Patents by Inventor Wolfgang Schindler

Wolfgang Schindler has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 10925390
    Abstract: The invention relates to a rack for a switchgear cabinet arrangement, comprising a main frame that includes four vertical profiled struts and eight horizontal profiled struts, four of said profiled struts forming a rectangular rack frame (4) having a constant cross-section; the rack frame has a peripheral receptacle which is formed by at least two sides of the profiled struts and which is open towards an external side of the rack frame; the disclosed rack is characterized in that a rectangular additional frame is inserted into the receptacle.
    Type: Grant
    Filed: September 21, 2016
    Date of Patent: February 23, 2021
    Inventors: Wolfgang Reuter, Timo Schindler, Matthias Müller
  • Publication number: 20200366069
    Abstract: The invention relates to an arrangement, which comprises two switch cabinet racks interconnected by means of a baying connector, the switch cabinet racks each having a profile web, which lie in a first common plane and by means of which the switch cabinet racks adjoin each other, and wherein the switch cabinet racks each have a mounting side which lie in a second common plane and face an interior space of the interconnected switch cabinet racks each, the first and the second plane extending parallel to one another and being spaced apart from one another, wherein the baying connector is completely arranged between the first and the second plane
    Type: Application
    Filed: December 17, 2018
    Publication date: November 19, 2020
    Inventors: Wolfgang REUTER, Timo SCHINDLER, Michael HOF
  • Publication number: 20200274335
    Abstract: The invention relates to a rack for a switchgear cabinet arrangement, comprising a main frame that includes four vertical profiled struts and eight horizontal profiled struts, four of said profiled struts forming a rectangular rack frame (4) having a constant cross-section; the rack frame has a peripheral receptacle which is formed by at least two sides of the profiled struts and which is open towards an external side of the rack frame; the disclosed rack is characterized in that a rectangular additional frame is inserted into the receptacle.
    Type: Application
    Filed: September 21, 2016
    Publication date: August 27, 2020
    Inventors: Wolfgang REUTER, Timo SCHINDLER, Matthias MÜLLER
  • Patent number: 10697850
    Abstract: A method for testing a container (11) having an interior volume (12) for tightness, comprising the following steps: providing the container (11) in a pressure chamber (10) and reducing pressure within the pressure chamber (10) or increasing pressure within the container (11) as far as a predefined test pressure, ascertaining a pressure profile (100) within the pressure chamber (10) over time, comparing the pressure profile (100) to a reference profile (200) in order to determine whether a leak is present within the container (11), wherein ambient conditions of the container (11) and/or the pressure chamber (10) are monitored and the reference profile (200) is adapted to changing ambient conditions.
    Type: Grant
    Filed: March 13, 2018
    Date of Patent: June 30, 2020
    Assignee: Robert Bosch GmbH
    Inventors: Wolfram Schindler, Wolfgang Maurischat, Thomas Peter, Lucien Matthias Drescher
  • Patent number: 10396531
    Abstract: The invention relates to a frame profile for a frame rack of a switch cabinet, wherein the frame profile has: a first and a second profile web, wherein a free end of the first profile web has a first sealing edge, and a free end of the second profile web has a second sealing edge, a first mounting side with fixing receptacles, which first mounting side is spaced apart from the first sealing edge by a first dimension of a first connecting side of the first profile web, which connects the first mounting side to the first sealing edge, a second mounting side with fixing receptacles, which second mounting side is spaced apart from the second sealing edge by a second dimension of a second connecting side of the second profile web, which connects the second mounting side to the second sealing edge, characterized in that at least one of the profile webs has an undercut.
    Type: Grant
    Filed: September 21, 2016
    Date of Patent: August 27, 2019
    Assignee: Rittal GmbH & Co. KG
    Inventors: Wolfgang Reuter, Daniel Brück, Timo Schindler, Hartmut Paul, Heiko Holighaus
  • Patent number: 10198684
    Abstract: A smart card module includes a substrate having a first main surface and a second main surface, which is opposite the first main surface. The substrate has a plurality of plated-through holes, which extend through the substrate from the first main surface to the second main surface. The smart card module further includes a chip over the first main surface of the substrate, a first metal structure over the second main surface of the substrate, electrically insulating material, which covers the first metal structure, and a second metal structure over the electrically insulating material, wherein the second metal structure is electrically insulated from the first metal structure by the electrically insulating material. The chip is connected to the first metal structure by at least one first plated-through hole. The chip is connected to the second metal structure by at least one second plated-through hole.
    Type: Grant
    Filed: May 22, 2015
    Date of Patent: February 5, 2019
    Assignee: Infineon Technologies AG
    Inventors: Frank Pueschner, Alfred Haimerl, Jens Pohl, Wolfgang Schindler
  • Publication number: 20150339565
    Abstract: A smart card module includes a substrate having a first main surface and a second main surface, which is opposite the first main surface. The substrate has a plurality of plated-through holes, which extend through the substrate from the first main surface to the second main surface. The smart card module further includes a chip over the first main surface of the substrate, a first metal structure over the second main surface of the substrate, electrically insulating material, which covers the first metal structure, and a second metal structure over the electrically insulating material, wherein the second metal structure is electrically insulated from the first metal structure by the electrically insulating material. The chip is connected to the first metal structure by at least one first plated-through hole. The chip is connected to the second metal structure by at least one second plated-through hole.
    Type: Application
    Filed: May 22, 2015
    Publication date: November 26, 2015
    Inventors: Frank PUESCHNER, Alfred HAIMERL, Jens POHL, Wolfgang SCHINDLER
  • Patent number: 9070067
    Abstract: A smart card module for use in a smart card includes a microchip and a contact zone for making contact with the microchip by means of a reader. The microchip can be enclosed by an encapsulation which can enclose the microchip completely from all sides.
    Type: Grant
    Filed: May 30, 2014
    Date of Patent: June 30, 2015
    Assignee: Infineon Technologies AG
    Inventors: Juergen Hoegerl, Andreas Mueller-Hipper, Frank Pueschner, Wolfgang Schindler, Peter Stampka
  • Patent number: 8991711
    Abstract: In various aspects of the disclosure, a chip card module is provided. The chip card module may include a flexible substrate having a metallization on a first and second major surface, or side, thereof. An integrated circuit affixed to the second side is oriented with chip pads facing away from the substrate. Wire bonds may connect the chip pads to the metallizations.
    Type: Grant
    Filed: July 19, 2012
    Date of Patent: March 31, 2015
    Assignee: Infineon Technologies AG
    Inventors: Frank Pueschner, Jens Pohl, Juergen Hoegerl, Wolfgang Schindler
  • Publication number: 20140353387
    Abstract: A smart card module for use in a smart card includes a microchip and a contact zone for making contact with the microchip by means of a reader. The microchip can be enclosed by an encapsulation which can enclose the microchip completely from all sides.
    Type: Application
    Filed: May 30, 2014
    Publication date: December 4, 2014
    Inventors: Juergen Hoegerl, Andreas Mueller-Hipper, Frank Pueschner, Wolfgang Schindler, Peter Stampka
  • Publication number: 20140249721
    Abstract: A steering system for a vehicle that includes actuators for a wheel drive, steering, and suspension may include (a) a request level configured to determine a desired movement vector, (b) a control level, to which for each predetermined movement direction of the motor vehicle one control unit is assigned, each control unit being configured to determine a force vector as a function of the desired movement vector, and (c) an actuation level configured to determine respective control variables for the actuators as a function of the determined force vectors.
    Type: Application
    Filed: June 28, 2012
    Publication date: September 4, 2014
    Inventors: Wolfgang Schindler, Thomas Gallner, Thomas Raste
  • Publication number: 20140084070
    Abstract: According to one embodiment, a chip card is provided comprising a booster antenna wherein the booster antenna comprises a material having an electrical resistivity of at least 0.05 Ohm*mm2/m.
    Type: Application
    Filed: September 25, 2012
    Publication date: March 27, 2014
    Applicant: INFINEON TECHNOLOGIES AG
    Inventors: Frank Pueschner, Siegfried Hoffner, Peter Stampka, Wolfgang Schindler, Stephan Rampetzreiter
  • Publication number: 20140021264
    Abstract: In various aspects of the disclosure, a chip card module is provided. The chip card module may include a flexible substrate having a metallization on a first and second major surface, or side, thereof. An integrated circuit affixed to the second side is oriented with chip pads facing away from the substrate. Wire bonds may connect the chip pads to the metallizations.
    Type: Application
    Filed: July 19, 2012
    Publication date: January 23, 2014
    Applicant: Infineon Technologies AG
    Inventors: Frank PUESCHNER, Jens POHL, Juergen HOEGERL, Wolfgang SCHINDLER
  • Publication number: 20100313684
    Abstract: A device for the dilution of a gas to be analyzed with a dilution gas has a sample gas tube (1) and a feed (3) for the dilution gas, which open into a common line (6) for the diluted gas to be analyzed. In order that even with large pulsatile pressures in the gas to be analyzed at the sample point no return flow of dilution air into the line of the gas to be analyzed and no uncontrolled temperature change of this gas can occur, the feed (3) for the dilution gas in the form similar to a Venturi jet (7) merges into the common line (6), the sample gas tube (1) is embodied so as to be thermally insulated with respect to the ambient air and dilution air and opens into the Venturi jet (7) just before the location with the smallest cross section.
    Type: Application
    Filed: October 2, 2009
    Publication date: December 16, 2010
    Inventors: MICHAEL ARNDT, Alexander Bergmann, Franz Knopf, Wolfgang Schindler
  • Patent number: 7694888
    Abstract: A method for producing a contact zone for a chip card has the following steps. A sheet having a first surface and a second surface opposite the first surface. Forming at least one insulating trench, which extends from the first surface to the second surface. A cluster layer is applied to the first surface. The second surface is connected to a carrier element after the cluster layer has been applied to the first surface.
    Type: Grant
    Filed: November 15, 2006
    Date of Patent: April 13, 2010
    Assignee: Infineon Technologies AG
    Inventors: Frank Pueschner, Wolfgang Schindler, Peter Stampka
  • Patent number: 7579679
    Abstract: A chip card with a chip module having an integrated circuit and, for external contacting, has on a main face a contact zone with a number of contact areas which are spaced apart from one another and are electrically connected to the integrated circuit. At least one contact area is made up of first functional regions with first surfaces and of second functional regions with second surfaces, and the first surfaces of the first functional regions lie higher with respect to the main face than the second surfaces of the second functional regions.
    Type: Grant
    Filed: March 29, 2006
    Date of Patent: August 25, 2009
    Assignee: Infineon Technologies AG
    Inventors: Frank Püschner, Wolfgang Schindler, Ewald Simmerlein-Erlbacher, Peter Stampka
  • Patent number: 7574307
    Abstract: An exhaust emission analysis system is provided that includes an exhaust and dilution gas source respectively providing exhaust and dilution gases. A dilution unit includes exhaust and dilution gas mass flow controllers, fluidly connected to the exhaust and dilution gas sources. The mass flow controllers define a gas flow rate of gas from their respective gas source. A connection mixes the gases to provide a diluted exhaust gas having an incorrect dilution ratio. A water measurement device measures the water content of the exhaust gas. A water content dilution signal is sent from the water measurement device to a control device. An adjustment factor is calculated by the controller and a flow rate command signal is sent from the controller, to the exhaust gas mass flow controller to adjust the gas flow rate of the exhaust gas and provide a corrected dilution ratio at the connection.
    Type: Grant
    Filed: August 31, 2004
    Date of Patent: August 11, 2009
    Assignee: AVL North America Inc.
    Inventors: William Martin Silvis, Norbert Kreft, Gerald Marek, Wolfgang Schindler
  • Patent number: 7565846
    Abstract: An exhaust sampling system is provided that includes a sampler having a sample inlet for receiving an exhaust gas sample. The sampler includes a mixer for receiving the exhaust gas sample and a diluent to produce a diluted exhaust gas. The exhaust sampling system includes first and second dilution gas flow devices. The first and second dilution gas flow devices are fluidly connected to one another at a second junction. Any diluent provided by the first and second dilution gas flow devices intermingles with one another prior to reaching the mixer. A diluted sample flow meter is arranged downstream from the mixer for receiving the diluted exhaust gas. In one example, diluent flow from the first and second dilution gas flow devices intermingles before being introduced to the mixer. In another example, diluent flow from the first dilution gas flow device is leaked out of the second dilution gas flow device in a controlled manner to achieve a desired diluent flow into the mixer.
    Type: Grant
    Filed: October 11, 2006
    Date of Patent: July 28, 2009
    Assignee: AVL North America Inc.
    Inventors: William Martin Silvis, Gerald Marek, Wolfgang Schindler
  • Patent number: 7397140
    Abstract: A chip module having a chip which is mounted by means of chip adhesive on a mount and is electrically connected via bonding wires to contact pads, and an encapsulation compound which surrounds the chip and the bonding wires and is bounded by a subarea of the mount. The encapsulation compound is radiation-hardened and heat-hardened in a combined form and has radiation-impermeable pigments.
    Type: Grant
    Filed: August 16, 2005
    Date of Patent: July 8, 2008
    Assignees: Infineon Technologies AG, Delo Industire Klebstoffe GmbH + Co. KG
    Inventors: Frank Puschner, Dietmar Dengler, Wolfgang Schindler, Thomas Spottl
  • Publication number: 20080087107
    Abstract: An exhaust sampling system is provided that includes a sampler having a sample inlet for receiving an exhaust gas sample. The sampler includes a mixer for receiving the exhaust gas sample and a diluent to produce a diluted exhaust gas. The exhaust sampling system includes first and second dilution gas flow devices. The first and second dilution gas flow devices are fluidly connected to one another at a second junction. Any diluent provided by the first and second dilution gas flow devices intermingles with one another prior to reaching the mixer. A diluted sample flow meter is arranged downstream from the mixer for receiving the diluted exhaust gas. In one example, diluent flow from the first and second dilution gas flow devices intermingles before being introduced to the mixer. In another example, diluent flow from the first dilution gas flow device is leaked out of the second dilution gas flow device in a controlled manner to achieve a desired diluent flow into the mixer.
    Type: Application
    Filed: October 11, 2006
    Publication date: April 17, 2008
    Inventors: William Martin Silvis, Gerald Marek, Wolfgang Schindler