Patents by Inventor Woo Kyung Sung
Woo Kyung Sung has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 12112892Abstract: A multilayer electronic component includes a body including a dielectric layer and a first internal electrode and a second internal electrode and having first to sixth surfaces, a first external electrode including a first connection portion on the third surface, a first band portion on the first surface, and a third band portion on the second surface, a second external electrode including a second connection portion on the fourth surface, a second band portion on the first surface, and a fourth band portion on the second surface, an insulating layer disposed on the second surface and extending onto the first and second connection portions, a first plating layer disposed on the first band portion, and a second plating layer disposed on the second band portion. The insulating layer includes glass, and a region disposed on the second surface in the insulating layer has a convex shape in the first direction.Type: GrantFiled: September 13, 2022Date of Patent: October 8, 2024Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.Inventors: Hyung Jong Choi, Yoo Jeong Lee, Chung Yeol Lee, Kwang Yeun Won, So Jung An, Kang Ha Lee, Woo Kyung Sung, Myung Jun Park, Jong Ho Lee
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Publication number: 20240312718Abstract: A multilayer electronic component includes a body including a dielectric layer and an internal electrode alternately disposed with the dielectric layer; and an external electrode disposed on the body, wherein the external electrode includes an electrode layer connected to the internal electrode and including Cu, a first plating portion disposed on the electrode layer, and a second plating portion disposed on the first plating portion, and wherein the first plating portion includes a Ni layer in contact with the electrode layer, and an intermetallic compound layer disposed on the Ni layer and including an intermetallic compound including at least one of Ni and Sn.Type: ApplicationFiled: February 21, 2024Publication date: September 19, 2024Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.Inventors: So Jung AN, Hyung Jong CHOI, Jung Won PARK, Yoo Jeong LEE, Kwang Yeun WON, Woo Kyung SUNG, Byung Jun JEON, Chul Seung LEE
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Publication number: 20240222032Abstract: A multilayer electronic component may include: a body including a dielectric layer and internal electrodes; and external electrodes including an electrode layer disposed on the body and a plating layer disposed on the electrode layer, wherein the plating layer includes an extension extending onto the body to contact the body, and the extension includes one or more grains in which an angle between a surface of the body in contact with the extension and a major axis of the grain is 70 degrees or greater and 110 degrees or less.Type: ApplicationFiled: December 14, 2023Publication date: July 4, 2024Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.Inventors: So Jung An, Hyung Jong Choi, Jung Won Park, Yoo Jeong Lee, Kwang Yeun Won, Woo Kyung Sung, Byung Jun Jeon, Chul Seung Lee
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Publication number: 20240222030Abstract: A multilayer electronic component includes: a body including a dielectric layer and internal electrodes alternately positioned while having the dielectric layer interposed therebetween; and an external electrode positioned on the body. The external electrode includes an electrode layer connected to one or more of the internal electrodes and including copper (Cu), a first plating layer positioned on the electrode layer and including nickel (Ni), and a second plating layer positioned on the first plating layer and including nickel (Ni). An oxide including nickel (Ni) is positioned on a boundary surface between the first plating layer and the second plating layer. An average thickness of the first plating layer is smaller than an average thickness of the second plating layer.Type: ApplicationFiled: September 26, 2023Publication date: July 4, 2024Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.Inventors: Yoo Jeong LEE, Kwang Yeun WON, Hyung Jong CHOI, So Jung AN, Jung Won PARK, Woo Kyung SUNG, Byung Jun JEON, Chul Seung LEE
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Publication number: 20240203646Abstract: A multilayer electronic component according to an embodiment of the present disclosure includes a body including a dielectric layer and an internal electrode; and an external electrode disposed on the body. The external electrode includes a first electrode layer connected to the internal electrode and including Cu, a second electrode layer partially disposed on the first electrode layer and including Ni, an intermediate layer disposed on the second electrode layer and in a region of the first electrode layer, in which the second electrode layer is not disposed, and including a metal oxide, and a first plating layer disposed on the intermediate layer and including Ni.Type: ApplicationFiled: October 20, 2023Publication date: June 20, 2024Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.Inventors: Jung Won PARK, Hyung Jong CHOI, So Jung AN, Yoo Jeong LEE, Kwang Yeun WON, Woo Kyung SUNG, Byung Jun JEON, Chul Seung LEE
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Patent number: 11996240Abstract: An electronic component includes a microbody including a body including a plurality of dielectric layers and a plurality of internal electrodes disposed with a corresponding dielectric layer interposed therebetween, and an electrode layer disposed on an external side surface of the body and connected to a portion of the plurality of internal electrodes; and a sealing thin film. The microbody includes a microhole extending in at least a portion of the dielectric layer, the internal electrode, and the electrode layer through a surface of the microbody. The sealing thin film includes an internal sealing thin film disposed in at least a portion of an internal space of the open microhole to seal the microhole.Type: GrantFiled: October 7, 2021Date of Patent: May 28, 2024Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.Inventors: Kong Joo Jeon, So Jung An, Kwang Yeun Won, Woo Kyung Sung, Kyu Sik Park, Myung Jun Park
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Publication number: 20230411074Abstract: A multilayer electronic component includes a body including a plurality of dielectric layers and an internal electrode including a conductive material, and an external electrode disposed on the body and connected to the internal electrode. The internal electrode includes a Sn diffusion portion including Sn in a region connected to the external electrode, and a ratio of an average number of atoms of the Sn compared to an average number of atoms of the conductive material other than the Sn of the internal electrode included in the Sn diffusion portion is 3% or more and 50% or less.Type: ApplicationFiled: November 9, 2022Publication date: December 21, 2023Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.Inventors: Eui Hyun JO, Jin Soo PARK, Chul Seung LEE, Byung Jun JEON, Hyung Jong CHOI, Hyun Hee GU, Woo Kyung SUNG, Myung Jun PARK
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Patent number: 11842853Abstract: A multilayer electronic component according to an embodiment of the present disclosure includes: an electronic component body including a body having a dielectric layer and an internal electrode, and an external electrode disposed on the body; and a coating layer disposed on an external surface of the electronic component body, including one or more of silicon (Si) and fluorine (F), and having an average thickness of 5 nm or more and 15 nm or less.Type: GrantFiled: September 9, 2021Date of Patent: December 12, 2023Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.Inventors: Hyung Jong Choi, Yoo Jeong Lee, Kwan Young Son, Woo Kyung Sung, Kyu Sik Park, Myung Jun Park, Kwang Yeun Won
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Publication number: 20230260708Abstract: A multilayer electronic component includes a body including first and second surfaces opposing each other and third and fourth surfaces connected to the first and second surfaces and opposing each other, the body including dielectric layers and internal electrodes interposed between the dielectric layers, and an external electrode disposed on the body to be connected to the internal electrodes. The external electrode includes first and second plating layers respectively covering the third and fourth surfaces, a first electrode layer covering portions of the first and second surfaces and having one side surface in contact with one side surface of the first plating layer, a second electrode layer covering the portions of the first and second surfaces and having one side surface in contact with one side surface of the second plating layer, and third and fourth plating layers respectively covering the first and second plating layers.Type: ApplicationFiled: December 20, 2022Publication date: August 17, 2023Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.Inventors: So Jung AN, Yoo Jeong LEE, Hyung Jong CHOI, Chung Yeol LEE, Kwang Yeun WON, Woo Kyung SUNG, Myung Jun PARK, Jong Ho LEE
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Publication number: 20230260709Abstract: A multilayer electronic component includes a body including a plurality of internal electrodes and a dielectric layer interposed between the plurality of internal electrodes, and an external electrode including an electrode layer disposed on the body to be connected to the plurality of internal electrodes and a conductive resin layer disposed on the electrode layer. The electrode layer includes an island region.Type: ApplicationFiled: December 22, 2022Publication date: August 17, 2023Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.Inventors: Yoo Jeong Lee, Hyung Jong Choi, Chung Yeol Lee, Kwang Yeun Won, So Jung An, Woo Kyung Sung, Myung Jun Park, Jong Ho Lee
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Publication number: 20230238182Abstract: A multilayer electronic component includes a body including a dielectric layer and a first internal electrode and a second internal electrode and having first to sixth surfaces, a first external electrode including a first connection portion on the third surface, a first band portion on the first surface, and a third band portion on the second surface, a second external electrode including a second connection portion on the fourth surface, a second band portion on the first surface, and a fourth band portion on the second surface, an insulating layer disposed on the second surface and extending onto the first and second connection portions, a first plating layer disposed on the first band portion, and a second plating layer disposed on the second band portion. The insulating layer includes glass, and a region disposed on the second surface in the insulating layer has a convex shape in the first direction.Type: ApplicationFiled: September 13, 2022Publication date: July 27, 2023Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.Inventors: Hyung Jong CHOI, Yoo Jeong LEE, Chung Yeol LEE, Kwang Yeun WON, So Jung AN, Kang Ha LEE, Woo Kyung SUNG, Myung Jun PARK, Jong Ho LEE
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Publication number: 20230230770Abstract: A multilayer electronic component includes: a body having first and second surfaces opposing each other in a first direction, and third and fourth surfaces connected to first and second surfaces and opposing each other in a second direction; a first external electrode including a first connection portion disposed on the third surface, a first band portion extending from the first connection portion onto a portion of the first surface, and a third band portion extending from the first connection portion onto a portion of the second surface; a second external electrode including a second connection portion disposed on the fourth surface, and a second band portion extending from the second connection portion onto a portion of the first surface; an insulating layer including a silicone-based resin and disposed on the first and second connection portions.Type: ApplicationFiled: September 1, 2022Publication date: July 20, 2023Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.Inventors: So Jung AN, Hyung Jong CHOI, Yoo Jeong LEE, Chung Yeol LEE, Kwang Yeun WON, Woo Kyung SUNG, Myung Jun PARK, Jong Ho LEE
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Publication number: 20230230765Abstract: A multilayer electronic component includes a body including a dielectric layer and internal electrodes stacked in a first direction with the dielectric layer interposed therebetween and external electrodes including a first electrode layer connected to the internal electrodes and including Ni, and a second electrode layer disposed on the first electrode layer and including an Ni—Cu alloy. A Cu content of the second electrode layer is 70 mol to 90 mol compared to 100 mol of the total content of Ni and Cu of the second electrode layer.Type: ApplicationFiled: December 14, 2022Publication date: July 20, 2023Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.Inventors: Jin Soo PARK, Eui Hyun JO, Jun Hyeong KIM, Ha Jeong KIM, Hyun Hee GU, Woo Kyung SUNG, Myung Jun PARK, Byung Jun JEON, Chul Seung LEE
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Publication number: 20230223195Abstract: A multilayer electronic component includes: a body including a dielectric layer and internal electrodes alternately disposed while having the dielectric layer interposed therebetween; a first external electrode including a first connection portion and first and third band portions extending from ends of the first connection portion; a second external electrode including a second connection portion and second and fourth band portions extending from the second connection portion; an insulating layer disposed on the first and second connection portions and covering a top surface of the body and the third and fourth band portions; first and second plating layers disposed on the first and second band portions, respectively. An end of the plating layer and an end of the insulating layer contact with each other, and a thickness of the end of the plating layer and a thickness of the end of the insulating layer decreases toward the contact point.Type: ApplicationFiled: October 25, 2022Publication date: July 13, 2023Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.Inventors: Hyung Jong CHOI, Yoo Jeong LEE, Chung Yeol LEE, Kwang Yeun WON, So Jung AN, Kang Ha LEE, Woo Kyung SUNG, Myung Jun PARK, Jong Ho LEE
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Publication number: 20230215647Abstract: A multilayer electronic component includes: a body including dielectric layers and internal electrodes alternately disposed with respective dielectric layers interposed therebetween; a first external electrode including a first connection portion, and first and second band portions extending from the first connection portion; a second external electrode including a second connection portion, and second and fourth band portions extending from the second connection portion; an insulating layer disposed to extend to a portion on the first and second connection portions; a first plating layer disposed on the first band portion and disposed to extend to be in contact with the insulating layer; and a second plating layer disposed on the second band portion and disposed to extend to be in contact with the insulating layer. An average thickness of the first or second plating layer is smaller than an average thickness of the insulating layer.Type: ApplicationFiled: September 27, 2022Publication date: July 6, 2023Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.Inventors: Yoo Jeong Lee, Chung Yeol Lee, Hyung Jong Choi, Kwang Yeun Won, So Jung An, Kang Ha Lee, Woo Kyung Sung, Myung Jun Park, Jong Ho Lee
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Publication number: 20230215643Abstract: An electronic component includes a body including a dielectric layer and internal electrodes, and including first to sixth surfaces; a first external electrode including a first connection portion on the third surface and a first band portion on the first surface; a second external electrode including a second connection portion on the fourth surface and a second band portion on the first surface; an insulating layer on the second surface and the first and second connection portions; and a plating layer on the first and second band portions. The plating layer extends onto the first and second connection portions and is in contact with the insulating layer. A thickness of an end of the insulating layer decreases toward the plating layer. An end of the plating layer includes a first region between the insulating layer and the first or second connection portion and a second region covering the insulating layer.Type: ApplicationFiled: October 25, 2022Publication date: July 6, 2023Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.Inventors: Chung Yeol Lee, Yoo Jeong Lee, Hyung Jong Choi, Kwang Yeun Won, So Jung An, Woo Kyung Sung, Kang Ha Lee, Myung Jun Park, Jong Ho Lee, Jun Hyeong Kim
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Publication number: 20230215646Abstract: A multilayer electronic component includes: a body including dielectric layers and first and second internal electrodes and having first to sixth surfaces; a first external electrode including a first connection portion, disposed on the third surface, and a first band portion extending from the first connection portion onto a portion of the first surface; a second external electrode including a second connection portion, disposed on the fourth surface, and a second band portion extending from the second connection portion onto a portion of the first surface; an insulating layer disposed on the second surface and disposed to extend to the first and second connection portions; a first plating layer disposed on the first band portion; and a second plating layer disposed on the second band portion. The insulating layer includes a fluorine-based organic material.Type: ApplicationFiled: September 20, 2022Publication date: July 6, 2023Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.Inventors: Kwang Yeun WON, Jong Ho LEE, Yoo Jeong LEE, Hyung Jong CHOI, Chung Yeol LEE, So Jung AN, Woo Kyung SUNG, Myung Jun PARK
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Publication number: 20230187138Abstract: A ceramic electronic component, includes: a body including a dielectric layer and first and second internal electrodes, the body having first and second surfaces, third and fourth surfaces, and fifth and sixth surfaces; a first external electrode disposed on the first surface, and extending onto a portion of each of the third to sixth surfaces; a second external electrode disposed on the second surface, and extending onto a portion of each of the third to sixth surfaces, wherein, in at least one of cross-sections in first and second directions or in first and third directions, in at least one of the first and second external electrodes, a maximum thickness in a peripheral portion of the first and second surfaces is greater than a maximum thickness in a center portion, and a maximum thickness in a center portion is greater than a maximum thickness in a corner portion.Type: ApplicationFiled: October 20, 2022Publication date: June 15, 2023Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.Inventors: Jin Soo Park, Jong Ho Lee, Kang Ha Lee, Yoon A Park, Eui Hyun Jo, Myung Jun Park, Hyun Hee Gu, Woo Kyung Sung
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Publication number: 20220199331Abstract: An electronic component includes a microbody including a body including a plurality of dielectric layers and a plurality of internal electrodes disposed with a corresponding dielectric layer interposed therebetween, and an electrode layer disposed on an external side surface of the body and connected to a portion of the plurality of internal electrodes; and a sealing thin film. The microbody includes a microhole extending in at least a portion of the dielectric layer, the internal electrode, and the electrode layer through a surface of the microbody. The sealing thin film includes an internal sealing thin film disposed in at least a portion of an internal space of the open microhole to seal the microhole.Type: ApplicationFiled: October 7, 2021Publication date: June 23, 2022Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.Inventors: Kong Joo Jeon, So Jung An, Kwang Yeun Won, Woo Kyung Sung, Kyu Sik Park, Myung Jun Park
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Publication number: 20220199328Abstract: A multilayer electronic component according to an embodiment of the present disclosure includes: an electronic component body including a body having a dielectric layer and an internal electrode, and an external electrode disposed on the body; and a coating layer disposed on an external surface of the electronic component body, including one or more of silicon (Si) and fluorine (F), and having an average thickness of 5 nm or more and 15 nm or less.Type: ApplicationFiled: September 9, 2021Publication date: June 23, 2022Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.Inventors: Hyung Jong Choi, Yoo Jeong Lee, Kwan Young Son, Woo Kyung Sung, Kyu Sik Park, Myung Jun Park, Kwang Yeun Won