Patents by Inventor Woo Kyung Sung

Woo Kyung Sung has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20160307693
    Abstract: An electronic component includes a coil including lead terminals plated with a metal; a body part filling a space around the coil; and external electrodes connected to the lead terminals of the coil. At least portions of the lead terminals of the coil are exposed externally of the body part.
    Type: Application
    Filed: January 19, 2016
    Publication date: October 20, 2016
    Inventors: Tai Yon Cho, Doo Young Kim, Sang Ho Shin, Jun Ah, Woo Kyung Sung
  • Publication number: 20160055961
    Abstract: A wire wound inductor and a manufacturing method thereof. A wire wound inductor in accordance with an aspect of the present invention includes a magnetic core, a coil being wound and installed in the magnetic core, and a conductive resin layer being formed on each of both ends of the magnetic core for electrical connection with the coil. The conductive resin layer includes a head covering a surface of the end of the magnetic core and a band being extended from the head to a lateral surface of the end of the magnetic core, and the head is formed to be relatively thinner than the band.
    Type: Application
    Filed: April 15, 2015
    Publication date: February 25, 2016
    Inventors: Hyun-Hee GU, Woo-Kyung SUNG, Young-Sook LEE, Byoung-Jin CHUN, Hye-Jin JEONG, Myung-Jun PARK, Jae-Hwan HAN
  • Publication number: 20160042857
    Abstract: There are provided a chip electronic component including: a magnetic body including an insulating substrate and a conductive coil pattern which is disposed on at least one surface of the insulating substrate; and external electrodes disposed on both end portions of the magnetic body to be connected to end portions of the conductive coil pattern, wherein each of the external electrodes includes a first plating layer disposed on an end surface of the magnetic body to be connected to the conductive coil pattern and a conductive resin layer covering the first plating layer and extended to main surfaces of the magnetic body.
    Type: Application
    Filed: March 13, 2015
    Publication date: February 11, 2016
    Inventors: Byoung Jin CHUN, Woo Kyung SUNG, Hyun Hee GU, Young Sook LEE, Hye Jin JEONG, Jae Hwan HAN
  • Publication number: 20130258546
    Abstract: There are provided a multilayer ceramic electronic component and a fabrication method thereof. The multilayer ceramic component includes a ceramic main body in which internal electrodes and dielectric layers are alternately laminated; external electrodes formed on outer surfaces of the ceramic main body; intermediate layers formed on the external electrodes and including one or more selected from the group consisting of nickel, copper, and a nickel-copper alloy; and plating layers formed on the intermediate layers, whereby infiltration of a plating solution can be prevented.
    Type: Application
    Filed: March 14, 2013
    Publication date: October 3, 2013
    Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Chan Kong KIM, Jin Yung RYU, Jun AH, Yong Joon KO, Woo Kyung SUNG, Jong Rock LEE
  • Patent number: 8391207
    Abstract: A method and system for transmitting data from a base station to a mobile station in a wireless communication system using a multiple hop relay scheme is In a multi-hop system having a plurality of nodes, performing bidirectional data transmission between the nodes comprises: grouping the plurality of nodes into a first node group to a fourth node group, and assigning data transmission intervals to the grouped node groups at each frame, the data transmission intervals dividing each frame in time; receiving, by a second group node, data from an upper group node at a first frame and, at the same time, receiving, by a third group node, data from a lower group node; and transmitting by the second group node data to the upper group node at a second frame and, at the same time, transmitting by the third group node data to the lower group node.
    Type: Grant
    Filed: November 14, 2008
    Date of Patent: March 5, 2013
    Assignee: Samsung Electronics Co., Ltd.
    Inventors: Jeong Sik In, Sun Gi Kim, Hyo Hyun Choi, Ju Wook Jang, Woo Kyung Sung
  • Publication number: 20090122747
    Abstract: A method and system for transmitting data from a base station to a mobile station in a wireless communication system using a multiple hop relay scheme is In a multi-hop system having a plurality of nodes, performing bidirectional data transmission between the nodes comprises: grouping the plurality of nodes into a first node group to a fourth node group, and assigning data transmission intervals to the grouped node groups at each frame, the data transmission intervals dividing each frame in time; receiving, by a second group node, data from an upper group node at a first frame and, at the same time, receiving, by a third group node, data from a lower group node; and transmitting by the second group node data to the upper group node at a second frame and, at the same time, transmitting by the third group node data to the lower group node.
    Type: Application
    Filed: November 14, 2008
    Publication date: May 14, 2009
    Inventors: Jeong Sik IN, Sun Gi Kim, Hyo Hyun Choi, Ju Wook Jang, Woo Kyung Sung