Abstract: A process for the feedstock recycling of thermoset materials treats the material with a partially hydrogenated aromatic hydrocarbon at a temperature of from 200 to 350° C. in the presence of an amine. In the case of epoxy resin materials an amine is not needed if processing is carried out at temperatures of from 300 to 350° C.

Abstract: Epoxy resin mixtures suitable for producing halogen-free flame-retardant composites by the injection process comprise the following components: (A) a phosphorus-free aliphatic and/or aromatic and/or heterocyclic epoxy resin; (B) an epoxide group-containing phosphorus compound; (C) a phosphorus-modified epoxy resin with an epoxide value of from 0.02 to 1 mol/100 g, obtained by reacting polyepoxy compounds having at least two epoxide groups per molecule with phosphinic anhydrides and/or phosphonic anhydrides or with phosphonic monoesters, followed by thermal elimination of alcohol; and (D) as hardener, at least one primary or secondary aliphatic polyamine with NH and/or NH2 groups.

Abstract: A polyamide, a copolyamide, or a polyamide blend is reacted with a monoepoxy-functional phosphorus compound at an elevated temperature to produce flame-retardant polyamides, where the amount of phosphorus compound is 5 wt % to 35 wt %, based on the total composition, i.e., the polyamide mixture.

Abstract: Flame-resistantly formulated, flowable, latently reactive, phenolically curable epoxy-resin moulding compounds for the encapsulation of electronic components containing the following components:an epoxy-resin component obtained from a solvent-free reaction resin mixture of polyepoxy resin and polyisocyanate resin having a molar ratio of the epoxy groups to the isocyanate groups of 1.1 to 4 at a reaction temperature of up to 220.degree. C. in the presence of a reaction accelerator in a concentration of 0.5 to 2.5% and using triphenylphosphine oxide in a concentration of 0.05 to 10%, relative in each case to the reaction resin mixture,a hardener component containing at least two phenolic hydroxyl groups per molecule,inorganic filler,and standard additives.

Abstract: Epoxy resin mixtures to produce prepregs and composites contain the following components:a phosphorus-modified epoxy resin with an epoxy value of 0.02 to 1 mol/100 g, made up of structural units derived from(a) polyepoxy compounds with at least two epoxy groups per molecule and(b) phosphinic acid anhydrides, phosphonic acid anhydrides or phosphonic acid half-esters;dicyandiamide and/or an aminobenzoic acid derivative as the hardener;an amino hardening accelerator.

Abstract: Epoxy resin mixtures for the production of prepregs and composites contain the following components:a phosphorus-modified epoxy resin with an epoxy value of 0.02 to 1 mol/100 g, made up of structural units derived from(a) polyepoxy compounds with at least two epoxy groups per molecule, and(b) phosphinic acid anhydrides, phosphonic acid anhydrides, or phosphonic acid half-esters;an amine-substituted aromatic sulfonic acid amide or hydrazide as a hardener;an amino hardening accelerator.

Abstract: Epoxy resin mixtures for prepregs and compositesEpoxy resin mixtures for preparing prepregs and composites contain the following components:a phosphorus-modified epoxy resin with an epoxy value of 0.02 to 1 mol/100 g, made up of structural units derived from(a) polyepoxy compounds with at least two epoxy groups per molecule and(b) phosphinic acid anhydrides, phosphonic acid anhydrides, or phosphonic acid half-esters;a glycidyl group-free compound with phenolic OH groups in the form of bisphenol-A, bisphenol-F, or a high-molecular phenoxy resin obtained through the condensation of bisphenol-A or bisphenol-F with epichlorohydrin;an aromatic polyamine used as a hardening agent.

Abstract: The present invention relates to phosphorus-modified epoxy resins having an epoxy number from 0 to 1 mol/100 g, comprising structural units which are derived from(A) polyepoxy compounds having at least two epoxy groups per molecule, and(B) phosphinic and/or phosphonic anhydrides.The invention further provides a process for preparing these phosphorus-modified epoxy resins and provides for the use of the resins in producing moldings, coatings or laminates.

Abstract: Epoxy resin mixtures for producing prepregs and composites that are available at low cost and can be processed well yield flame-retardant molding materials even without the addition of flame retardants, and these molding materials have a high glass transition temperature and also have an improved interlaminar adhesion and adhesion to copper when they contain the following components:a phosphorus-modified epoxy resin with an epoxy value of 0.02 to 1 mol/100 g, composed of structural units derived from(A) polyepoxy compounds with at least two epoxy groups per molecule and(B) at least one compound from the group consisting of phosphinic acids, phosphonic acids, pyrophosphonic acids and phosphonic acid half-esters, andan aromatic polyamine as the hardener.

Abstract: Epoxy resin mixtures for producing prepregs and composites that are available at low cost and can be processed well yield flame-retardant molding materials even without the addition of flame retardants, and these molding materials have a high glass transition temperature and also have an improved interlaminar adhesion and adhesion to copper when they contain the following components:a phosphorus-modified epoxy resin with an epoxy value of 0.02 to 1 mol/100 g, composed of structural units derived from(A) polyepoxy compounds with at least two epoxy groups per molecule and(B) phosphinic acid anhydrides and/or phosphonic acid anhydrides, andan aromatic polyamine as the hardener.

Abstract: Biochemical substances, such as enzymes, are immobilized using an olefinic-unsaturated, epoxyfunctional polysiloxane. The polysiloxane is applied to a carrier material. The polysiloxane on the carrier is cross-linked by using high-energy radiation or a peroxide to form a polymer matrix. The polymer matrix is treated with an aqueous solution of a biochemical substance that reacts with epoxy groups and becomes immobilized. The polymer matrix is stabilized by the reaction of non-reacted epoxy groups with a compound containing an amino group, a carboxyl group or an amino group and a carboxyl group. The crosslinked polysiloxane can be hydrophilized after cross-linking and prior to immobilization of the biochemical substance by the reaction of a portion of the epoxy groups with a hydrophilic compound.

Abstract: A biosensor is prepared having a selective detection system containing a biochemical substance such as an enzyme immobilized on an olefinic-unsaturated, epoxyfunctional polysiloxane. Prior to immobilization of the biochemical substance, the polysiloxane is applied as a layer to a carrier and cross-linked by treatment with high-energy radiation. A biochemical substance is reacted with epoxy groups of the cross-linked polysiloxane. Any non-reacted epoxy groups are reacted with a compound containing an amino group, a carboxyl group or an amino group and a carboxyl group to stabilize. After cross-linking and before reacting of the biochemical substance, the cross-linked polysiloxane can be hydrophilized by reacting some of the epoxy groups with a hydrophilic compound containing a reactive group.

Abstract: Biochemical substances such as enzymes are immobilized by reaction with epoxy groups of an olefinic-unsaturated, epoxyfunctional polyether. Prior to immobilization, the polyether is applied to a carrier and crosslinked by treatment with high-energy radiation or peroxide to form a layer. After reacting the biochemical substance with epoxy groups, non-reacted epoxy groups are reacted with a compound containing an amino group and/or a carboxyl group such as an amino acid. Before immobilizing of the biochemical substance and after crosslinking, the polyether may be hydrophilized by reacting some of the epoxy groups with a hydrophilic compound such as an amino acid.

Abstract: A biosensor is prepared having a selective detection system containing a biochemical substance such as an enzyme immobilized by reaction with epoxy groups of an olefinic-unsaturated, epoxyfunctional polyether. Prior to immobilization, the polyether is applied to a carrier and crosslinked by treatment with high-energy radiation or peroxide to form a layer. After reacting the biochemical substance with epoxy groups, non-reacted epoxy groups are reacted with a compound containing an amino group and/or a carboxyl group such as an amino acid. Before immobilizing of the biochemical substance and after crosslinking, the polyether may be hydrophilized by reacting some of the epoxy groups with a hydrophilic compound such as an amino acid.

Abstract: The invention provides epoxy resin compounds for manufacturing prepregs and composite materials, which can be obtained inexpensively and have good processibility, and provide--without having to add flameproofing agents--virtually inflammable molded materials with a high glass transition temperature. The epoxy resin compounds contain the following constituents:(A) an aromatic and/or heterocyclic polyepoxide resin that is free of phosphorous, optionally in a mixture with an aliphatic epoxy resin;(B) an epoxy-group-containing phosphorous compound and(C) an aromatic polyamine as a curing agent.

Abstract: The invention provides epoxide resin molding compositions for protectively covering semiconductor components, which are accessible in a cost-effective manner and have good processibility. The epoxide resin molding compositions provide virtually inflammable molded materials with a high glass transition temperature and a low thermal expansion coefficient without the addition of flameproofing agents, when they contain the following constituents:(A) an aromatic and/or heterocyclic polyepoxide resin which is free of phosphorous, optionally in combination with an aliphatic epoxide resin;(B) an epoxide-group-containing phosphorous compound;(c) an aromatic polyamine as a curing agent; and(D) filler material.

Abstract: Reaction resin mixtures which can be economically processed provide inflammable molded materials with excellent mechanical properties and high dimensional stability under heat when they contain the following constituents: (A) a phosphorus-free polyfunctional epoxide; (B) an epoxy-group-containing phosphorus compound; (C) a polyfunctional isocyanate; (D) a curing catalyst; and, if required, (E) filler material.

Abstract: A method for radical cross-linking or organic polymers, is disclosed which uses a cross-linking enhancer of the following formula ##STR1## wherein R is alkenyl or alkynyl;R.sup.1 is alkylene, alkenylene, alkynylene or --(R.sup.2 --O).sub.m --R.sup.2 --, R.sup.2 is CH.sub.2, (CH.sub.2).sub.2, (CH.sub.2).sub.3 or CH.sub.2 --CH(CH.sub.3), and m is 1 to 50; and n is 1 to 10.

Abstract: The invention relates to a method for the production of N,N'-bis-salicyloyl hydrazine by a catalytic reaction of salicylic-acid alkyl esters with hydrazine or salicylic-acid hydrazide and has the object to develop such a method in such a manner that not only an N,N'-bis-salicyloyl hydrazine with reduced eye irritation is obtained, but wherein the product is also produced with a high yield and purity. For this purpose, the invention provides that hydrazine or salicylic-acid hydrazide is heated with a 1-to-10 times excess of salicylic-acid alkyl ester in the presence of a halogenide, hydroxide or oxide of boron, aluminum or zinc to temperatures of up to 150.degree. C. The N,N'-bis-salicyloyl hydrazine prepared by the method according to the invention is suitable particularly as an additive to polymers for cable and wire insulation in power and communication engineering.

Abstract: Improved printed circuit boards of laminated thermosetting sheets with epoxy resin as the bonding agent contain for inhibiting copper migration 0.1% to 10% N,N'-bis-salicyloyl hydrazine, based on the weight of the hardened epoxy resin.