Abstract: An electrosurgical generator including housing and an internal circuitry to generate a high-frequency voltage and to output the generated high-frequency voltage to an electrosurgical instrument, further including at least one output socket for connection of a plug of the electrosurgical instrument. The output socket is configured as self-contained unit including: a casing configured for mounting at a front plate of the housing; a plug socket mounted at a frontal face of the casing for plugging of the electrosurgical instrument; a conductor board inserted into the casing and being configured to provide internal connections of the output socket; and a connector provided at the conductor board for a connection to the internal circuitry. Thereby the output socket is modularly exchangeable. Being self-contained, the output socket can be easily exchanged against another output socket of different functionality, allowing for easy re-configuration.

Abstract: A cabriolet vehicle has a body structure and a roof structure that can be attached to the body structure (14). The roof structure has a top with a top material. The top material has a main section, which forms the actual roof of the roof structure in the closed state of the top and lateral rear elongation sections. The elongation sections can be threaded into openings (15) of the body structure (14) and attached to tensioning brackets (19) of the body structure.

Abstract: In a rear end of the vehicle body, an assembly carrier which is arranged in the vehicle transverse direction is inserted between inner body-side side parts of the vehicle rear end. The assembly carrier holds pre-assemblable components and to which assembly carrier is fastened a rear-end trim panel and which assembly carrier is fixedly connected to the two inner side parts by screw devices and forms a stiffening body cross member.

Abstract: A cabriolet vehicle has a body structure and a roof structure that can be attached to the body structure (14). The roof structure has a top with a top material. The top material has a main section, which forms the actual roof of the roof structure in the closed state of the top and lateral rear elongation sections. The elongation sections can be threaded into openings (15) of the body structure (14) and attached to tensioning brackets (19) of the body structure.

Abstract: In a rear end of the vehicle body, an assembly carrier which is arranged in the vehicle transverse direction is inserted between inner body-side side parts of the vehicle rear end. The assembly carrier holds pre-assemblable components and to which assembly carrier is fastened a rear-end trim panel and which assembly carrier is fixedly connected to the two inner side parts by screw devices and forms a stiffening body cross member.

Abstract: An encapsulated chip chip 10 is attached to a baseplate 12, a conductive layer 14 that is at least as high as the chip 10 is attached to the baseplate. A cover plate 16, provided with electrically conductive surfaces 18, is arranged on this conductive layer 14, which is both electrically and mechanically connected with the chip 10 and the conductive layer 14, for example by means of an anisotropically conductive film 26. The cover plate 16 offers protection against touch contact and other mechanical influences. The anisotropically conductive film 26 completely encloses the chip 10. The cover plate 16 provides an electrical connection between the chip 10 and the conductive layer 14 and, at the same time, serves as encapsulation for the chip 10. Because of this, manufacture of the chip 10 becomes easy and cost-effective and only requires relatively few process steps.

Abstract: An encapsulated chip chip 10 is attached to a baseplate 12, a conductive layer 14 that is at least as high as the chip 10 is attached to the baseplate. A cover plate 16, provided with electrically conductive surfaces 18, is arranged on this conductive layer 14, which is both electrically and mechanically connected with the chip 10 and the conductive layer 14, for example by means of an anisotropically conductive film 26. The cover plate 16 offers protection against touch contact and other mechanical influences. The anisotropically conductive film 26 completely encloses the chip 10. The cover plate 16 provides an electrical connection between the chip 10 and the conductive layer 14 and, at the same time, serves as encapsulation for the chip 10. Because of this, manufacture of the chip 10 becomes easy and cost-effective and only requires relatively few process steps.

Abstract: In a device for attaching a semiconductor chip (10) to a chip carrier (12), thereby producing an electrically conducting connection between contact areas (22, 24) arranged on a surface of the semiconductor chip (10) and contact areas (26, 28) on the chip carrier (12) by means of an anisotropically conducting film (16) or an anisotropically conducting paste (16), a pressure die (18) is used for the application of the pressure to the chip (10) with an adjustable pressing force against the chip carrier (12). A counter-pressure support (14) accepts the chip carrier (12) with the semiconductor chip (10) arranged on it with the interposition of the anisotropically conducting film (16) or the anisotropically conducting paste (16). An elastic body (20) is arranged either between the pressure die (14) and the semiconductor chip (10) or between the chip carrier (12) and the counter-pressure support (14).

Abstract: Device for attaching a semiconductor chip to a chip carrier In a device for attaching a semiconductor chip (10) to a chip carrier (12), thereby producing an electrically conducting connection between contact areas (22, 24) arranged on a surface of the semiconductor chip (10) and contact areas (26, 28) on the chip carrier (12) by means of an anisotropically conducting film (16) or an anisotropically conducting paste (16), a pressure die (18) is used for the application of the pressure to the chip (10) with an adjustable pressing force against the chip carrier (12). A counter-pressure support (14) accepts the chip carrier (12) with the semiconductor chip (10) arranged on it with the interposition of the anisotropically conducting film (16) or the anisotropically conducting paste (16). An elastic body (20) is arranged either between the pressure die (14) and the semiconductor chip (10) or between the chip carrier (12) and the counter-pressure support (14).

Abstract: In a device for attaching a semiconductor chip (10) to a chip carrier (12), thereby producing an electrically conducting connection between contact areas (22, 24) arranged on a surface of the semiconductor chip (10) and contact areas (26, 28) on the chip carrier (12) by means of an anisotropically conducting film (16) or an anisotropically conducting paste (16), a pressure die (18) is used for the application of the pressure to the chip (10) with an adjustable pressing force against the chip carrier (12). A counter-pressure support (14) accepts the chip carrier (12) with the semiconductor chip (10) arranged on it with the interposition of the anisotropically conducting film (16) or the anisotropically conducting paste (16). An elastic body (20) is arranged either between the pressure die (14) and the semiconductor chip (10) or between the chip carrier (12) and the counter-pressure support (14).

Abstract: A method of tuning the resonance frequency of a transponder to a target frequency is described, wherein a transponder comprises a film antenna with an IC (IC) mounted to the film antenna (L) and an integrated resonance capacitor (C) is part of a IC. During testing of IC at chip probe to determine the pass/fail of the IC, the integrated resonance capacitor (C) is measured and the value is stored with the pass/fail data of the wafer map. Then after mounting a passed IC (IC) to a film antenna (L) with variable inductance, retrieve the integrated resonance capacitance value from the wafer map and calculate the amount of inductance necessary to achieve the target frequency. Tune the film antenna (L) to achieve the necessary inductance, measure the transponder resonance frequency, and compare the transponder resonance frequency to the target frequency.

Abstract: An automatic screw driving gun has a belt feeder mechanism (1) for advancing a screw supply belt (2) through a feeder housing (6) in response to the rotation of a screw drive shaft or blade (11, 28) . The belt feeder mechanism (1) has a feeder lever (12) coupled to the rotating screw drive blade (11, 28) through a coupling device including a rocker lever (16) and a toggle lever (18) for a stepwise advance of the belt (4) through the feeder housing perpendicularly to the screw drive shaft. A cam driven by the screw drive shaft advances the feeder lever with each blade rotation whereby the power of the drive motor is used for the belt advance thereby relieving the operator.

Abstract: A screw gun drive is adapted to adjust itself automatically to the pitch of the threading of the screw being driven. For this purpose a spindle-type spring biassed coupling is provided between the screw driving blade and the drive shaft of the motor. As a result of such a coupling the screw driving blade first begins a rotational movement when the drive motor is switched on, and then it superimposes an automatic axial feed advance which adapts itself to the pitch of the screw being driven. An adjustment member provides for adjusting the spindle coupling to the length of the screws being driven.