The invention relates to a fluorescent coating for Hg low-pressure discharge lamps, comprising a fluorescent composition from at least one green fluorescent material emitting in the green spectral range, especially a Tb- and/or Eu-doped green fluorescent material, and a red fluorescent material emitting in the red spectral range, especially a Eu and/or Mn red fluorescent material. The invention is characterized in that a further fluorescent material is present which is adapted to absorb UV Hg and Hg-Vis radiation.Type: ApplicationFiled: October 22, 2007Publication date: March 4, 2010Inventors: Claudia Castiglioni, Wolfgang Gruber, Armin Konrad
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Publication number: 20090053854Abstract: A memory circuit arrangement and fabrication method thereof are presented in which the parts of the memory circuit arrangement are situated on two different substrates. An integrated memory cell array is situated on one substrate. An integrated control circuit that controls access to the memory cells is situated on the other (logic circuit) substrate. The control circuit controls sequences when reading, writing or erasing content of a memory cell. The logic circuit substrate also contains a CPU and encryption coprocessor. The memory circuit contains a sense amplifier, with the aid of which the memory state of a memory cell can be determined, and a decoding circuit that selects a word or bit line.Type: ApplicationFiled: October 27, 2008Publication date: February 26, 2009Inventors: Wolfgang Gruber, Ronald Kakoschke, Thomas Schweizer, Dominik Wegertseder
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Publication number: 20090052219Abstract: A memory circuit arrangement and fabrication method thereof are presented in which the parts of the memory circuit arrangement are situated on two different substrates. An integrated memory cell array is situated on one substrate. An integrated control circuit that controls access to the memory cells is situated on the other (logic circuit) substrate. The control circuit controls sequences when reading, writing or erasing content of a memory cell. The logic circuit substrate also contains a CPU and encryption coprocessor. The memory circuit contains a sense amplifier, with the aid of which the memory state of a memory cell can be determined, and a decoding circuit that selects a word or bit line.Type: ApplicationFiled: October 27, 2008Publication date: February 26, 2009Inventors: Wolfgang Gruber, Ronald Kakoschke, Thomas Schwelzer, Dominik Wegertseder